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  55487-1119 Datasheet PDF File

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    1511195010

Molex Electronics Ltd.
Part No. 1511195010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin
File Size 51.54K  /  2 Page

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Coilcraft Inc
Part No. CMT1-1.1-9L
Description Single Phase EMI Filter, ROHS COMPLIANT PACKAGE-4
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    2SB1119 2SD1619 2SB1119S

SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Part No. 2SB1119 2SD1619 2SB1119S
Description 5-Pin µP Supervisory Circuits with Watchdog and Manual Reset
LF Amp,Electronic Governor Applications
LF Amp/Electronic Governor Applications
File Size 85.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 10131931-119ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 19 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    1511195014

Molex Electronics Ltd.
Part No. 1511195014
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin
File Size 51.54K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-119-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    1511195018

Molex Electronics Ltd.
Part No. 1511195018
Description 2.00mm Pitch Milli-Gri Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin
File Size 51.54K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-196-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    1511193006

Molex Electronics Ltd.
Part No. 1511193006
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating
File Size 51.53K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-119-07LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 07 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    1511193010

Molex Electronics Ltd.
Part No. 1511193010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating
File Size 51.54K  /  2 Page

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Amphenol Communications Solutions
Part No. 10128481-119500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 2-Pair, 15 column, 19.5mm Plug Height, Press-Fit, Hermaphroditic.
Tech specs 　 　

Official Product Page

    1511193012

Molex Electronics Ltd.
Part No. 1511193012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating
File Size 51.54K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-119-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    1511194006

Molex Electronics Ltd.
Part No. 1511194006
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating
File Size 51.54K  /  2 Page

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    1511193020

Molex Electronics Ltd.
Part No. 1511193020
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin
File Size 51.54K  /  2 Page

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    1511195008

Molex Electronics Ltd.
Part No. 1511195008
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin
File Size 51.54K  /  2 Page

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