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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQ3632
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| OCR Text |
...und. However, a small amount of pc board trace can be used as the inductor. Alternatively, if an extra component can be tolerated, a small value chip inductor could be used. See Figure 2.
VDD
Operation
MODE High Gain C2 0 1 High Gain L... |
| Description |
Low Current/ 3V pcS Band CDMA LNA IC
Low Current, 3V pcS Band CDMA LNA IC
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| File Size |
210.38K /
12 Page |
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it Online |
Download Datasheet
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Ecliptek, Corp.
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| Part No. |
APDS-9120-020
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| OCR Text |
...ions. in process zone p1 , the pc board and component pins are heated to a temperature of 150c to activate the ?ux in the solder paste. the temperature ramp up rate, r1, is limited to 3c per second to allow for even heating of both the ... |
| Description |
PROXIMITY SENSOR-PHOTOELECTRIC, 1.25-2.55V, SQUARE, SURFACE MOUNT
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| File Size |
216.89K /
16 Page |
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it Online |
Download Datasheet |
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Conexant
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| Part No. |
20463-12 11242-21 11242-31 11242-11
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| OCR Text |
...4.0, windows 2000 - microsoft pc 98 and pc 99 compliant v.80 synchronous access mode thin packages support low profile designs +3...mobile applications designers guide (doc. no. 100473, formerly identified as doc. no. 1221) and the ... |
| Description |
Smart HSF mobile modem
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| File Size |
265.44K /
22 Page |
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it Online |
Download Datasheet |
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Price and Availability
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