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For solder Found Datasheets File :: 91744    Search Time::1.985ms    
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    SI4464DY-T1

Vishay Siliconix
Part No. SI4464DY-T1
OCR Text ... soldering process. the actual solder connections are defined by the solder mask openings. by combining the basic footprint wi th the copper plane on the drain pins, the solder mask ge neration occurs automatically. a final item to keep in...
Description Trans MOSFET N-CH 200V 1.7A 8-Pin SOIC N T/R

File Size 231.71K  /  9 Page

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    SI4462DY-E3

Vishay Siliconix
Part No. SI4462DY-E3
OCR Text ... soldering process. the actual solder connections are defined by the solder mask openings. by combining the basic footprint wi th the copper plane on the drain pins, the solder mask ge neration occurs automatically. a final item to keep in...
Description Trans MOSFET N-CH 200V 1.15A 8-Pin SOIC N

File Size 621.86K  /  9 Page

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    PC817X PC817

SHARP[Sharp Electrionic Components]
Part No. PC817X PC817
OCR Text ...od, conforms to JIS C 702 1. *2 solder shall adhere at the area of 95% or more of immersed portion of lead and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below. F7 SHARP CO...
Description DEVICE SPECIFICATION FOR PHOTOCOUPLER

File Size 507.10K  /  11 Page

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    PC817 PC817XI

SHARP[Sharp Electrionic Components]
Part No. PC817 PC817XI
OCR Text ...onforms to JIS C 7021. `2 solder shall adhere at the area of 95% or more of immersed portion of lead and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below. SHARP CORPORAT...
Description DEVICE SPECIFICATION FOR PHOTOCOUPLER

File Size 545.48K  /  11 Page

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    SPANSION LLC
Part No. S98WS064RBOHI0023
OCR Text ...sc ball pitch sd / se 0.40 bsc. solder ball placement a3,a4,a5,a6,m3,m4,m5,m6 depopulated solder balls 3493\ 16-038.22 \ 05.12.05 notes: 1. dimensioning and tolerancing methods per asme y14.5m-1994. 2. all dimensions are in millimeters. 3....
Description SPECIALTY MEMORY CIRCUIT, PBGA88

File Size 310.28K  /  10 Page

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Part No. S05LTB335
OCR Text ...age c onnection (power) = pc b solder c onnection l high voltage c onnection (c oil) = pc b tail l auxiliary c ontacts = without body related features: l mount style = printed c ircuit board configuration related features: l c ontact ar...
Description POWER/SIGNAL RELAY, SPST, MOMENTARY, 24VDC (COIL), 5A (CONTACT), THROUGH HOLE-STRAIGHT MOUNT

File Size 116.90K  /  1 Page

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    Q62703-Q2439 Q62703-Q2676 LOPP370-KN LOPP370-M LOPP370-MQ LOPP370-N Q62703-Q3232 LSPP370 LSPP370-KN LSPP370-M LSPP370-MQ

SIEMENS A G
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
Part No. Q62703-Q2439 Q62703-Q2676 LOPP370-KN LOPP370-M LOPP370-MQ LOPP370-N Q62703-Q3232 LSPP370 LSPP370-KN LSPP370-M LSPP370-MQ LSPP370-N LSPP370-P Q62703-Q2530 Q62703-Q2671 Q62703-Q2672 Q62703-Q2673 Q62703-Q2674 Q62703-Q2675
OCR Text ...d orange (resp. to super-red) q solder leads with stand-off q available taped on reel q load dump resistant acc. to DIN 40839 q q q q q q Semiconductor Group 0 11.96 VEX06712 LSP P370, LOP P370 Typ Type Emissionsfarbe ...
Description Plane MULTILED 3 mm T1 LED, Non Diffused 平面来料加工3毫米T1的LED,非漫射
Plane MULTILED 3 mm T1 LED, Non Diffused DUAL COLOR LED, ORANGE/PURE GREEN, 3 mm
Plane MULTILED 3 mm T1 LED/ Non Diffused

File Size 536.38K  /  9 Page

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    PESD5V0X2UAMB

NXP Semiconductors
Part No. PESD5V0X2UAMB
OCR Text ... ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm sot883b 7. marking table 4. marking codes type number marking code pesd5v0x2uamb 0100 1111 marking code (example) pin 1 indication reading direction reading direction re...
Description Ultra low capacitance unidirectional double ESD protection diode

File Size 201.97K  /  13 Page

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    PDTA115EMB

NXP Semiconductors
Part No. PDTA115EMB
OCR Text ... ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm sot883b table 4. marking codes type number marking code pdta115emb 0010 0000 fig 1. dfn1006b-3 (sot883b) binary marking code description marking code (example) pin 1 in...
Description PNP resistor-equipped transistor; R1 = 100 kΩ, R2 = 100 kΩ

File Size 703.69K  /  11 Page

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    PBHV8115T215

NXP Semiconductors
Part No. PBHV8115T215
OCR Text ...mal resistance from junction to solder point --70k/w fr4 pcb, standard footprint fig 2. transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab151 10 1 10 2 10 3 z th(j-a) (k/w) 10 - 1 10 ...
Description 150 V, 1 A NPN high-voltage low VCEsat (BISS) transistor

File Size 107.23K  /  13 Page

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For solder Found Datasheets File :: 91744    Search Time::1.985ms    
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