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For osp Found Datasheets File :: 383 Search Time::1.594ms
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				PROTEC[Protek Devices]
Part No.	LC0404FC36C LC0404FC LC0404FC05C LC0404FC08C LC0404FC12C LC0404FC15C LC0404FC3.3C LC0404FC24C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	LOW CAPACITANCE FLIP CHIP ARRAY
File Size	109.63K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	LC0406FC36C LC0406FC LC0406FC05C LC0406FC08C LC0406FC12C LC0406FC15C LC0406FC24C LC0406FC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	LOW CAPACITANCE FLIP CHIP ARRAY
File Size	113.55K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	LC0408FC36C LC0408FC LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	LOW CAPACITANCE FLIP CHIP ARRAY
File Size	116.58K / 6 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	NUF4105FCT1 NUF4105FC NUF4105
OCR Text	... 50/50 No Clean Type 3 or Finer osp Cu 150 mm Max Copper Solder Mask NSMD SMD Figure 6. Solder Mask versus Non-Solder Mask Definition Controlled Atmosphere 250 225C Min 235C Max 200 TEMPERATURE (C) 183 C 150 140 to 160 C 1...
Description	4 Channel EMI Pi-Filter Array with ESD Protection 4 ESD Diodes
File Size	82.64K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	P0402FC36C P0402FC05C P0402FC08C P0402FC12C P0402FC15C P0402FC24C P0402FC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	FLIP CHIP ARRAY
File Size	71.02K / 5 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	P0404FC36C P0404FC05C P0404FC12C P0404FC15C P0404FC24C P0404FC3.3C P0404FC08C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	PFLIP CHIP ARRAY
File Size	72.00K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	P0406FC36C P0406FC05C P0406FC08C P0406FC12C P0406FC15C P0406FC24C P0406FC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	PFLIP CHIP ARRAY
File Size	73.26K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	P0408FC36C P0408FC05C P0408FC08C P0408FC12C P0408FC15C P0408FC24C P0408FC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	PFLIP CHIP ARRAY
File Size	78.11K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	PKFC36C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC3.3C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	PACKAGED FLIP CHIP ARRAY
File Size	64.09K / 5 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	PRSB68C PRSB6.8C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	STANDARD TVS COMPONENTS
File Size	86.75K / 5 Page	View it Online	Download Datasheet

For osp Found Datasheets File :: 383 Search Time::1.594ms
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