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Molex Electronics Ltd.
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| Part No. |
15-80-0583 0015800583
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
M38510/05852BCA
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| Description |
CMOS quad bilateral switch 14-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0581 0015800581
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating
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| File Size |
1,218.24K /
7 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
JM38510/05852BCA
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| Description |
CMOS quad bilateral switch 14-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-433HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-435HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-430HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-431HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61127-0543LF
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| Description |
Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94937-0543LF
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| Description |
Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Price and Availability
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