| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5SMX12M1273 |
IGBT-Die
|
The ABB Group
|
| 5SMX12H1273 |
IGBT-Die
|
The ABB Group
|
| 5SMX12L2510 |
IGBT-Die
|
The ABB Group
|
| 5SMX12K1701 |
IGBT-Die
N/A
|
The ABB Group
ABB Semiconductors
|
| 5SMX12E1273 |
IGBT-Die
|
The ABB Group
|
| DD750S65K3 |
Bare Die IGBT
|
Infineon Technologies AG
|
| IRG4CC60FB |
IRG4CC60FB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC71KB |
IRG4CC71KB IGBT Die in Wafer Form
|
IRF[International Rectifier]
|
| IRG4CC60UB |
IRG4CC60UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30KB |
IRG4CC30KB IGBT Die in Wafer Form
|
International Rectifier
|
