PART |
Description |
Maker |
MBR1550CT |
Guard ring die constuction for transient protection
|
Kersemi Electronic Co., Ltd...
|
1N5819-T 1N5817-B 1N5817-T 1N5818-B 1N5819-B 1N581 |
Through-Hole Schottky Rectifiers Guard Ring Die Construction for Transient Protection
|
Diodes Incorporated
|
VS-63CPQ100PBF |
Guard ring for enhanced ruggedness and long term reliability
|
Vishay Siliconix
|
1PS76SB70 |
Low forward volatge Guard ring protected Very small plastic SMD package
|
TY Semiconductor Co., L...
|
1PS76SB21 |
Ultra fast switching speed Low forward volatge Guard ring protected
|
TY Semiconductor Co., L...
|
BAT64-07 BAT6407 Q62702-A964 |
Silicon Schottky Diodes (For low-loss/ fast-recovery/ meter protection/ bias isolation and clamping applications Integrated diffused guard ring) Silicon Schottky Diodes (For low-loss, fast-recovery, meter protection, bias isolation and clamping applications Integrated diffused guard ring) From old datasheet system
|
SIEMENS AG SIEMENS[Siemens Semiconductor Group]
|
408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
19073-0244 19073-0233 19193-0105 19193-0094 19069- |
RING AVIKRIMP EXPD (C-840-56X) 5 mm2, COPPER ALLOY, RING TERMINAL 190730233 5 mm2, COPPER ALLOY, RING TERMINAL RING VERSAKRIMP TAPED (C-328-06T) 5 mm2, COPPER ALLOY, RING TERMINAL 191930094 5 mm2, COPPER ALLOY, RING TERMINAL RING KRIMPTITE (C-128-08) SPM 5 mm2, COPPER ALLOY, RING TERMINAL CONN RING TERM 1/2 10-12AWG 5 mm2, COPPER ALLOY, RING TERMINAL RING VERSAKRIMP (C-328-06) 5 mm2, COPPER ALLOY, RING TERMINAL RING AVIKRIMP EXPD (C-830-56X) 5 mm2, COPPER ALLOY, RING TERMINAL RING INSULKRIMP TAPED (C-230-10XT) 5 mm2, COPPER ALLOY, RING TERMINAL
|
Molex, Inc.
|
203CMQ080 203CMQ100 203CMQ-SERIES |
SCHOTTKY RECTIFIER Guard ring for enhanced ruggedness and long term reliability Center tap module
|
Sangdest Microelectroni...
|
BAT721 1PS76SB21 1PS76SB21-15-15 BAT721C BAT721S B |
Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages. Schottky barrier diodes in small packages
|
NXP Semiconductors
|
19073-0085 19073-0096 19073-0094 19073-0087 19073- |
CONN RING TERM #8 14-16AWG 2.5 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL RING AVIKRIMP TAPED (BB-839-08T) 2.5 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL RING AVIKRIMP (BB-839-08) 2.5 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL #10 RING TERMINAL 100/PKG 2.5 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL BB-837-06T RING AVIKRIMP TAPED 2.5 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
|
Molex, Inc.
|