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  70543-0058 Datasheet PDF File

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    70543-0018

Molex Electronics Ltd.
Part No. 70543-0018
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 19Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.19K  /  4 Page

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Texas Instruments

Part No. M38510/05852BCA
Description CMOS quad bilateral switch 14-CDIP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70543-0017

Molex Electronics Ltd.
Part No. 70543-0017
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Texas Instruments

Part No. JM38510/05852BCA
Description CMOS quad bilateral switch 14-CDIP -55 to 125
Tech specs    

Official Product Page

    70543-0010

Molex Electronics Ltd.
Part No. 70543-0010
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0014

Molex Electronics Ltd.
Part No. 70543-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0038

Molex Electronics Ltd.
Part No. 70543-0038
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, Tin (Sn) Plating

File Size 418.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0039

Molex Electronics Ltd.
Part No. 70543-0039
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 5Circuits, Tin (Sn) Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SDA-70543-0011

Molex Electronics Ltd.
Part No. SDA-70543-0011
Description 2.54mm (.100) Pitch SL Header

File Size 418.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SDA-70543-0019

Molex Electronics Ltd.
Part No. SDA-70543-0019
Description 2.54mm (.100) Pitch SL Header

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    Molex
Part No. 70543-0004 70543-0XXX
Description (70543 Series) Header

File Size 77.40K  /  1 Page

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Amphenol Communications Solutions

Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs    

Official Product Page

    90-0058

Maxim Integrated Products
Part No. 90-0058
Description PACKAGE LAND PATTERN, (T633-2 / T633 2)

File Size 15.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 70543-0058 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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