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solder clamp Datasheet PDF File

For solder clamp Found Datasheets File :: 3019 Search Time::1.203ms
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				Toshiba Semiconductor
Part No.	TD62783APG06 TD62783AFWG TD62783APG
OCR Text	...olderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time ...
Description	8CH HIGH−VOLTAGE SOURCE DRIVER
File Size	267.15K / 11 Page	View it Online	Download Datasheet

				CRYSTEK CORPORATION
Part No.	CS-NM-MSD
OCR Text	...r astm-b196. uns c17300. 1.3 solder ferrule: bra ss per astm-b16. uns c36000. 1.4 lock ring: be ryllium copper per as tm-b197. uns ...clamp nuts: passi vated per sae-ams-2700. 2.3 gasket, lock ring, an d dielectrics: none. 3.0 inte...
Description	Type N Plug , solder clamp for Semflex LA290 Cable
File Size	82.87K / 2 Page	View it Online	Download Datasheet


Part No.	CN214 CBNC316 CNF900
OCR Text	...g5 8 nicke l cbnc58 s bnc mal e solder-o n rg5 8 nicke l cbmuhf5 8 mini uhf mal e crimp-o n rg5 8 blac k cmuhf5 8 mini uhf mal e crimp-o n r...clamp-o n lmr60 0 nicke l cn90 0 type n mal e crimp-o n lmr90 0 nicke l cnf90 0 type n femal e clamp...
Description	N CONNECTOR BNC CONNECTOR
File Size	74.76K / 1 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TD62083AFNG TD62084AFNG
OCR Text	...olderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time ...
Description	500 mA, 50 V, 8 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR 8CH DARLINGTON SINK DRIVER
File Size	358.96K / 11 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TD62783AFG TD62783APG TD62784AFG TD62784APG
OCR Text	...olderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time ...
Description	8 ch High-Voltage Source Driver
File Size	178.28K / 11 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TD62783AFNG TD62784AFNG
OCR Text	...olderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time ...
Description	8CH HIGH−VOLTAGE HIGH SOURCE−CURRENT DRIVER
File Size	328.14K / 10 Page	View it Online	Download Datasheet

				ITT[ITT Industries]
Part No.	T4555 T2508 T2509 T4825 050-000-0000000 050-000-0030010 050-000-0030020 050-000-0030040 050-000-0130000 050-000-0290000 050-000-0291000 050-000-0292000 050-000-0854080 050-000-0854090 050-000-1854100 050-000-2854080 050-000-2854090 050-000-4854120 050-424-3188220 050-424-3196220 050-424-3875220 050-443-0000220 050-445-0000220 050-453-0000220 055-607-6203890 055-607-6702890 055-624-6703890 A50-428-3188220 A50-428-3196220 RD316 RG174_U RG178_U RG196_U RG316_U SSMB SSMC T0557_1 T0854_10_K T0854_8_A T0854_8_C T0854_9_A T0854_9_C T0854_M8_E T1848 T2297 T2887_A T2921 T4519 T4653 T4809
OCR Text	...6. Using a small soldering iron solder center conductor to contact. NOTE: The center conductor should not protrude beyond the contact or tou...clamp Type for Braided Cable Assembly Instructions clamp NUT `O' RING SLEEVE INSULATO...
Description	RF Coaxial Connectors
File Size	454.31K / 39 Page	View it Online	Download Datasheet

				California Micro Devices Corp
Part No.	PACDN2404CG
OCR Text	...t appliances and pcs. the large solder bumps allow for standard attachment to laminate boards with- out the use of underfill. the pacdn2404c...clamp voltage positive clamp negative clamp i load = 10ma 6.0 -9.2 7.6 -7.6 9.2 -6.0 v v v esd in-...
Description	ESD Protection Arrays, 4, 8 and 16 Channel, Chip Scale Package
File Size	156.77K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TD62308BFG TD62308BP1G
OCR Text	...olderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time ...
Description	4CH LOW INPUT ACTIVE HIGE−CURRENT DARLINGTON SINK DRIVER
File Size	402.13K / 11 Page	View it Online	Download Datasheet

				California Micro Devices
Part No.	CSPESD301
OCR Text	...ces. figure 6. recommended non-solder mask defined pad illustration figure 7. eutectic (snpb) solder ball reflow profile figure 8. lead-free (snagcu) solder ball reflow profile printed circuit board recommendations parameter value pad s...
Description	1 / 2 and 3-Channel ESD Arrays in CSP
File Size	447.52K / 7 Page	View it Online	Download Datasheet

For solder clamp Found Datasheets File :: 3019 Search Time::1.203ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |