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  heat Datasheet PDF File

For heat Found Datasheets File :: 62769    Search Time::2.656ms    
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    KPIR5020 KPIR5040 KPIR5060 KPIR5080 FPIR3210 FPIR32100 MPIR4005 MPIR4010 MPIR40100 MPIR4020 MPIR4040 MPIR4060 MPIR4080 F

Electronic devices inc.
Part No. KPIR5020 KPIR5040 KPIR5060 KPIR5080 FPIR3210 FPIR32100 MPIR4005 MPIR4010 MPIR40100 MPIR4020 MPIR4040 MPIR4060 MPIR4080 FPIR3205 FPIR3220 FPIR3240 FPIR3260 FPIR3280 FPIR32 KPIR5010 KPIR5005 KPIR50100
OCR Text heat SINKS PROVIDE VERY LOW THERMAL RESISTANCE This mark indicates recognition under the component program of Underwriters Laboratories, inc. Our unique case construction enables the closer molding of integrated heat sink to the activ...
Description FAST RECOVERY, 32, 40 and 50 AMPERES

File Size 57.88K  /  2 Page

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    SI4466DY-T1-GE3

Vishay Siliconix
Part No. SI4466DY-T1-GE3
OCR Text ...n been modified to provide the heat transfer capabilities required by power devices. leadframe materials and design, molding compounds, and die attach materials have been changed, while the footpr int of the packages remains the same. see...
Description TRANSISTOR 9.5 A, 20 V, 0.009 ohm, N-CHANNEL, Si, POWER, MOSFET, HALOGEN FREE AND ROHS COMPLIANT, SOP-8, FET General Purpose Power

File Size 227.69K  /  8 Page

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    LA42031

Sanyo Semicon Device
Part No. LA42031
OCR Text ...Tstg No signal Infinitely large heat sink Conditions Ratings 16 15 150 3 -25 to +75 -40 to +150 Unit V W C C/W C C Operating Conditions at Ta = 25C Parameter Recommended supply voltage Recommended load resistance Allowable operating sup...
Description Monolithic Linear IC Audio Output for TV application 5W Monaural Power Amplifier

File Size 72.93K  /  7 Page

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    SI4464DY-T1

Vishay Siliconix
Part No. SI4464DY-T1
OCR Text ...n been modified to provide the heat transfer capabilities required by power devices. leadframe materials and design, molding compounds, and die attach materials have been changed, while the footpr int of the packages remains the same. see...
Description Trans MOSFET N-CH 200V 1.7A 8-Pin SOIC N T/R

File Size 231.71K  /  9 Page

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    SI4462DY-E3

Vishay Siliconix
Part No. SI4462DY-E3
OCR Text ...n been modified to provide the heat transfer capabilities required by power devices. leadframe materials and design, molding compounds, and die attach materials have been changed, while the footpr int of the packages remains the same. see...
Description Trans MOSFET N-CH 200V 1.15A 8-Pin SOIC N

File Size 621.86K  /  9 Page

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    LA42032

Sanyo Semicon Device
Part No. LA42032
OCR Text ...x jc Topr Tstg Infinitely large heat sink Conditions Ratings 16 15 150 3 -25 to +75 -40 to +150 Unit V W C C/W C C Operating Conditions at Ta = 25C Parameter Recommended supply voltage Recommended load resistance Allowable operating sup...
Description Monolithic Linear IC Audio Output for TV application 5W × 2ch Power Amplifier
Monolithic Linear IC Audio Output for TV application 5W 】 2ch Power Amplifier

File Size 77.04K  /  7 Page

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    NSSL088A

NICHIA CORPORATION
Part No. NSSL088A
OCR Text ...ls | weight description ????` heat-resistant polymer ?`? ( w? silicone resin(with phosphor) ~? + y? ag-plated copper alloy 0.010g(typ) nichia sts-da1-2410a <cat.no.130826> 5 soldering ? recommended reflow soldering condition(lea...
Description SPECIFICATIONS FOR WARM WHITE LED

File Size 290.81K  /  17 Page

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    LA5771

Sanyo Semicon Device
Part No. LA5771
OCR Text ...torage temperature Topr Tstg No heat sink Infinite heat sink Conditions Ratings 34 3 -1 1.75 7.5 -30 to +125 -40 to +150 Unit V A V W W C C Recommended Operating Conditions at Ta = 25C Parameter Input voltage range VIN Symbol Conditions...
Description Monolithic Linear IC Separately-excited Step-down Switching Regulator (3.3V)

File Size 63.83K  /  5 Page

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    NNSW208C

NICHIA CORPORATION
Part No. NNSW208C
OCR Text ...ls | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.0041g(typ) 2.4 0.5 0.45 1 0.66 0.27 0.7 0.38 (0.07) (0.63) cathode anode (2.6) 2.8 0.8 (0.59) (2....
Description SPECIFICATIONS FOR WHITE LED

File Size 288.76K  /  18 Page

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    NFSA172

NICHIA CORPORATION
Part No. NFSA172
OCR Text ... optical degradation due to the heat and atmosphere of reflow soldering. * since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant. failure to comply might lead to nic...
Description SPECIFICATIONS FOR AMBER LED

File Size 317.97K  /  16 Page

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