55447-0370 pdf Datasheet P14 Part Num --- IC-ON-LINE

Amphenol Communications Solutions

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Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board, CTW, Gold plating, AWG24<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)

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55447-0370 Datasheet PDF File

For 55447-0370 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037003-MF-12B
Description	37.00 x 37.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.86K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037020-MF-12S
Description	37.00 x 37.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.88K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037002-MF-12A
Description	37.00 x 37.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.91K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037012-MF-12K
Description	37.00 x 37.00 x 12.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.98K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037022-MF-12U
Description	37.00 x 37.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.93K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037002-PF-12A
Description	37.00 x 37.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
File Size	249.93K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037008-SF-12G
Description	37.00 x 37.00 x 8.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size	278.15K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037012-PF-12K
Description	37.00 x 37.00 x 12.00 mm BGA Heat SInk (High Aspect Ratio Ext.) Custom Pin Fin
File Size	250.02K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037022-PF-12U
Description	37.00 x 37.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
File Size	249.96K / 1 Page	View it Online	Download Datasheet

				Advanced Thermal Solutions, Inc.
Part No.	ATS037037020-SF-12S
Description	37.00 x 37.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size	278.08K / 1 Page	View it Online	Download Datasheet

For 55447-0370 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

Price & Availability of 55447-0370

Part #	Manufacturer	Description	Price	BuyNow Qty.
0554470370 0554470370	Molex	Conn Wire to Board HDR 3 POS 1.25mm Solder ST Thru-Hole Tray - Trays (Alt: 0554470370)		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
55447-0370	Molex	Conn Wire to Board HDR 3 POS 1.25mm Solder ST Thru-Hole Mini Mi II™ Tray	2500: USD0.133 1000: USD0.14 500: USD0.1717 250: USD0.2175 200: USD0.279 140: USD0.386	3000

Part #	Manufacturer	Description	Price	BuyNow Qty.
55447-0370 65759185	Molex	Conn Wire to Board HDR 3 POS 1.25mm Solder ST Thru-Hole Mini Mi II Tray	438: USD0.143	3000

Part #	Manufacturer	Description	Price	BuyNow Qty.
55447-0370 55447-0370	Molex	1.25mm Pitch Mi ll System Wire-to-Board Header, Single Row, Vertical, with Positive Lock, 3 Circuits	3000: USD5.239 5000: USD4.914	0

Part #	Manufacturer	Description	Price	BuyNow Qty.
55447-0370	Molex	Conn Wire to Board HDR 3 POS 1.25mm Solder ST Thru-Hole Mini Mi II™ Tray	2500: USD0.133 1000: USD0.14 500: USD0.1717 250: USD0.2175 200: USD0.279 140: USD0.386	3000