| PART |
Description |
Maker |
| TSSOP14 |
14-LEAD THIN SHRINK SMALL OUTLINE
|
STMicroelectronics
|
| AKB083220 AKB083220-13 |
Thin Small Outline Packages TSOP to SOIC BGA Adapters
|
ACCUTEK MICROCIRCUIT CO...
|
| 21-0114B 21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) 封装外形引脚薄型SOT23封装，（小资料）
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Maxim Integrated Products, Inc.
|
| M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装（EPTSSOP
From old datasheet system
|
INTERSIL[Intersil Corporation]
|
| SC70-8 |
SMALL OUTLINE TRANSISTOR PACKAGE
|
List of Unclassifed Manufacturers
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| AP2327GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2323GN-HF |
Capable of 1.8V Gate Drive, Small Package Outline
|
Advanced Power Electronics Corp.
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AP2609GY-HF AP2609GY-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
