| PART |
Description |
Maker |
| KBJ10J KBJ10A KBJ10B KBJ10M KBJ10D |
Tantalum Molded Capacitor; Capacitance: 68uF; Voltage: 16V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 47uF; Voltage: 16V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel
TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILCON BRIDGE RECTIFIER 技术规格单相桥式整流器秀
|
DC Components Co., Ltd.
|
| TG-110 TG-112 TG-115 TG-117 TG-124 TG-123 TG-181 T |
HIGH ENERGY SPARK GAP DEVICES 高能火花隙装
Tantalum Molded Capacitor; Capacitance: 4.7uF; Voltage: 35V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 1uF; Voltage: 6.3V; Case Size: 2x1.25 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 4V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
HIGH ENERGY SPARK GAP DEVICES
|
Clare Inc
CLARE[Clare, Inc.]
CLARE[Clare Inc.]
|
| GBJ1010 GBJ10005 GBJ1001 GBJ1002 GBJ1004 GBJ1006 G |
Aluminum Polymer SMT Capacitor; Capacitance: 47uF; Voltage: 25V; Case Size: 10x10 mm; Packaging: Tape & Reel 10 A, 400 V, SILICON, BRIDGE RECTIFIER DIODE
Aluminum Polymer SMT Capacitor; Capacitance: 68uF; Voltage: 20V; Case Size: 10x8 mm; Packaging: Tape & Reel 10 A, 100 V, SILICON, BRIDGE RECTIFIER DIODE
Aluminum Polymer SMT Capacitor; Capacitance: 22uF; Voltage: 20V; Case Size: 6.3x6 mm; Packaging: Tape & Reel 10 A, 50 V, SILICON, BRIDGE RECTIFIER DIODE
10A GLASS PASSIVATED BRIDGE RECTIFIER
|
Diodes, Inc.
DIODES[Diodes Incorporated]
|
| WAN-0165 |
Safe Handling and Packaging of Tape and Reel Product to be Returned
|
Wolfson Microelectronics plc
|
| DL126TRD DL126TRS |
Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes
|
ON Semiconductor
|
| 6861XX14122 |
1.0MM ZIF FPC HORIZONTAL TOP CONTACT TYPE - TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 68715014022 |
0.5MM ZIF FPC HORIZONTAL TOP CONTACT TYPE -TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 87891-1818 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-1817 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| KA7305 |
Tantalum Conformal-Coated Capacitor; Capacitance: 3.3uF; Voltage: 16V; Packaging: Tape & Reel
B/W CCD PROCESSOR
|
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
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