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Kingbright Corporation. KINGBRIGHT[Kingbright Corporation] Kingbright Electronic
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Part No. |
KP-2012P3C
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OCR Text |
... Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units... |
Description |
Made with silicon phototransistor chips
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File Size |
65.51K /
3 Page |
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YAGEO Corporation
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Part No. |
RL1206
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OCR Text |
...inations made by th ick film process. applications ? converters ? printer equipment ? server board ? telecom ? consumer features ? halogen free epo xy ? rohs compliant ? h azardous wastes ? ... |
Description |
LOW OHMIC CHIP RESISTORS
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File Size |
447.78K /
9 Page |
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it Online |
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KINGBRIGHT[Kingbright Corporation]
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Part No. |
KP-1608SECK
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OCR Text |
... Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units... |
Description |
1.6x0.8mm SMD CHIP LED LAMP
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File Size |
87.52K /
4 Page |
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it Online |
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KINGBRIGHT[Kingbright Corporation]
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Part No. |
KP-1608P1C
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OCR Text |
...nstructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units... |
Description |
OHTOTRANSISTOR
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File Size |
62.18K /
3 Page |
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it Online |
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Bosch
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Part No. |
SMD288
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OCR Text |
...anced porous silicon membrane) process. th e apsm technology allows to produce a stable single-crystalline membrane with a cmos compatible surface micro-mechanic process. the evaluation circuit which is integrated on the same chip a... |
Description |
Barometric pressure sensor
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File Size |
228.14K /
2 Page |
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it Online |
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http:// MACOM[Tyco Electronics]
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Part No. |
MAAMGM0002-SMB MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB
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OCR Text |
...e Select-at-Test Biasing MSAGTM process
Description
The MAAMGM0002-Die is a 0.1W Distributed Amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. The MMIC can be used as a broadban... |
Description |
Amplifier, Distributed, 0.1W 1.0-18.0 GHz
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File Size |
181.88K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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Part No. |
MAAMGM0003-DIE
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OCR Text |
...ion Self-Aligned MSAG(R) MESFET process
Primary Applications
EW Radar
Description
The MAAMGM0003-Die is a 0.4W Distributed Amplifier with on-chip bias networks and variable gain control. This product is fully matched to 50 ohms on... |
Description |
0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz
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File Size |
265.55K /
7 Page |
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it Online |
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MACOM[Tyco Electronics]
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Part No. |
MAAMGM0007-DIE
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OCR Text |
...ge (4-6V) Operation GaAs MSAGTM process Proven Manufacturability and Reliability
No Airbridges Polyimide Scratch Protection No Hydrogen Poisoning Susceptibility
Description
The MAAMGM0007-Die is a single stage distributed amplifier wit... |
Description |
2.0-18.0 GHz Distributed Amp/Gain Block
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File Size |
315.57K /
6 Page |
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it Online |
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SPANSION LLC
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Part No. |
S98WS064RBOHI0023
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OCR Text |
...nt phases in t he manufacturing process that occur before full production is achieved. changes to the technical specifications presented in a preliminary document should be expected while keeping these as pects of production under consid... |
Description |
SPECIALTY MEMORY CIRCUIT, PBGA88
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File Size |
310.28K /
10 Page |
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it Online |
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Price and Availability
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