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aluminum Datasheet PDF File

For aluminum Found Datasheets File :: 15961 Search Time::1.938ms
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				Microsemi, Corp. MICROSEMI[Microsemi Corporation] N.A.
Part No.	LX8415-00 LX8415-00CST LX8415-25 LX8415-25CST LX8415-33 LX8415-33CST LX8415-XX LX8415-33CSTT
OCR Text	...onditions, connection of a 220F aluminum electrolytic capacitor or a 47F solid tantalum capacitor between the output terminal and ground will guarantee stable operation. If a bypass capacitor is connected between the output voltage adjust (...
Description	0.5 A LOW DROPOUT POSITIVE REGULATORS 0.5低压降的正调节器 THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS 3.3 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PDSO4 0.5 A LOW DROPOUT POSITIVE REGULATORS 2.5 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PSSO3 Low Drop Out Regulator - Positive Fixed Low Drop Out Regulator - Positive Adjustable
File Size	190.13K / 7 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX1546ETL
OCR Text	...licon nitride/ Silicon dioxide) aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bry...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.24K / 8 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc] ON Semi
Part No.	MMBT6517LT1 MMBT6517LT1_D ON2130
OCR Text	...o use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. 6 Motorola Small-Signal Tr...
Description	From old datasheet system Motorola Preferred Device High Voltage Transistor
File Size	229.86K / 8 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	MXP1126-C MSC1341
OCR Text	...hoto Transistor Chip Planar NPN aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy Electrical Characteristics @ 25oC SYMB OL BVCEO BVEBO BVCBO ID hFE CHARACT ERIST IC Collector-Emitter Voltag...
Description	Photoconductive Detectors Photo Transistor Chip From old datasheet system
File Size	36.04K / 1 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	MXP22-C
OCR Text	... Dielectrically Isolated Diodes aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy o Electrical Characteristic 25 s@ SYMBOL VOC ISC VB C CONDITIONS 10 mW/cm2, wavelength = 850 nm 10 mW/cm2, w...
Description	Multi Element Opto Arrays Monolithic Photodiode Array-Chip
File Size	37.65K / 1 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	MXP415-C MSC1342
OCR Text	...hoto Transistor Chip Planar NPN aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy Electrical Characteristics @ 25oC SYMB OL BVCEO BVEBO BVCBO VCESAT ID hFE CHARACT ERIST IC Collector-Emitter...
Description	Photo Transistor Chip From old datasheet system Photoconductive Detectors
File Size	36.58K / 1 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	PZT651T1 ON2780 PZT65
OCR Text	...o use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. 3 PZT651T1 SOLDER STENCIL...
Description	From old datasheet system HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT
File Size	101.17K / 6 Page	View it Online	Download Datasheet

For aluminum Found Datasheets File :: 15961 Search Time::1.938ms
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