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  32000 Datasheet PDF File

For 32000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    KM23C32000CET

Samsung Semiconductor
Part No. KM23C32000CET
Description 32M-Bit (4Mx8 / 2Mx16) CMOS Mask ROM

File Size 81.46K  /  4 Page

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Renesas Electronics Corporation

Part No. 84132-000
Description 4Kx4 SRAM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    KMM53632000CK

Samsung Semiconductor
Part No. KMM53632000CK
Description 32MB X 36 DRAM Simm Using 16MB X 4 & 16MB X 1

File Size 414.90K  /  20 Page

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Renesas Electronics Corporation

Part No. 7MB6320-000
Description SRAM MODULE
Tech specs    

Official Product Page

    KMM53632000BK

Samsung Semiconductor
Part No. KMM53632000BK
Description 32MBx36 DRAM Simm Using 16MBx4 & 16MBx1

File Size 377.48K  /  18 Page

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Amphenol Communications Solutions

Part No. 10106133-2000002LF
Description PwrBlade+® , Power Connectors, 2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    Infineon
Part No. HYS72T32000HU-3.7-A HYS72T32000HU-5-A
Description 256MB - 2GB, 240pin

File Size 638.44K  /  40 Page

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Amphenol Communications Solutions

Part No. 10121505-320008BLF
Description HPCE VT Receptacle with enhanced wall 32P8S
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM53232000BV
Description 32M x 32 DRAM SIMM(32M x 32 动RAM模块)

File Size 357.48K  /  19 Page

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Amphenol Communications Solutions

Part No. 10119109-320007LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ICST[Integrated Circuit Systems]
Part No. MK3200SI MK3200STR MK3200 MK32000SITR MK3200S
Description 32.768 kHz Clock Oscillator

File Size 31.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 48232-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    KMM53232000CK

Samsung Semiconductor
Part No. KMM53232000CK
Description 32MBx32 DRAM Simm Using 16MBx4

File Size 403.02K  /  20 Page

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Amphenol Communications Solutions

Part No. 10104320-009RLF
Description Universal Contact, 1.30mm Height
Tech specs    

Official Product Page

    HYS72T32000HP

Qimonda AG
Part No. HYS72T32000HP
Description 240-Pin Registered DDR2 SDRAM Modules

File Size 1,278.30K  /  53 Page

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Amphenol Communications Solutions

Part No. 10106133-2000004LF
Description PwrBlade+® , Power Connectors, 2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    KM29W32000AIT KM29W32000AT

Samsung Semiconductor
Part No. KM29W32000AIT KM29W32000AT
Description 4M x 8-Bit NAND Flash Memory

File Size 382.82K  /  28 Page

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Amphenol Communications Solutions

Part No. 10106133-2000401LF
Description PwrBlade+® , Power Connectors, 2HDP, Right Angle, Header.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. KM23V32000CT KM23V32000CET
Description 32M-Bit (4Mx8 /2Mx16) CMOS Mask ROM(32M(4Mx8 /2Mx16) CMOS掩膜ROM) 32兆位Mx8 / 2Mx16)的CMOS掩模ROM2兆位Mx8 / 2Mx16)的CMOS掩膜光盘

File Size 56.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106133-2000005LF
Description PwrBlade+® , Power Connectors, 2HDP PF, Right Angle, Header.
Tech specs    

Official Product Page

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