| PART |
Description |
Maker |
| GSOT05C-HT3 |
Vishay Semiconductors
|
Vishay Intertechnology,Inc.
|
| SML150FB12 |
HIGH PERFORMANCE POWER SEMICONDUCTORS
|
Seme LAB
|
| SML400HB06 |
HIGH PERFORMANCE POWER SEMICONDUCTORS
|
Seme LAB
|
| HL-203K |
Power Semiconductors Data Book 1974
|
AEI Semiconductors
|
| BCR10AM-10 |
Power and Industrial Semiconductors Data Book
|
N/A
|
| HI3-0201HS4 HI3-0201HS5 HI1-0201HS2 HI1-0201HS5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0414-4 90; Contact Mating Area Plating: Tin
Interface IC 接口IC
|
Intersil, Corp.
|
| 2SJ221 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0611-3 05; No. of Positions: 8; Connector Type
Silicon P-Channel MOS FET
|
Hitachi,Ltd.
HITACHI[Hitachi Semiconductor]
|
| 30CTH02 30CTH02-1 30CTH02FP 30CTH02S |
200V 20A HyperFast Discrete Diode in a TO-220AB package
300V 20A HyperFast Discrete Diode in a TO-262 package
300V 20A HyperFast Discrete Diode in a TO-220 FullPak package
200V 30A HyperFast Discrete Diode in a D2-Pak package
|
International Rectifier
|
| 2SJ226 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0503-0 00; No. of Positions: 8; Connector Type: Wire
Very High-Speed Switching Applications
|
Sanyo Electric Co.,Ltd.
SANYO[Sanyo Semicon Device]
|
| HGT1S7N60A4DS9A |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0692-5 53; Contact Mating Area Plating: Gold 晶体管| IGBT的|正陈| 600V的五（巴西）国际消费电子展|4A一（c）|63AB
|
Intersil, Corp.
|
| HGT2100-100 HGT2100-1000 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0684-7 53; Contact Mating Area Plating: Gold 工业控制IC
Industrial Control IC 工业控制IC
|
IDEC, Corp.
|
