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  bell 202 v 23 modem Datasheet PDF File

For bell 202 v 23 modem Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP 73K222AL-LP

TDK Electronics
ETC
TDK Semiconductor
Part No. 73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP 73K222AL-LP
Description v.22, v.21, bell 212A, 103 Single-Chip modem

File Size 159.85K  /  28 Page

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    73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP

ETC
TDK Corporation
Part No. 73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP
Description v.22/ v.21/ bell 212A/ 103 Single-Chip modem
v.22, v.21, bell 212A, 103 Single-Chip modem

File Size 166.05K  /  28 Page

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    FX614

CML Microcircuits
Part No. FX614
Description CML Semiconductor Products bell 202 Compatible modem

File Size 331.01K  /  17 Page

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    73K302L 73K302L-IH 73K302L-IP

TDK Semiconductor
TDK Electronics
Part No. 73K302L 73K302L-IH 73K302L-IP
Description bell 212A, 103, 202 Single-Chip modem

File Size 279.57K  /  29 Page

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    73K324L-IGT 73K324L-IP 73K324L-28IH 73K324L

TDK Semiconductor
ETC[ETC]
Part No. 73K324L-IGT 73K324L-IP 73K324L-28IH 73K324L
Description CCITT v.22bis, v.22, v.21, v.23, bell 212A Single-Chip modem

File Size 182.79K  /  31 Page

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    73K224BL 73K224BL-IGT 73K224BL-IH

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Electronic Theatre Controls, Inc.
TDK Semiconductor
ETC
Part No. 73K224BL 73K224BL-IGT 73K224BL-IH
Description v.22bis/v.22/v.21/bell 212A/103 Single-Chip modem w/ Integrated Hybrid

File Size 232.81K  /  33 Page

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    73K324BL-IH 73K324BL-IGT 73K324BL

List of Unclassifed Manufacturers
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TDK Semiconductor
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. 73K324BL-IH 73K324BL-IGT 73K324BL
Description 22bis/v.22/v.21/v.23 bell 212A Single-Chip modem w/Integrated Hybrid
CONN, SHROUDED HDR, 34PIN, MALE, 0.100
Four Wall Header; No. of Contacts:34; Pitch Spacing:0.1"; No. of Rows:2; Gender:Header; Body Material:Glass-filled Polyester; Contact Plating:Nickel; Leaded Process Compatible:No; Mounting Type:Through Hole RoHS Compliant: No 单芯片调制解调器瓦特/集成混合

File Size 306.52K  /  34 Page

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    MX-COM Inc
Part No. MX919LH MX919J NBSPMX919JNBSP
Description modem CIRCUIT,modem,CMOS,LDCC,24PIN,PLASTIC
modem CIRCUIT,modem,CMOS,DIP,24PIN,CERAMIC
From old datasheet system

File Size 2,271.14K  /  37 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. S1T2410B01 S1T2410B02 DS_S1T2410B01 S1T2410B02-D0B0 S1T2410B01-D0B0 DSS1T2410B02 DSS1T2410B01
Description From old datasheet system
bipolar integrated circuit designed as a telephone bell replacement
Low drain current,Adjustable 2-frequency tone,Built-in hysteresis
bipolar integrated circuit designed as telephone bell replacement

File Size 168.67K  /  8 Page

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    H66T19AA H66T19BA H66T32BA H66T68AA H66T68 H66T68BA H66T19 H66T32 H66T32AA H66T66BA

MICRO-ELECTRONICS[Micro Electronics]
HSMC
Hi-Sincerity Mocroelectronics
Hi-Sincerity Microelectronics
Part No. H66T19AA H66T19BA H66T32BA H66T68AA H66T68 H66T68BA H66T19 H66T32 H66T32AA H66T66BA
Description 64-Note ROM memory Dynamic speaker can be driven with external NPN transistor
CMOS LSI DESIGNED FOR USE IN DOOR bell/ TELEPHONE AND TOY
CMOS LSI DESIGNED FOR USE IN DOOR bell, TELEPHONE AND TOY

File Size 32.67K  /  4 Page

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