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				MOTOROLA[Motorola, Inc]
Part No.	MMBTA55LT1 MMBTA56LT1
OCR Text	...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description	Driver Transistors
File Size	77.93K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBTA56LT1 ON2137
OCR Text	...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description	Driver Transistors(PNP Silicon) *Motorola Preferred Device From old datasheet system
File Size	56.02K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. ON Semi MOTOROLA[Motorola, Inc]
Part No.	MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text	...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description	MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA N-hannel Enhancement-ode Logic Level SOT23 From old datasheet system
File Size	87.87K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MSD42WT1 ON2379
OCR Text	...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description	From old datasheet system NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT
File Size	74.51K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] ONSEMI[ON Semiconductor]
Part No.	PZT2907AT1 PZT2907AT1_D ON2779 PZT2907A
OCR Text	...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description	SOT-223 PACKAGE PNP SILICON TRANSISTOR SURFACE MOUNT From old datasheet system
File Size	139.62K / 6 Page	View it Online	Download Datasheet

				LITTELFUSE[Littelfuse]
Part No.	V18MLE0603L V18MLE0402 MLE V18MLE1206 V18MLE0603 V18MLE0805 V18MLE0805L V18MLE0603LA V18MLE0402NH V18MLE0603LWH
OCR Text	...p is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minim...
Description	Surface mount varistor. Ag/Pd. Max continuous working voltage: 18VDC. 7 in diameter reel. Surface mount varistor. Ag/Pt. Max continuous working voltage: 18VDC. Bulk pack. Multilayer Transient Voltage Suppressor Surface mount varistor. Nickel barrier. Max continuous working voltage: 18VDC. 7in diameter reel.
File Size	151.48K / 7 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	BAS116LT1 ON0112
OCR Text	...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description	From old datasheet system Switching Diode
File Size	61.54K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS16LT1 ON0114
OCR Text	...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description	CASE 31808, STYLE 8 SOT23 (TO236AB) SILICON, SIGNAL DIODE, TO-236AB CASE 31808/ STYLE 8 SOT23 (TO236AB) From old datasheet system
File Size	77.42K / 4 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	BAS16TT1
OCR Text	...dering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will...
Description	Silicon Switching Diode
File Size	123.64K / 8 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	BAS16WT1 ON0115
OCR Text	...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description	CASE 419-02, STYLE 2 SC-70/SOT-323 From old datasheet system
File Size	96.40K / 6 Page	View it Online	Download Datasheet

For gradient Found Datasheets File :: 1376 Search Time::2.625ms
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