osp pdf Datasheet P13 Full Text Search --- IC-ON-LINE

osp Datasheet PDF File

For osp Found Datasheets File :: 383 Search Time::1.437ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

				VTI[VTI technologies]
Part No.	SCA3000
OCR Text	...e pitch SMD soldering are NiAu, osp, Electroless-Ag and Electroless-Sn. 5.2 Solder Paste The SCA3000 package can be soldered with lead-free SAC (tin-silver-copper) solder. The SAC solder paste composition should be near eutectic. The...
Description	3-axis accelerometer
File Size	450.20K / 15 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	SFC05-4
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	FLIP CHIP ARRAY
File Size	126.18K / 6 Page	View it Online	Download Datasheet

				Littelfuse, Inc. LITTELFUSE[Littelfuse]
Part No.	SP0516BACT SP0504BACT SP0508BACT SP0504BAC
OCR Text	...2mm 0.360mm (sq) 50/50 No Clean osp (Entek Cu Plus 106A) 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder ...
Description	(SP0504BAC / SP0508BAC / SP0516BAC) Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package
File Size	152.54K / 3 Page	View it Online	Download Datasheet

				LITTELFUSE[Littelfuse]
Part No.	SP0516BBCT SP0504BBC SP0504BBCT SP0508BBC SP0508BBCT SP0516BBC
OCR Text	...2mm 0.360mm (sq) 50/50 No Clean osp (Entek Cu Plus 106A) 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder ...
Description	(SP0504BBC / SP0508BBC / SP0516BBC) SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package
File Size	167.33K / 3 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	U0402FC36C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC3.3C U0402FC33C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	76.18K / 5 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	U0404FC36C U0404FC05C U0404FC08C U0404FC12C U0404FC15C U0404FC24C U0404FC3.3C U0404FC33C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	98.88K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	U0406FC36C U0406FC05C U0406FC08C U0406FC12C U0406FC15C U0406FC24C U0406FC3.3C U0406FC33C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	102.32K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	U0408FC36C U0408FC05C U0408FC08C U0408FC12C U0408FC15C U0408FC24C U0408FC3.3C U0408FC33C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED FLIP CHIP ARRAY
File Size	105.62K / 6 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	ULC0402FC36C ULC0402FC05C ULC0402FC12C ULC0402FC15C ULC0402FC24C ULC0402FC3.3C ULC0402FC33C ULC0402FC08C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	96.36K / 5 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	ULC0404FC36C ULC0404FC05C ULC0404FC08C ULC0404FC12C ULC0404FC15C ULC0404FC24C ULC0404FC3.3C ULC0404FC33C
OCR Text	... 0.150mm 0.330mm Round No Clean osp(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activa...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	109.29K / 6 Page	View it Online	Download Datasheet

For osp Found Datasheets File :: 383 Search Time::1.437ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |