| |
|
 |
Amphenol Communications Solutions |
| Part No. |
87900-158HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
A-70567-0015 0015800341
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
|
| File Size |
1,218.42K /
7 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0015800145 15-80-0145 70567-0141
|
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0015800169 15-80-0169 A-70567-0278
|
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
|
| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0015800281 70567-0012 15-80-0281
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
|
| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
15-80-0105 0015800105 A-70567-0139
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
70567-0011 A-70567-0011 0015800261
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
|
| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
70567-0010 A-70567-0010 0015800241
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
|
| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 000-6181-37R |
| Maker: N/A |
| Pack: N/A |
| Stock: 300057 |
| Unit price
for : |
|
50: $2.07 |
|
100: $1.96 |
| 1000:
$1.86 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
