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laminate Datasheet PDF File

For laminate Found Datasheets File :: 801 Search Time::1.719ms
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				Integrated Device Techn... IDT[Integrated Device Technology]
Part No.	IDT7MP4060 IDT7MP4060S15M IDT7MP4060S15Z IDT7MP4060S20M IDT7MP4060S20Z IDT7MP4095 IDT7MP4095S20M IDT7MP4095S15Z IDT7MP4095S20Z IDT7MP4095S15M
OCR Text	... plastic components on an epoxy laminate (FR-4) substrate * Single 5V (10%) power supply * Multiple GND pins and decoupling capacitors for maximum noise immunity * Inputs/outputs directly TTL compatible * Gold plated fingers on the SIMM ver...
Description	128K x 32 CMOS STATIC RAM MODULES
File Size	96.36K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	BT169D BT169DW BT169BW BT169GW BT169W BT169EW BT169
OCR Text	...xy glass (1.6 mm thick), copper laminate (35 m thick). September 1997 5 Rev 1.200 Philips Semiconductors Product specification Thyristor logic level MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0.24 6.7 6.3 3....
Description	Thyristors logic level(可控硅逻辑电平) 1 A, 600 V, SCR Thyristor logic level
File Size	52.63K / 7 Page	View it Online	Download Datasheet

				Fujitsu, Ltd. Fujitsu Limited Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited] Fujitsu Microelectronics Fujitsu Component Limit...
Part No.	N010-0550- N010-0550-T341 N010-0510-T302 N010-0510-T211 NC41120-0015 FID-550 N010-0550-T511 N010-0550-T601 N010-0550-T611 N010-0550-T621 N010-0550-T711 N010-0550-T811 N010-0550-T913 N010-0551-T242 N010-0559-V022 N16B-0558-B240 N16B-0558-B720
OCR Text	...nductive Face FPC-type cable laminate Film Contact Section View Bottom View (Drawing, with conductive side up) (Mating connector type FCI or equivalent SFW15R-1ST: for FPC) Transparent Area Anit-input Area 0.8 mm min. Input Area Sh...
Description	Stainless Steel Clips 电阻式触摸屏规格 PLASTIC ID HOLD DOWN CLIP RELAY STANDARD Resistive Touch Panel Specification
File Size	325.89K / 7 Page	View it Online	Download Datasheet

				Philips
Part No.	BT148WSERIES
OCR Text	...xy glass (1.6 mm thick), copper laminate (35 m thick). October 1997 5 Rev 1.300 Philips Semiconductors Product specification Thyristors logic level MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0.24 6.7 6.3 3.1...
Description	logic level
File Size	40.27K / 7 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	PACDN1408CR PACDN1404CR PACDN1404C PACDN1404 PACDN1416CR PACDN1416C PACDN1408C
OCR Text	...llow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIAGRAMS D1 D2 D3 D4 D5 B1 B2 B3 B1 B2 B3 B4 B5 C1 B1 C2 B2 C3 B3 C4 B4 C5 B5 A1 A2 A3 A1 A2 A3 A4 ...
Description	ESD PROTECTION ARRAYS CHIP SCALE PACKAGE ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE
File Size	49.48K / 3 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	PACDN1408C PACDN1408CR PACDN2408CR PACDN2408C
OCR Text	...llow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIAGRAMS B1 B2 B3 B4 B5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 A1 A2 A3 A4 A5 PACDN1408C PACDN2408C S TA N D A R D PA ...
Description	ESD PROTECTION ARRAYS/ 8 CHANNEL/ CHIP SCALE PACKAGE ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE ESD PROTECTION ARRAYS CHIP SCALE PACKAGE ESD PROTECTION ARRAYS 8 CHANNEL CHIP SCALE PACKAGE
File Size	744.94K / 3 Page	View it Online	Download Datasheet

				Philips
Part No.	BUK9880-55
OCR Text	...xy glass (1.6 mm thick), copper laminate (35 m thick). April 1998 7 Rev 1.100 Philips Semiconductors Product specification TrenchMOSTM transistor Logic level FET MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0....
Description	TrenchMOS TM transistor
File Size	50.33K / 9 Page	View it Online	Download Datasheet

				MICRON[Micron Technology] Micron Technology, Inc.
Part No.	MT46V8M16 MT46V32M4 MT46V16M8
OCR Text	... 1 A B C SUBSTRATE: PLASTIC laminate 2 3 4 5 6 A B C D E F G H J K L M 7 8 9 C L 3.20 0.05 4.50 0.05 9 .00 0.10 D E SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or 62% Sn, 36% Pb, 2%Ag SOLDER BALL PAD: ...
Description	DOUBLE DATA RATE DDR SDRAM DOUBLE DATA RATE DDR SDRAM 双倍数据速率的DDR SDRAM内存
File Size	148.77K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	BT169
OCR Text	...xy glass (1.6 mm thick), copper laminate (35 m thick). September 1997 5 Rev 1.200 Philips Semiconductors Product specification Thyristor logic level MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0.24 6.7 6.3 3....
Description	Thyristor logic level
File Size	39.12K / 7 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	CX77304-15
OCR Text	...ts are mounted on a multi-layer laminate substrate and the assembly encapsulated with plastic overmold. * Dual-band cellular handsets encompassing Class 4 GSM850 PCS1900, and up to Class 10 GPRS multislot operation Functional Block D...
Description	PA Module for Dual Band GSM850 PCSI900 / GPRS Applications PA Module for Dual-band GSM850 PCS1900 / GPRS Applications PAM for Dual-band GSM850 PCS1900 / GPRS
File Size	550.65K / 20 Page	View it Online	Download Datasheet

For laminate Found Datasheets File :: 801 Search Time::1.719ms
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