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POLYFET[Polyfet RF Devices]
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Part No. |
F1002
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR 专利金金属化硅栅增强型射频功率VDMOS晶体
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File Size |
36.55K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54101-S0504A03RLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1004
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR 专利金金属化硅栅增强型射频功率VDMOS晶体
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File Size |
37.07K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54101-S08-16
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1005
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
37.06K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54101-G34-02
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
POLYFET[Polyfet RF Devices]
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Part No. |
F1006
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
36.74K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-G10-06LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1007
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
37.50K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-S08-04
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
POLYFET[Polyfet RF Devices]
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Part No. |
F1008
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
37.41K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-T10-02
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1012
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Description |
CIRCULAR MINI-DINS PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
37.44K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-G05-05
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 5 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1014
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
37.58K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-G0516LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54101-G0808LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
POLYFET[Polyfet RF Devices]
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Part No. |
F1015
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR 专利金金属化硅栅增强型射频功率VDMOS晶体
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File Size |
37.15K /
2 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
54101-G0818LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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