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1001000 PC2VL 9S08DZ16 XMEGA FR20K05 77034052 4078B KBPC5
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  leadless Datasheet PDF File

For leadless Found Datasheets File :: 6488    Search Time::1.922ms    
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    United Monolithic Semic...
UMS[United Monolithic Semiconductors]
Part No. CHM1290REF_24 CHM1290REF CHM1290REF/24
OCR Text leadless package Description The monolithic microwave IC (MMIC) in the package is a multi-function chip which integrates a self biased LO buffer amplifier and a sub-harmonic diode mixer for 2LO suppression. It is usable both for up- and do...
Description 20-30GHz SUB-HARMONICALLY PUMPED MIXER

File Size 196.07K  /  8 Page

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    United Monolithic Semic...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
Part No. CHA5390TBF_24 CHA5390TBF CHA5390TBF/24
OCR Text leadless package Description The monolithic microwave IC (MMIC) in the package is a high gain broadband fourstage monolithic medium power amplifier. It is designed for a wide range of applications, from military to commercial communication...
Description 24-30GHz Medium Power Amplifier 24 - 30GHz的中等功率放大器

File Size 167.02K  /  6 Page

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    United Monolithic Semiconductors GmbH
UMS[United Monolithic Semiconductors]
Part No. CHA5093TCF_24 CHA5093TCF CHA5093TCF/24
OCR Text leadless package Description The packaged monolithic microwave IC (MMIC) is a high gain three-stage monolithic high power amplifier. It is designed for a wide range of applications, from military to commercial communication systems. The ci...
Description 24-26GHz High Power Amplifier 24 - 26GHz高功率放大器

File Size 151.10K  /  6 Page

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    NXP
Part No. PMEG2002AESF
OCR Text ...ction in a dsn0603-2 (sod962-2) leadless ultra small surface-mounted device (smd) package. 2. features and benefits ? average forward current i f(av) 0.2 a ? reverse voltage v r 20 v ? low forward voltage typ. v f 245 mv ? low forward ...
Description 0.2 A low VF MEGA Schottky barrier rectifier

File Size 207.99K  /  13 Page

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    United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
Part No. CHA2069RAF_24 CHA2069RAF CHA2069RAF/24
OCR Text leadless package Description The monolithic microwave IC (MMIC) in the package is a three-stage self biased wide band monolithic low noise amplifier. The MMIC is manufactured with a standard PM-HEMT process: 0.25m gate length, via holes th...
Description Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No
18-31GHz Low Noise Amplifier 18 - 31GHz之间低噪声放大器

File Size 169.36K  /  7 Page

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    United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
Part No. CHA2066RBF_24 CHA2066RBF CHA2066RBF/24
OCR Text leadless package Description The monolithic microwave IC (MMIC) in the package is a two-stage self biased wide band monolithic low noise amplifier. The MMIC is manufactured with a standard PM-HEMT process: 0.25m gate length, via holes thro...
Description 10-16GHz Self biased Low Noise Amplifier

File Size 179.82K  /  8 Page

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    Panasonic
Part No. CT-24SX12UF CT-27SX12F CT-24SX12F
OCR Text ...tes...........................5 leadless chip component (surfacemount).................5 componentremoval................5 chipcomponentinstallation..........5 howtoreplaceflat-ic..............5 boarddesignationtable..................6 rece...
Description Color Television Service Manual

File Size 4,611.37K  /  42 Page

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    SI5855CDC SI5855CDC-T1-E3

Vishay Siliconix
Part No. SI5855CDC SI5855CDC-T1-E3
OCR Text ...257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not...
Description P-Channel 20-V (D-S) MOSFET With Schottky Diode

File Size 128.70K  /  9 Page

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    SI5857DU SI5857DU-T1-GE3

Vishay Siliconix
Part No. SI5857DU SI5857DU-T1-GE3
OCR Text ...257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not...
Description P-Channel 20-V (D-S) MOSFET With Schottky Diode

File Size 133.11K  /  10 Page

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    AK594096AG AK594096AS

ACCUTEK MICROCIRCUIT CORPORATION
Part No. AK594096AG AK594096AS
OCR Text ...e module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. The module is only 0.800 inches high (same height as a standard 1 Meg module), making it ideally suited for applications with low height restrictions. The operation...
Description 4,194,304 Word x 9 Bit CMOS Dynamic Random Access Memory

File Size 83.97K  /  2 Page

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