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Amphenol Communications Solutions |
Part No. |
10127820-0222GLF
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Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68002-220HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68002-227HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127820-0222TLF
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Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tape and Reel without cap.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0022269131 22-26-9131
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Description |
2.54mm (.100) KK庐 IDT Double Cantilever Contact, 13 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip 2.54mm (.100) KK? IDT Double Cantilever Contact, 13 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip
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File Size |
484.66K /
20 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
68002-228HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68002-223HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0022269162 22-26-9162
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Description |
2.54mm (.100) KK庐 IDT Double Cantilever Contact, 16 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip 2.54mm (.100) KK? IDT Double Cantilever Contact, 16 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
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File Size |
484.67K /
20 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10022253-250CALF
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Description |
Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127820-0222GPLF
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Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127820-0222LF
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Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0022285200 22-28-5200
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Description |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, 20 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 20 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
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File Size |
522.39K /
36 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
68002-229HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 000-6181-37R |
Maker: N/A |
Pack: N/A |
Stock: 300057 |
Unit price
for : |
50: $2.07 |
100: $1.96 |
1000:
$1.86 |
Email: oulindz@gmail.com |
Contact us |
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