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	Part Number	Hot Search : 016V1 G208I L622503 AFW10031 DE1E3K LMX35 42020 TDA8102B
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				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9K1208U0M K9K1208U0M-YCB0 K9K1208U0M-YIB0 K9K1216D0C
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	64M x 8 Bit / 32M x 16 Bit NAND Flash Memory 64M x 8 Bit NAND Flash Memory
File Size	351.33K / 26 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9K1G08U0B K9K1G08B0B K9K1G08R0B
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	128M x 8 Bit NAND Flash Memory
File Size	945.71K / 41 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9K1G08U0M-YCB0 K9K1G08U0M-YIB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	128M x 8 Bit NAND Flash Memory
File Size	465.75K / 37 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRF1104LPBF IRF1104SPBF
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications b...
Description	HEXFET Power MOSFET
File Size	260.38K / 10 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRF1104L IRF1104S
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications b...
Description	HEXFET Power MOSFET
File Size	147.91K / 10 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFZ48S IRFZ48L
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description	HEXFET? Power MOSFET
File Size	315.98K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	IEEE1394
OCR Text	... is a byte wide port capable of accommodating various MPEG2 and DV codecs. A byte wide host interface is provided for internal register configuration as well as performing asynchronous data transfers. The board supports standard 6 MHz VHF/ ...
Description	IEEE 1394/Device Bay ATSC DTV receiver
File Size	233.48K / 4 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF5210L IRF5210S
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications b...
Description	Power MOSFET(Vdss=-100V/ Rds(on)=0.06ohm/ Id=-40A) Power MOSFET(Vdss=-100V, Rds(on)=0.06ohm, Id=-40A)
File Size	182.97K / 10 Page	View it Online	Download Datasheet

For accommodating Found Datasheets File :: 724 Search Time::1.797ms
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