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For package. Found Datasheets File :: 370732    Search Time::2.281ms    
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    BSZ0901NSI

Infineon Technologies AG
Part No. BSZ0901NSI
OCR Text ... design tools q g . typ 41 type package marking bsz0901nsi pg-tsdson-8 (fused leads) 0901nsi optimos? power-mosfet bsz0901nsi final data sheet 2 2.0, 2011-03-29 2 maximum ratings at t j = 25 c, unless otherwise specified. 3 therm...
Description n-Channel Power MOSFET

File Size 1,282.19K  /  11 Page

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    UFORCE

Advanced Micro Devices
Part No. UFORCE
OCR Text ...e stated the resistors are 0603 package 5% tol. note: unless otherwise stated the capacitors are 0603 package 10% tol. rev. 2.0 e4.sch 2.0 uforce demo board (c) advanced micro devices, inc. (800) 222-9323 5204 e. ben w hite blvd. a...
Description SMALL SIGNAL SCHOTTKY DIODES
ElanSC400 and Windows CE uforCE Demonstration System Schematics

File Size 214.47K  /  15 Page

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    2SB1172 2SB1172A

PANASONIC[Panasonic Semiconductor]
Part No. 2SB1172 2SB1172A
OCR Text ...ation voltage VCE(sat) * I type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment 7.00.3 3.00.2 2.00.2 3.50.2 Unit: mm 0 to 0.15 2.50.2 12.60.3 7.20.3 1.10....
Description Silicon PNP epitaxial planar type

File Size 75.67K  /  3 Page

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    2SB1175

PANASONIC[Panasonic Semiconductor]
Part No. 2SB1175
OCR Text ...e collector current IC * I type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment 12.60.3 7.20.3 (1.0) (1.0) Unit: mm 7.00.3 3.00.2 2.00.2 3.50.2 0 to 0.15 2.50....
Description Silicon PNP epitaxial planar type

File Size 84.91K  /  4 Page

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    2SB1176

PANASONIC[Panasonic Semiconductor]
Part No. 2SB1176
OCR Text ...e collector current IC * I type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment 12.60.3 7.20.3 (1.0) (1.0) Unit: mm 7.00.3 3.00.2 2.00.2 3.50.2 0 to 0.15 2.50....
Description Silicon PNP epitaxial planar type

File Size 84.74K  /  4 Page

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    2SB1180 2SB1180A

PANASONIC[Panasonic Semiconductor]
Part No. 2SB1180 2SB1180A
OCR Text ...ent transfer ratio hFE * I type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment 12.60.3 7.20.3 7.00.3 3.00.2 2.00.2 3.50.2 0 to 0.15 2.50.2 (1.0) (1.0)...
Description Silicon PNP epitaxial planar type darlington

File Size 84.71K  /  4 Page

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    TSL2591 TSL25911

austriamicrosystems AG
ams AG
Part No. TSL2591 TSL25911
OCR Text ...e tsl2591 C 4: pin description package fn dual flat no-lead (top view): package drawing is not to scale. pin number pin name description 1scl i 2 c serial clock input terminal 2 int interrupt open drain output (active low). 3 gnd powe...
Description very-high sensitivity light-to-digital
Dual Diode

File Size 698.97K  /  25 Page

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    TSHG5510

Vishay Siliconix
Part No. TSHG5510
OCR Text ...ed in a clear, untinted plastic package. features ? package type: leaded ? package form: t-1? ? dimensions (in mm): ? 5 ? leads with stand-off ? peak wavelength: p = 830 nm ? high reliability ? high radiant power ? high radiant intensi...
Description High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero

File Size 100.50K  /  5 Page

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