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Amphenol Communications Solutions |
Part No. |
75844-327-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
75844-329-72LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68004-432HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
92634-432HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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Tech specs |
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Official Product Page
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NEC Corp.
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Part No. |
UPD44321182GF-A50 UPD44321362GF-A50
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Description |
Film Capacitor; Voltage Rating:630VDC; Capacitor Dielectric Material:Polypropylene; Capacitance:22000pF; Capacitance Tolerance: /- 10%; Lead Pitch:15mm; Leaded Process Compatible:Yes; Series:171; Termination:Radial Leaded 32M-BIT ZEROSB SRAM PIPELINED OPERATIO
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File Size |
294.01K /
24 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com
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Price and Availability
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