|
|
|
WEDC[White Electronic Designs Corporation]
|
Part No. |
EDI2DL32256V EDI2DL32256V35BC EDI2DL32256V40BC EDI2DL32256V40BI EDI2DL32256V38BC EDI2DL32256V-BC
|
OCR Text |
...16 die mounted on a multi-layer laminate substrate. The device is packaged in a 119 lead, 14mm by 22mm, BGA. It is available with clock speeds of166, 150 and 133 MHz. The device is a Pipeline Burst SRAM, allowing the user to develop a fast ... |
Description |
TMS320C6202. TMS320C6203. TMS320C6204. TMS320C6 Families x32 Fast Synchronous SRAM 256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,4.0ns,256Kx32同步流水线脉冲静态RAM) 256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,3.5ns,256Kx32同步流水线脉冲静态RAM) 256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,3.8ns,256Kx32同步流水线脉冲静态RAM)
|
File Size |
94.58K /
8 Page |
View
it Online |
Download Datasheet |
|
|
|
Tyco Electronics
|
Part No. |
MRF16006
|
OCR Text |
...oard Material - Teflon(R) Glass laminate Dielectric Thickness - 0.30, r = 2.55, 2.0 oz. Copper B1 C1, C5 C2 C3 Fair Rite Bead on #24 Wire 100 pF, B Case, ATC Chip Cap 0.1 F, Dipped Mica Cap 0.1 F, Chip Cap C4 L1, L2 L3 R1 47 F, 50 V, Electr... |
Description |
RF POWER TRANSISTOR NPN SILICON
|
File Size |
139.23K /
5 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|