81024 pdf Datasheet P3 Part Num --- IC-ON-LINE


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81024 Datasheet PDF File

For 81024 Found Datasheets File :: 38+ Page :: | 1 | 2 | <3> | 4 |

					HYNIX[Hynix Semiconductor]
Part No.	GMS81008 GMS81016 GMS81024 GMS81032 GMS81004
Description	8-BIT SINGLE CHIP MICROCOMPUTERS
File Size	555.15K / 101 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-102-40LF
Description	BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Mosel Vitelic Corp
Part No.	V62C5181024L-45WI V62C5181024L-55WI V62C5181024LL-45WI
Description	128K x 8 CMOS static RAM, 45ns, low power 128K x 8 CMOS static RAM, 55ns, low power 128K x 8 CMOS static RAM, 45ns, low low power
File Size	591.12K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-102-46LF
Description	BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs				Official Product Page

					Visual Communications Company, Inc. RECOM Electronic GmbH
Part No.	8102401XA 8102403VA 8102408VA 8102401VA
Description	x1 SRAM x1的SRAM
File Size	900.30K / 27 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	65781-024LF
Description	Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,48 Positions
Tech specs				Official Product Page

					MOSEL-VITELIC Mosel Vitelic, Corp. MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp MOSEL[Mosel Vitelic Corp]
Part No.	V62C5181024 V62C5181024L-35P V62C5181024L-35PI V62C5181024L-35T V62C5181024L-35TI V62C5181024L-35W V62C5181024L-35WI V62C5181024L-70P V62C5181024L-70PI V62C5181024L-70T V62C5181024L-70TI V62C5181024L-70W V62C5181024L-70WI V62C5181024LL-35PI V62C5181024LL-35T V62C5181024LL-35TI V62C5181024LL-35W V62C5181024LL-35WI V62C5181024LL-70PI V62C5181024LL-70T V62C5181024LL-70TI V62C5181024LL-70W V62C5181024LL-70WI V62C5181024LL-70P V62C5181024LL-35P
Description	128K X 8 STANDARD SRAM, 70 ns, PDIP32 128K x 8 Static RAM 128K的8静态RAM ER 14C 14#16 PIN RECP BOX
File Size	59.69K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-810241600LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Intersil, Corp. IntersilCorporation INTERSIL[Intersil Corporation]
Part No.	HM3-6514-9 HM3-6514B-9 HM3-6514S-9 8102402VA 8102404VA 8102406VA HM-6514 HM1-6514B-9 FN2995 HM1-6514-9 HM1-6514S-9 HM4-6514-B 24502BVA
Description	1024 x 4 CMOS RAM 1K X 4 STANDARD SRAM, 120 ns, CDIP18 GE KIT: CAT5 VGA VIDEO 2CSPLITTER & REMOTE 1K X 4 STANDARD SRAM, 200 ns, CDIP18 RES THICK FILM 10M OHM 5.0W 5% SEMTRON WALLPHONE PLATE 1024x4CMOSRAM From old datasheet system
File Size	40.43K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-810241800LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Hynix Semiconductor Inc. Hynix Semiconductor, Inc.
Part No.	HMS81004E HMS81016E HMS81020TL HMS81024E HMS81032E HMS81032TL
Description	HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS Hynix半导体公司的8位单芯片微控制器
File Size	669.00K / 77 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-102-42LF
Description	BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4S643232C-TC/L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC10 K4S643232C-TC70 K4S643232C-TC55 K4S643232C-TC80 K4S643232C-TC60 K4S643232C-TL60 K4S643232C-TL70 V62C5181024LL-70P K4S643232C-TL10
Description	ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70% Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC 200万32内存12k × 32 × 4银行同步DRAM LVTTL Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 8-CDIP -55 to 125 200万32内存12k × 32 × 4银行同步DRAM LVTTL ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70% Replaced by TLC2201A : Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-PDIP -40 to 85 Replaced by TLC2201A : Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-SOIC -40 to 85 Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 20-LCCC -55 to 125 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL
File Size	1,165.47K / 43 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-102-44LF
Description	BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs				Official Product Page

					HYNIX[Hynix Semiconductor]
Part No.	HMS81024E HMS81008E HMS81032E HMS81032TL HMS81004E HMS81016E HMS81020TL
Description	HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS
File Size	651.98K / 77 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-810242200LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4S643232C-TL55 K4S643232C-TL70 K4S643232C-TC70 V62C5181024LL-70P K4S643232C K4S643232C-TC10 K4S643232C-TC55 K4S643232C-TC60 K4S643232C-TC80 K4S643232C-TL10 K4S643232C-TL60 K4S643232C-TL80 K4S643232C-TC_L10 K4S643232C-TC_L55 K4S643232C-TC_L60 K4S643232C-TC_L70 K4S643232C-TC_L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC/L80
Description	2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL
File Size	1,151.85K / 43 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	65781-024
Description	Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,48 Positions
Tech specs				Official Product Page

					KEMET Corporation
Part No.	EDI8F81024LP100BSC EDI8F81024C85BSC
Description	Dual Channel, High Speed, High Current Line Driver with 3-State; Temperature Range: -40°C to 85°C; Package: 8-SOIC Dual Channel, High Speed, High Current Line Driver with 3-State; Temperature Range: -40°C to 85°C; Package: 8-PDIP x8的SRAM模块
File Size	127.10K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-102-48LF
Description	BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs				Official Product Page

For 81024 Found Datasheets File :: 38+ Page :: | 1 | 2 | <3> | 4 |

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Part: 81001813-1

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