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  conductivity Datasheet PDF File

For conductivity Found Datasheets File :: 4534    Search Time::2.922ms    
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    Agilent(Hewlett-Packard...
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Avago Technologies, Ltd.
Part No. HMPP-389X HMPP-3890-BLK HMPP-3890-TR1 HMPP-3890-TR2 HMPP-3892-BLK HMPP-3892-TR1 HMPP-3892-TR2 HMPP-3895-BLK HMPP-3895-TR1 HMPP-3895-TR2 HMPP-389T-BLK HMPP-389T-TR1 HMPP-389T-TR2 DEMO-HMPP-38X0 DEMO-HMPP-389T HMPP-389T
OCR Text ...(0.0028 inch2) * Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging tech...
Description HMPP-389T · MiniPak PIN switch diode
HMPP-3895 · MiniPak PIN switch diode
HMPP-3892 · MiniPak PIN switch diode
HMPP-3890 · MiniPak PIN switch diode
DEMO-HMPP-389T · Demonstration circuit board for HMPP-389T
DEMO-HMPP-38X0 · Demonstration circuit board for the HMPP-3860 and HMPP-3890
MiniPak Surface Mount RF PIN Switch Diodes MiniPak表面贴装射频PIN开关二极管
MiniPak PIN switch diode MiniPak PIN开关二极管

File Size 152.35K  /  11 Page

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    HMPP-3860 HMPP-3862 HMPP-3865 HMPP-386X

Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
Part No. HMPP-3860 HMPP-3862 HMPP-3865 HMPP-386X
OCR Text ...(0.0028 inch2) * Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging tech...
Description HMPP-3865 · Low cost general purpose PIN diode
HMPP-3862 · Low cost general purpose PIN diode
HMPP-3860 · Low cost general purpose PIN diode
MiniPak Surface Mount RF PIN Diodes

File Size 115.40K  /  8 Page

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    ONSEMI[ON Semiconductor]
Part No. MR2510 MR2502 MR2504 MR2500-D
OCR Text ... Low Cost; relatively low heat conductivity High Cost; high heat conductivity Medium Cost; medium heat conductivity Relatively expensive to plate and not all platers can process aluminum. Handling of the button during assembly must be rela...
Description 25A 1000V Silicon Rectifier
Medium-Current Silicon Rectifiers

File Size 91.78K  /  8 Page

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    ONSEMI[ON Semiconductor]
Part No. TRA2532 TRA2532-D
OCR Text ... Low Cost: relatively low heat conductivity High Cost: high heat conductivity Medium Cost: medium heat conductivity. Relatively expensive to plate and not all platers can process aluminum. Handling of the button during assembly must be ...
Description Overvoltage Transient Suppressor

File Size 61.83K  /  8 Page

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    ONSEMI[ON Semiconductor]
Part No. TRA3225 TRA3225-D TRA3225/D
OCR Text ... Low Cost: relatively low heat conductivity High Cost: high heat conductivity Medium Cost: medium heat conductivity. Relatively expensive to plate and not all platers can process aluminum. Handling of the button during assembly must be ...
Description Medium-Current Silicon Rectifier 中等电流硅整
Medium - Current Silicon Rectifier

File Size 71.20K  /  8 Page

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    PS21962-4S PS21962-4S09

Mitsubishi Electric Semiconductor
Part No. PS21962-4S PS21962-4S09
OCR Text ...te 3 : Grease with good thermal conductivity should be applied evenly with about +100m~+200m on the contacting surface of DIP-IPM and heat-sink. The contacting thermal resistance between DIP-IPM case and heat sink (Rth(c-f)) is determined b...
Description Dual-In-Line Package Intelligent Power Module
600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion

File Size 127.03K  /  8 Page

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    NCP1129

ON Semiconductor
Part No. NCP1129
OCR Text ...printed circuit copper clad low conductivity (note 6) high conductivity (note 7) r ja 128 78 c/w esd capability (note 8) human body model esd capability per jedec jesd22?a114f. machine model esd capability per jedec jesd22?a115c. charged...
Description High Voltage Switching Regulator for Offline SMPS

File Size 191.28K  /  18 Page

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    PS21962-A PS21962-C

Mitsubishi Electric Semiconductor
Part No. PS21962-A PS21962-C
OCR Text ...te 3 : Grease with good thermal conductivity should be applied evenly with about +100m~+200m on the contacting surface of DIP-IPM and heat-sink. The contacting thermal resistance between DIP-IPM case and heat sink (Rth(c-f)) is determined b...
Description 600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion

File Size 127.72K  /  10 Page

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    PS21962-ST

Mitsubishi Electric Semiconductor
Part No. PS21962-ST
OCR Text ...te 3 : Grease with good thermal conductivity should be applied evenly with about +100m~+200m on the contacting surface of DIP-IPM and heat-sink. The contacting thermal resistance between DIP-IPM case and heat sink (Rth(c-f)) is determined b...
Description 600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion

File Size 131.03K  /  8 Page

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    PS21962-S

Mitsubishi Electric Semiconductor
Part No. PS21962-S
OCR Text ...te 3 : Grease with good thermal conductivity should be applied evenly with about +100m~+200m on the contacting surface of DIP-IPM and heat-sink. The contacting thermal resistance between DIP-IPM case and heat sink (Rth(c-f)) is determined b...
Description 600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion

File Size 88.77K  /  8 Page

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For conductivity Found Datasheets File :: 4534    Search Time::2.922ms    
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