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Amphenol Communications Solutions |
Part No. |
54112-804280900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-808260900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Bourns, Inc.
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Part No. |
9230-32-RC 9230-90-RC 9230-62-RC 9230-06-RC 9230-28-RC 9230-60-RC 9230-66-RC 9230-00-RC
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Description |
CHOKE RF MOLDED 3.3UH 10% IRON 1 ELEMENT, 3.3 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR Choke, Axial Molded 1 ELEMENT, 820 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR Choke, Axial Molded 1 ELEMENT, 56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR Choke, Axial Molded 1 ELEMENT, 0.27 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR CHOKE RF MOLDED 2.2UH 10% IRON 1 ELEMENT, 2.2 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR CHOKE RF MOLDED 47UH 10% FERRITE 1 ELEMENT, 47 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR Choke, Axial Molded 1 ELEMENT, 82 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR Choke, Axial Molded 1 ELEMENT, 0.15 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
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File Size |
265.93K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54121-805100900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-820100900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-510201900LF
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Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 20 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-809081900LF
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Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
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Tech specs |
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Official Product Page
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Winbond Electronics, Corp. Cypress Semiconductor Corp.
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Part No. |
W230
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Description |
Spread Spectrum FTG for VIA K7 Chipset(应用VIA K7 芯片设置的宽频谱FTG) 166 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48 Spread Spectrum FTG for VIA K7 Chipset(应用B>VIA K7 芯片设置的宽频谱FTG) From old datasheet system
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File Size |
170.82K /
14 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-110401900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-112061900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-811081900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-105160900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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