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  laminate Datasheet PDF File

For laminate Found Datasheets File :: 813    Search Time::1ms    
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    MRF16030

Tyco Electronics
Part No. MRF16030
OCR Text ...oard Material - Teflon(R) Glass laminate Dielectric Thickness = 0.30, r = 2.55, 2.0 oz. Copper B1 C1, C5 C2 C3 Fair Rite Bead on #24 Wire 100 pF, B Case, ATC Chip Cap 0.1 F, Dipped Mica Cap 0.1 F, Chip Cap C4 L1, L2 L3 R1 47 F, ...
Description RF POWER TRANSISTOR NPN SILICON

File Size 130.11K  /  5 Page

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    WEDPN16M64V-B100B2C WEDPN16M64V-B100B2I WEDPN16M64V-B100B2M WEDPN16M64V-100B2I WEDPN16M64V-125B2C WEDPN16M64V-125B2I WED

White Electronic Designs Corporation
Part No. WEDPN16M64V-B100B2C WEDPN16M64V-B100B2I WEDPN16M64V-B100B2M WEDPN16M64V-100B2I WEDPN16M64V-125B2C WEDPN16M64V-125B2I WEDPN16M64V-133B2C WEDPN16M64V-133B2M WEDPN16M64V-125B2M WEDPN16M64V-133B2I WEDPN16M64V-100B2C WEDPN16M64V-100B2M WEDPN16M64V-XB2X
OCR Text ...for hi-reliability applications laminate interposer for optimum TCE match Upgradeable to 32M x 64 density (W332M64V-XBX) * This product is subject to change without notice. Discrete Approach ACTUAL SIZE 21 WEDPN16M64V-XB2X 21 ...
Description 16MX64 SYNCHRONOUS DRAM

File Size 450.05K  /  15 Page

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    WEDPN16M72V-B100B2C WEDPN16M72V-133B2I WEDPN16M72V-XB2X WEDPN16M72V-100B2C WEDPN16M72V-125B2I WEDPN16M72V-125B2M WEDPN16

White Electronic Designs Corporation
Part No. WEDPN16M72V-B100B2C WEDPN16M72V-133B2I WEDPN16M72V-XB2X WEDPN16M72V-100B2C WEDPN16M72V-125B2I WEDPN16M72V-125B2M WEDPN16M72V-133B2C WEDPN16M72V-100B2M WEDPN16M72V-125B2C WEDPN16M72V-133B2M WEDPN16M72V-100B2I
OCR Text ...for hi-reliability applications laminate interposer for optimum TCE match Upgradeable to 32M x 72 density (contact factory for information) * This product is subject to change without notice. Discrete Approach 11.9 11.9 11.9 11.9 11.9 ...
Description 16MX72 SYNCHRONOUS DRAM

File Size 326.68K  /  14 Page

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    WEDPN16M72VR-B100B2I WEDPN16M72VR-100B2M WEDPN16M72VR-125B2I WEDPN16M72VR-125B2M WEDPN16M72VR-133B2C WEDPN16M72VR-100B2C

White Electronic Designs Corporation
Part No. WEDPN16M72VR-B100B2I WEDPN16M72VR-100B2M WEDPN16M72VR-125B2I WEDPN16M72VR-125B2M WEDPN16M72VR-133B2C WEDPN16M72VR-100B2C WEDPN16M72VR-133B2M WEDPN16M72VR-125B2C WEDPN16M72VR-XB2X WEDPN16M72VR-100B2I WEDPN16M72VR-133B2I
OCR Text ...for hi-reliability applications laminate interposer for optimum TCE match * This product is subject to change without notice. ** Available at commercial and industrial temperatures only. January 2005 Rev. 1 White Electronic Designs...
Description 16MX72 REGISTERED SYNCHRONOUS DRAM

File Size 296.23K  /  13 Page

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    WEDPN4M64V-B100BC WEDPN4M64V-B100BM WEDPN4M64V-100BC WEDPN4M64V-100BI WEDPN4M64V-100BM WEDPN4M64V-125BC WEDPN4M64V-125BI

White Electronic Designs Corporation
Part No. WEDPN4M64V-B100BC WEDPN4M64V-B100BM WEDPN4M64V-100BC WEDPN4M64V-100BI WEDPN4M64V-100BM WEDPN4M64V-125BC WEDPN4M64V-125BI WEDPN4M64V-125BM WEDPN4M64V-133BC WEDPN4M64V-133BI WEDPN4M64V-XBX WEDPN4M64V-133BM
OCR Text ...for lower parasitic capacitance laminate interposer for optimum TCE match Suitable for hi-reliability applications Upgradeable to 8M x 64 (contact factory for availability) *This product is subject to change without notice. Discrete A...
Description 4MX64 SYNCHRONOUS DRAM

File Size 259.25K  /  12 Page

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    WED3C7410E16M400BH9I WED3C7410E16M400BHI WED3C7410E16M400BHM WED3C7410E16M450BHI WED3C7410E16M-XBHX WED3C7410E16M450BH9C

White Electronic Designs Corporation
Part No. WED3C7410E16M400BH9I WED3C7410E16M400BHI WED3C7410E16M400BHM WED3C7410E16M450BHI WED3C7410E16M-XBHX WED3C7410E16M450BH9C WED3C7410E16M450BH9I WED3C7410E16M450BH9M WED3C7410E16M450BHC WED3C7410E16M450BHM WED3C7410E16M400BH9C WED3C7410E16M400BH9M WED3C7410E16M400BHC
OCR Text ...rposer for TCE compatibility to laminate substrates for increased Board level reliability Available with eutectic or high lead solder balls FIGURE 1 - MULTI-CHIP PACKAGE DIAGRAM AltiVecTM is a trademark of Motorola Inc. HiTCETM is a t...
Description 7410E RISC Microprocessor HiTCETM Multichip Package

File Size 394.01K  /  15 Page

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    LA7565E LA7565KM

Sanyo Semicon Device
Part No. LA7565E LA7565KM
OCR Text ... a 65 x 72 x 1.6 mm epoxy glass laminate printed circuit board. Operating Conditions at Ta = 25C Parameter Recommended supply voltage Operating supply voltage Symbol VCC VCC op Conditions Ratings 9 8.5 to 9.5 Unit V V No. 6100-2/18 ...
Description IF SIGNAL-PROCESSING IC FOR PAL/NTSC MULTI-SYSTEM AUDIO TV AND VCR PRODUCTS

File Size 195.41K  /  18 Page

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    CYM1441PZ-25C CYM1441PZ-45C CYM1441PZ-35C CYM1441 CYM1441PZ-20C

Cypress Semiconductor, Corp.
Part No. CYM1441PZ-25C CYM1441PZ-45C CYM1441PZ-35C CYM1441 CYM1441PZ-20C
OCR Text ... packages mounted onto an epoxy laminate substrate with pins. Two chip selects (CSL and CSU) are used to independently enable the upper and lower 4 bits of the data word. Writing to the memory module is accomplished when the chip select (CS...
Description 256K x 8 Static RAM Module 256K X 8 MULTI DEVICE SRAM MODULE, 20 ns, ZMA60
256K x 8 Static RAM Module 256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, ZMA60

File Size 96.92K  /  6 Page

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    CYM1464 CYM1464PD-22C CYM1464PD-30C CYM1464PD-45C CYM1464PD-55C CYM1464PD-20C CYM1464PD-25C CYM1464PD-35C

Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
Part No. CYM1464 CYM1464PD-22C CYM1464PD-30C CYM1464PD-45C CYM1464PD-55C CYM1464PD-20C CYM1464PD-25C CYM1464PD-35C
OCR Text ...OJ packages mounted on an epoxy laminate substrate with pins. Writing to the module is accomplished when the chip select (CS) and write enable (WE) inputs are both LOW. Data on the eight input/output pins (I/O0 through I/O7) of the device i...
Description 512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, DMA32
512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, DMA32
512Kx8 Static RAM Module 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, DMA32

File Size 91.39K  /  8 Page

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    CYM1831PM-15C CYM1831PM-20C CYM1831PM-35C CYM1831PN-20C CYM1831PN-35C CYM1831PY-15C CYM1831 CYM1831PM-25C CYM1831PM-45C

Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
Part No. CYM1831PM-15C CYM1831PM-20C CYM1831PM-35C CYM1831PN-20C CYM1831PN-35C CYM1831PY-15C CYM1831 CYM1831PM-25C CYM1831PM-45C CYM1831PN-15C CYM1831PN-25C CYM1831PN-45C CYM1831PZ-35C CYM1831PY-20C CYM1831PY-25C CYM1831PY-35C CYM1831PY-45C CYM1831PZ-15C CYM1831PZ-20C CYM1831PZ-25C CYM1831PZ-45C
OCR Text ...rint -- 1.2 sq. in. on an epoxy laminate board with pins. Four chip selects (CS1, CS2, CS3, and CS4) are used to independently enable the four bytes. Reading or writing can be executed on individual bytes or any combination of multiple byte...
Description 64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 15 ns, DMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PZMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PDMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PDMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PDMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PDMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 25 ns, DMA64
64K x 32 Static RAM Module 64K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PZMA64

File Size 141.29K  /  8 Page

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For laminate Found Datasheets File :: 813    Search Time::1ms    
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