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mils Datasheet PDF File

For mils Found Datasheets File :: 5811 Search Time::2.5ms
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				Central Semiconductor Corp
Part No.	CPD94X
OCR Text	... diode chip die size 20 x 20 mils die thickness 5.9 mils anode bonding pad area 16 x 16 mils top side metalization al - 20,000? back side metalization au - 12,000? www.centralsemi.com r0 (19-july 2010) process cpd94x t...
Description	0.5 Amp Schottky Diode Chip
File Size	665.02K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD93V
OCR Text	...planar die size 12.8 x 12.8 mils die thickness 7.1 mils anode bonding pad area 5.1 x 5.1 mils top side metalization al - 30,000? back side metalization au-as - 10,000? www.centralsemi.com r2 (22-march 2010) process ...
Description	High Current Switching Diode Chip
File Size	400.55K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD92X
OCR Text	...l planar die size 9.0 x 9.0 mils die thickness 5.9 mils anode bonding pad area 4.8 mils diameter top side metalization al - 30,000? back side metalization au - 12,000? backside cathode www.centralsemi.com r1 (22-march 201...
Description	High Voltage Schottky Diode Chip
File Size	368.44K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD91V10
OCR Text	...ial planar die size 11 x 11 mils die thickness 7.1 mils anode bonding pad area 3.35 x 3.35 mils top side metalization al - 15,000? back side metalization au-as - 12,000? www.centralsemi.com r2 (3-august 2010) process ...
Description	Switching Diode Low Leakage Switching Diode Chip
File Size	818.87K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD89V
OCR Text	...planar die size 12.8 x 12.8 mils die thickness 7.1 mils anode bonding pad area 5.1 x 5.1 mils top side metalization al - 30,000? back side metalization au-as - 10,000? www.centralsemi.com r1 (22-march 2010) process ...
Description	High Current Diode Chip
File Size	451.48K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD87R
OCR Text	...planar die size 14.6 x 14.6 mils die thickness 3.9 mils anode bonding pad area 11.8 x 11.8 mils top side metalization al - 30,000? back side metalization au - 12,000? www.centralsemi.com r1 (22-march 2010) process ...
Description	Low Leakage Schottky Diode Chip
File Size	704.01K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD85V
OCR Text	...planar die size 39.4 x 39.4 mils die thickness 7.1 mils anode bonding pad area 35 x 35 mils top side metalization al - 30,000? back side metalization au - 12,000? www.centralsemi.com r1 (22-march 2010) process cpd...
Description	1 Amp Schottky Barrier Rectifier Chip
File Size	447.30K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD80V10
OCR Text	...ial planar die size 16 x 16 mils die thickness 7.1 mils anode bonding pad area 6.5 x 6.5 mils top side metalization al - 30,000? back side metalization au-as - 13,000? backside cathode www.centralsemi.com r3 (22-march 20...
Description	Switching Diode High Voltage Switching Diode Chip
File Size	394.34K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp Central Semiconductor C...
Part No.	CPD38X
OCR Text	...ifier chip die size 72 x 72 mils die thickness 5.9 mils anode bonding pad area 64 x 64 mils top side metalization al/ni/au - 30,000?/4,000?/1,500? back side metalization ti/ni/au - 1,600?/5,550?/1,500? www.centralsemi.co...
Description	8 Amp Schottky Rectifier Chip
File Size	144.14K / 1 Page	View it Online	Download Datasheet

				Central Semiconductor Corp Central Semiconductor C...
Part No.	CPD30V
OCR Text	...46,200 die size 15.4 x 15.4 mils die thickness 7.1 mils anode 1 bonding pad area 5.9 x 5.9 x 8.3 mils anode 2 bonding pad area 5.9 x 5.9 x 8.3 mils top side metalization al - 30,000? back side metalization au-as - 10...
Description	Dual Switching Diode
File Size	473.08K / 2 Page	View it Online	Download Datasheet

For mils Found Datasheets File :: 5811 Search Time::2.5ms
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