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Amphenol Communications Solutions |
Part No. |
54112-408081150LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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HYNIX[Hynix Semiconductor] Hynix Semiconductor Inc. Hynix Semiconductor, Inc. Analog Devices, Inc. Panasonic Industrial Solutions
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Part No. |
HY62VT08081E-DGC HY62VT08081E-DGE HY62VT08081E-DGI HY62VT08081E-DPC HY62VT08081E-DPE HY62VT08081E-DPI HY62VT08081E-DTC HY62VT08081E-DTE HY62VT08081E-DTI HY62UT0808 HY62KT08081E-DTI HY62KT08081E HY62KT08081E-DGC HY62KT08081E-DGE HY62KT08081E-DGI HY62KT08081E-DPC HY62KT08081E-DPE HY62KT08081E-DPI HY62KT08081E-DTC HY62KT08081E-DTE HY62UT08081E-DGC HY62UT08081E-DGE HY62UT08081E-DGI HY62UT08081E-DPC HY62UT08081E-DPE HY62UT08081E-DPI HY62UT08081E-DTC HY62UT08081E-DTE HY62UT08081E-DTI HY62KT08081E-DT70E HY62KT08081E-DT10E HY62KT08081E-DT10C HY62KT08081E-DT70C HY62KT08081E-DT10I HY62KT08081E-DP10I HY62KT08081E-DP10E HY62KT08081E-DG70C HY62KT08081E-DG70E HY62KT08081E-DG10E HY62KT08081E-DG10C HY62KT08081E-DP10C HY62KT08081E-DG10I HY62VT08081E-DG10E HY62VT08081E-DP10E HY62KT08081E-DG70I HY62UT08081E-DT10I HY62UT08081E-DT10C HY62VT08081E-DT10E HY62VT08081E-DT10I HY62VT08081E-DT10C HY62VT08081E-DT85C HY62KT08081E-DT85C HY62UT08081E-DT85C HY62UT08081E-DG10I HY62UT08081E-DP10I HY62UT08081E-DP10C HY62UT08081E-DG10C HY62UT08081E-DT70I HY62UT08081E-DP70C HY62UT08081E-DT85I HY62UT08081E-DT70C HY62VT08081E-DT70I HY62VT08081E-DP85C HY62KT08081E-DG85I HY62UT08081E
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Description |
Low Power Slow SRAM - 256Kb SWITCH, REED SPST-NO 10W SMD QSW-REED,10MM,10W,SMD 9 POS FR-4 SIP SOCKET x8|3V|70/85/100|Low Power Slow SRAM - 256K x8|3.3V|70/85/100|Low Power Slow SRAM - 256K 32Kx8bit CMOS SRAM 32Kx8bit CMOS SRAM x8 SRAM x8的SRAM x8 SRAM 32K X 8 STANDARD SRAM, 100 ns, PDSO28 x8 SRAM 32K X 8 STANDARD SRAM, 70 ns, PDSO28 x8 SRAM 32K X 8 STANDARD SRAM, 100 ns, PDIP28
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File Size |
190.56K /
12 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54112-108081200LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-108081650LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-108081300LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 08055A101JAT2A |
Maker: |
Pack: |
Stock: Reserved |
Unit price
for : |
50: $0.01 |
100: $0.01 |
1000:
$0.01 |
Email: oulindz@gmail.com |
Contact us |
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