![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
INTEGRATED CIRCUITS DATA SHEET PCF84C81A Telecom microcontroller Product specification Supersedes data of 1996 Nov 20 File under Integrated Circuits, IC14 1998 Apr 20 Philips Semiconductors Product specification Telecom microcontroller CONTENTS 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 14.1 14.2 14.2.1 14.2.2 14.3 14.3.1 14.3.2 14.3.3 15 16 17 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description INSTRUCTION SET HIGH SINK OUTPUT CURRENTS ROM MASK OPTIONS HANDLING LIMITING VALUES DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS PCF84C81A 1998 Apr 20 2 Philips Semiconductors Product specification Telecom microcontroller 1 FEATURES PCF84C81A * Manufactured in silicon gate CMOS process * 8-bit CPU, ROM, RAM, I/O in a 28-lead package * 8 kbyte ROM, 256 byte RAM (PCF84C81A) * I2C-bus interface with multi-master capability * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 20 quasi-bidirectional I/O Port lines * High sink current capability on the 8 lines of Port 1 * 8-bit programmable timer/event counter 1 * 3 single-level vectored interrupts: - external - 8-bit programmable timer/event counter 1 - I2C-bus * Two test inputs, one of which also serves as the external interrupt input * Stop and Idle modes * Supply voltage: 2.5 to 5.5 V * Clock frequency: 1 to 16 MHz * Operating temperature: -40 to +85 C. 2 GENERAL DESCRIPTION This data sheet details the specific properties of the PCF84C81A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the "PCF84CxxxA family" data sheet which should be read in conjunction with this publication. The PCF84C81A is a general purpose CMOS microcontroller with 8 kbytes of program memory and 256 bytes of RAM. In addition to 20 I/O port lines, the microcontrollers provide an on-chip I2C-bus interface. This two-line serial bus extends the microcontroller capabilities when implemented with the powerful I2C-bus peripherals. These include LCD drivers, I/O expanders, telecom circuits, ADC and DAC converters, clock/calendar circuits, EEPROM and RAM and are listed in "Data Handbook IC12, I2C Peripherals". The instruction set is based on that of the MAB8048 and is a sub-set of that listed in the "PCF84CxxxA family" data sheet. 3 ORDERING INFORMATION (see note 1) PACKAGE TYPE NUMBER NAME PCF84C81AP PCF84C81AT DIP28 SO28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT117-1 SOT136-1 Note 1. Please refer to the Order Entry Form (OEF) for the full type number to use when ordering. This type number will also specify the required program and the ROM mask options. 1998 Apr 20 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1998 Apr 20 4 4 Philips Semiconductors Telecom microcontroller BLOCK DIAGRAM P2.0 to P2.2 SCLK SDA/P2.3 DATA PORT 2 FLIP-FLOPS 3 P1.0 to P1.7 8 PORT 1 BUFFER PORT 1 FLIP-FLOPS RESIDENT ROM 2 kbytes (PCF84C21A) 4 kbytes (PCF84C41A) 8 kbytes (PCF84C81A) DECODE P0.0 to P0.7 8 PORT 0 BUFFER PORT 0 FLIP-FLOPS CLOCK PORT 2 BUFFER INTERNAL CLOCK FREQ. 30 32 I2C-BUS INTERFACE T1 4 8 MEMORY BANK FLIP-FLOPS TIMER/ EVENT COUNTER HIGHER PROGRAM COUNTER LOWER PROGRAM COUNTER PROGRAM STATUS WORD 8 8 5 8 8 8 8 8 INTERRUPT LOGIC TEMPORARY REGISTER 2 8 8 8 8 8 MULTIPLEXER REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK ACCUMULATOR TEMPORARY REGISTER 1 RAM ADDRESS REGISTER ARITHMETIC LOGIC UNIT INSTRUCTION REGISTER & DECODER timer interrupt SIO/ derivative interrupt INT / T0 T1 external interrupt DECIMAL ADJUST STOP IDLE INT / T0 INTERRUPT CONDITIONAL BRANCH LOGIC TIMER FLAG CARRY ACC XTAL 2 ACC BIT TEST D E C O D E DATA STORE PCF84C81A handbook, full pagewidth CONTROL & TIMING RESET XTAL 1 INITIALIZE Product specification RESIDENT RAM ARRAY MBB561 OSCILLATOR Fig.1 Block diagram. Fig.1 Block diagram of PCF84C21A; PCF84C41A and PCF84C81A. Philips Semiconductors Product specification Telecom microcontroller 5 5.1 PINNING INFORMATION Pinning 5.2 Pin description PCF84C81A Table 1 DIP28 and SO28 packages PIN 1 2 FUNCTION 1 bit of Port 2: 4-bit quasi-bidirectional I/O port bidirectional data line of the I2C-bus interface, or 1 bit of Port 2: 4-bit quasi-bidirectional I/O port bidirectional clock line of the I2C-bus interface 8 bits of Port 0: 8-bit quasi-bidirectional I/O port Interrupt/Test 0 Test 1/count input of 8-bit timer/event counter 1 ground crystal oscillator input or external clock input crystal oscillator output Reset input SYMBOL handbook, halfpage P2.2 P2.2 1 2 3 4 5 6 7 28 VDD 27 P2.1 26 P2.0 25 P1.7 24 P1.6 23 P1.5 SDA/P2.3 SCLK P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 SDA/P2.3 SCLK 3 P0.0 to P0.7 4 to 11 INT/T0 T1 VSS XTAL1 XTAL2 RESET 12 13 14 15 16 17 PCF84C81A 8 9 22 P1.4 21 P1.3 20 P1.2 19 P1.1 18 P1.0 17 RESET 16 XTAL2 15 XTAL1 P0.6 10 P0.7 11 INT/T0 12 T1 13 VSS 14 MBB562 P1.0 to P1.7 18 to 25 8 bits of Port 1: 8-bit quasi-bidirectional I/O port P2.0 to P2.1 26 to 27 2 bits of Port 2: 4-bit quasi-bidirectional I/O port VDD 28 positive supply Fig.2 Pin configuration. 6 INSTRUCTION SET 7 HIGH SINK OUTPUT CURRENTS See the "PCF84CxxxA family" data sheet for a complete description of the instruction set. The Port 1 outputs of these devices are designed for high current drive in the logic 0 state. They are capable of driving 10 mA loads and higher. Applications include drive for small relays and light-emitting diodes (LEDs). To avoid overload, care should be taken that the total Port 1 current averages less than 80 mA, i.e. an average of 10 mA per Port 1 line. Refer to Chapter "Limiting values" which specifies an upper limit of 100 mA for ISS. 1998 Apr 20 5 Philips Semiconductors Product specification Telecom microcontroller 8 ROM MASK OPTIONS ROM CODE Program/data Port Output P0.0 to P0.7 P1.0 to P1.7 P2.0 to P2.2 SDA/P2.3 Port State after reset P0.0 to P0.7 P1.0 to P1.7 P2.0 to P2.2 SDA/P2.3 Oscillator Transconductance 9 HANDLING LOW (gmL) MEDIUM (gmM) set set set set reset reset reset - standard standard standard - open-drain open-drain open-drain open-drain OPTION PCF84C81A Any mix of instructions and data up to ROM size of 8 kbytes. push-pull push-pull push-pull - - - - - HIGH (gmH) Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See "Data Handbook IC14, Section: Handling MOS devices". 10 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IO Ptot PO IDD ISS Tstg Tj supply voltage all input voltages DC input current DC output current except Port 1 output LOW DC output current, Port 1 output LOW total power dissipation power dissipation per output supply current ground supply current storage temperature range operating junction temperature PARAMETER MIN. -0.5 -0.5 -10 -10 -10 - - -50 -100 -55 - +7 VDD + 0.5 +10 +10 +20 125 30 +50 +50 +150 90 MAX. V V mA mA mA mW mW mA mA C C UNIT 1998 Apr 20 6 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A 11 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL VDD IDD PARAMETER operating supply voltage operating supply current see Fig.3 note 1; see Figs 4 and 5 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(idle) supply current (Idle mode) note 1; see Figs 6 and 7 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(stp) Inputs VIL VIH ILI Outputs IOL LOW level output sink current [except Port 1; SDA/P2.3 and SCLK] LOW level output sink current; Port 1 LOW level output sink current; SDA/P2.3 and SCLK HIGH level pull-up output source current HIGH level push-pull output source current VDD = 5 V; VO = 0.4 V; see Fig.9 1.6 5 - mA LOW level input voltage HIGH level input voltage input leakage VSS VI VDD 0 -1 - - 0.3VDD V VDD +1 V A 0.7VDD - supply current (Stop mode) VDD = 2.5 V; notes 1 and 2; see Fig.8 - - - - - 0.2 0.8 1.2 1.7 1.2 0.4 1.6 4.0 5.0 10 mA mA mA mA A - - - - 0.3 1.1 1.7 2.5 0.6 3.0 5.0 6.0 mA mA mA mA CONDITIONS MIN. 2.5 TYP. - MAX. 5.5 UNIT V IOL1 IOL2 IOH IOH1 VDD = 5 V; VO = 1.2 V; see Fig.10 VDD = 5 V; VO = 0.4 V; see Fig.11 VDD = 5 V; VO = 3.5 V; see Fig.12 VDD = 5 V; VO = 0 V; see Fig.12 VDD = 5 V; VO = 4.6 V; see Fig.13 10 3 40 - -1.6 19 6.5 100 -7 - - - - mA mA A A mA -140 -400 Oscillator (see Fig.14) gmL gmM gmH RF LOW transconductance MEDIUM transconductance HIGH transconductance feedback resistor VDD = 5 V VDD = 5 V VDD = 5 V 0.2 0.9 3.0 0.3 0.4 1.6 4.5 1.0 1.0 3.2 9.0 3.0 mS mS mS M Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open. 1998 Apr 20 7 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A MBC953 - 1 handbook, halfpage 18 handbook, halfpage 3 MLA712 f xtal (MHz) 12 I DD (mA) 16 MHz 2 10 MHz guaranteed operating range 6 1 3.58 MHz 0 1 3 5 V DD (V) 7 0 1 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.3 Maximum clock frequency as a function of operating supply voltage (VDD). Fig.4 Typical operating supply current (IDD) as a function of operating supply voltage (VDD). handbook, halfpage 3 MLA713 - 1 MBB563 handbook, halfpage 1.5 I DD (mA) 2 5V IDD(idle) (mA) 1.0 16 MHz 10 MHz 1 3V 0.5 3.58 MHz 0 0.1 0 1 10 f xtal (MHz) 100 1 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Supply current based on optimal oscillator selection. Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal). Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD). 1998 Apr 20 8 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A MBB564 - 1 MBC954 handbook, halfpage 1.5 handbook, halfpage 3 IDD(idle) (mA) 1.0 5V IDD(stp) (A) 2 85 C 0.5 3V 1 25 C o o 0 0.1 0 1 10 f xtal (MHz) 100 1 3 5 V DD (V) 7 Supply current based on optimal oscillator selection. Fig.8 Fig.7 Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal). Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD). MBB565 16 I OL (mA) 12 handbook, halfpage 60 MBB566 IOL1 (mA) 40 8 20 4 1 3 5 V DD (V) 7 0 1 3 5 VDD (V) 7 VO = 0.4 V. VO = 1.2 V. Fig.9 Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD). Fig.10 Typical LOW level output sink current for Port 1 (IOL1) as a function of operating supply voltage (VDD). 1998 Apr 20 9 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A handbook, halfpage 16 MBB567 300 I OH (A) 200 MBC960 IOL2 (mA) 12 VO = VSS 8 100 VO = 0.7 V DD 4 1 3 5 VDD (V) 7 0 1 3 5 V DD (V) 7 Fig.11 Typical LOW level output sink current for SDA/P2.3 or SCLK (IOL2) as a function of operating supply voltage (VDD). Fig.12 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD). handbook, halfpage 12 MBC961 handbook, halfpage 6 MBC962 I OH1 (mA) 8 gm (mS) 4 g mH 4 2 g mM g mL 0 1 3 5 V DD (V) 7 0 1 3 5 V DD (V) 7 VOL = VDD - 0.4 V. Fig.13 Typical HIGH level push-pull output source current (IOH1) as a function of operating supply voltage (VDD). Fig.14 Typical transconductance values (gm) as a function of operating supply voltage (VDD) for the options gmL, gmM and gmH. 1998 Apr 20 10 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A 12 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL tr tf fxtal Table 2 PARAMETER rise time all outputs fall time all outputs clock frequency I2C-bus timing (see Figs 15 and 16) PARAMETER INPUT (see Fig.14) OUTPUT (see Fig.15; note 1) CONDITIONS VDD = 5 V; Tamb = 25 C; CL = 50 pF VDD = 5 V; Tamb = 25 C; CL = 50 pF see Fig.3 MIN. - - 1 TYP. 30 30 - MAX. - - 16 UNIT ns ns MHz SYMBOL SCLK tHD;STA tLOW tHIGH tRC tFC SDA tBUF tSU;DAT tHD;DAT tRD tFD tSU;STO START condition hold time 14 -------f xtal 17 -------f xtal 17 -------f xtal 1 s 0.3 s DF + 9 ----------------2 x f xtal DF - 3 ----------------2 x f xtal DF + 3 ----------------2 x f xtal ; note 2 SCLK LOW time SCLK HIGH time ; note 2 SCLK rise time SCLK fall time 1 s; note 3 0.1 s; note 4 4.7 s; note 5 bus free time 14 -------f xtal 250 ns 0 1 s 0.3 s 14 -------f xtal data set-up time 15 -------f xtal ; note 6 data hold time 9 -------f xtal 1 s; note 3 0.1 s; note 4 DF - 3 ----------------2 x f xtal SDA/P2.3 rise time SDA/P2.3 fall time STOP condition set-up time Notes 1. DF stands for Division Factor: the divisor of fxtal (see the "PCF84CxxxA family" data sheet). 3 ( DF + 1 ) DF - 3 2. Values given for ASC = 0; for ASC = 1: tHIGH = ---------------------------- ; tLOW = ----------------4 x f xtal 4 x f xtal 3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor. 4. At maximum allowed I2C-bus capacitance Cb = 400 pF. 5. Determined by program. t LOW - 9 24 6. If tLOW < -------- , tSU:DAT -------------------- , independent of ASC. f xtal f xtal 1998 Apr 20 11 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A SCLK 0.7 V DD 0.3 VDD t HIGH t LOW SDA/P2.3 0.7 V DD 0.3 VDD t BUF t HD;STA t RD t RC t HD;DAT t SU;DAT t FC t FD t SU;STO MBB568 Fig.15 Slave SCLK receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs). t LOW 0.9 VDD VOLmax t HIGH t FC t FD SCLK SDA/P2.3 0.9 V DD acknowledge bit t HD;STA V OLmax t HD;DAT t SU;DAT t HD;DAT t HD;DAT t SU;STO MBB569 t SU;DAT Fig.16 Master SCLK and transmitter SDA/P2,3 timing (SCLK and SDA/P2.3 are outputs). 1998 Apr 20 12 Philips Semiconductors Product specification Telecom microcontroller 13 PACKAGE OUTLINES handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth PCF84C81A SOT117-1 seating plane D ME A2 A L A1 c Z e b1 b 28 15 MH wM (e 1) pin 1 index E 1 14 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 1998 Apr 20 13 Philips Semiconductors Product specification Telecom microcontroller PCF84C81A SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE vMA Z 28 15 Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1998 Apr 20 14 Philips Semiconductors Product specification Telecom microcontroller 14 SOLDERING 14.1 Introduction PCF84C81A Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 14.3.2 WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 14.2 14.2.1 DIP SOLDERING BY DIPPING OR BY WAVE Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.3.3 REPAIRING SOLDERED JOINTS The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.2.2 REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 14.3 14.3.1 SO REFLOW SOLDERING Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Apr 20 15 Philips Semiconductors Product specification Telecom microcontroller 15 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values PCF84C81A This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1998 Apr 20 16 Philips Semiconductors Product specification Telecom microcontroller NOTES PCF84C81A 1998 Apr 20 17 Philips Semiconductors Product specification Telecom microcontroller NOTES PCF84C81A 1998 Apr 20 18 Philips Semiconductors Product specification Telecom microcontroller NOTES PCF84C81A 1998 Apr 20 19 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996 Internet: http://www.semiconductors.philips.com SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 455102/00/04/pp20 Date of release: 1998 Apr 20 Document order number: 9397 750 03728 |
Price & Availability of PCF84C81
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |