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Data Book
AU9362
USB Multiple Slots Flash Memory Card Reader Technical Reference Manual
Product Specification Official Release Revision 1.03 Public
Jun 2004
Data sheet status
Objective specification Preliminary specification Product specification This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Revision History
Date Aug 2003 Oct 2003 May 2004 Jun 2004 Revision 1.00/A21 1.01/A23,D23 1.02/A23,D23 1.03/A23,D23 Add 5
th
Description slot support for xD. Add additional configuration to support 2-slots version. Update 5.2 "Sample Schematics" Update 5.2 "Sample Schematics"
Page 2 of 26 AU9362 USB Multiple Slots Flash Memory Card Reader V1.03
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Copyright Notice Copyright 1997 - 2004 Alcor Micro Corp. All Rights Reserved. Trademark Acknowledgements The company and product names mentioned in this document may be the trademarks or registered trademarks of their manufacturers. Disclaimer Alcor Micro Corp. reserves the right to change this product without prior notice. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without prior notice
Contact Information: Web site: http://www.alcormicro.com/ Product URL: http://www.alcormicro.com/product_AU9362.htm Taiwan Alcor Micro Corp. 4F, No 200 Kang Chien Rd., Nei Hu, Taipei, Taiwan, R.O.C. Phone: 886-2-8751-1984 Fax: 886-2-2659-7723 Santa Clara Office 2901 Tasman Drive, Suite 206 Santa Clara, CA 95054 USA Phone: (408) 845-9300 Fax: (408) 845-9086 Los Angeles Office 9400 Seventh St., Bldg. A2 Rancho Cucamonga, CA 91730 USA Phone: (909) 483-9900 Fax: (909) 944-0464
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Table of Contents
1 Introduction....................................................................... 1.1 Description......................................................................................... 1.2 Features.............................................................................................. 2 Application Block Diagram................................................. 4 Pin Assignment.................................................................. 6 6 6 7 9
3 Operation Mode Selection................................................................. 8 5 System Architecture and Reference Design....................... 12 5.1 AU9362 Block Diagram................................................................... 12 5.2 Sample Schematics.......................................................................... 13 6 Electrical Characteristics................................................... 15 6.1 Absolute Maximum Ratings............................................................. 15 6.2 Recommended Operating Conditions........................................... 15 6.3 General DC Characteristics............................................................ 15 6.4 DC Electrical Characteristics for 5 volts operation.................... 16 6.5 Crystal Oscillator Circuit Setup for Characterization................ 16 6.6 USB Transceiver Characteristics.................................................... 17 6.7 ESD Test Results................................................................................ 21 6.8 Latch-Up Test Results....................................................................... 22 7 Mechanical Information...................................................... 24 8 Abbreviations...................................................................... 25
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List of Figures
2.1 Block Diagram............................................................................................... 4.1 Pin Assignment Diagram............................................................................. 7 9
5.1 AU9362 Block Diagram................................................................................. 12 6.1 Crystal Oscillator Circuit Setup for Characterization Diagram........... 16 6.2 Electrical Characteristics Diagram............................................................ 20 6.3 Latch-Up Test Results Diagram................................................................. 22 7.1 Mechanical Information Diagram.............................................................. 24
List of Tables
3.1 4.1 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7.1 Mode Table................................................................................................ 8 Pin Descriptions........................................................................................ 10 Absolute Maximum Ratings................................................................... 15 Recommended Operating Conditions.................................................. 15 General DC Characteristics.................................................................... 15 DC Electrical Characteristics for 5 Volts operation........................... 16 Recommended Operation Conditions.................................................. 17 Absolute Maximum Ratings .................................................................. 17 DC Electrical Characteristics................................................................. 18 AC Electrical Characteristics.................................................................. 19 ESD Data.................................................................................................... 21 Mechanical Information Table............................................................... 24
6.10 Latch-Up Data Table................................................................................. 23
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1.0 Introduction
1.1 Description
The AU9362 is a single chip USB flash memory reader controller which supports the widely used flash memory cards such as Compact Flash (CF) card, Micro Drive (MD), Smart Media Card (SMC), XD Picture Card, Memory Stick (MS), Memory Stick Duo, Memory Stick PRO, Secure Digital (SD) and Multimedia Card (MMC). It can be used as removable storage disks in enormous data exchange applications between PC and PC or PC and various consumer electronic appliances. The AU9362 reads digital contents saved on memory card that user captured with consumer electronic devices such as digital cameras, MP3 players, PDAs and mobile phones... etc. In addition, AU9362 allows user to transfer information such as data, graphics, texts or digital images from one electronic device to another quickly and easily. With AU9362, users' experience will be further enhanced by the Plug-and-Play nature built into latest operation systems such as Windows 2000/XP and Mac OS X.
1.2 Features
Support USB v1.1 specification and USB Device Class Definition for Mass Storage, Bulk-Transport v1.0 Support Compact Flash (CF) v1.4 Specification Support Secure Digital (SD) v1.0 Specification. Support Memory Stick (MS) v1.3 Specification. Support Memory Stick PRO v1.0 Specification. Support Memory Stick ROM Format v1.0 Specification. Support Smart Media Card (SMC) Standard 2000 Specification. Support xD-Picture Card Format V1.0 Specification Support IBM Microdrive device. Work with default driver from Windows ME, Windows XP, Mac OS 9, and Mac OS X. Windows 98, Windows 2000 are supported by vendor driver from Alcor. Ping-pong FIFO implementation for concurrent bus operation Support multiple sectors transfer to 4GB to optimize performance Support optional external EEPROM for USB VID, PID and string customization Support multiple slot concurrent operation. Integrated power switch and power management circuit for each slot to meet USB 500uA power consumption during suspend with card in the slot. Runs at 12MHz, built-in 48 MHz PLL Built-in 3.3V regulator 64-pin LQFP package
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2.0 Application Block Diagram
Following is the application diagram of a typical flash memory card reader using AU9362. By connecting the reader to a PC through USB bus, the AU9362 is acting as a bridge between the flash memory card from digital camera, MP3 player, PDA or mobile phone and PC. Figure 2.1 Block Diagram
Digital Camera
MP3 Player
PC with USB Host Controller
PDA
USB 9-in-1 Flash Memory Card Reader
CF/MS/MD/ SMC/SD/MMC Moble Phones
PC
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3.0 Operating Mode Selection
The AU9362 offers two operating modes. Mode 0 is used for SD/SMC/MS combo socket. While mode 1 is designed for single function socket. Mode 1 support xD card in a shared SMC socket.
Table 3.1 Mode Table
Mode 0 (2SLOTSEL : 0) Slot 1 CF Slot 1 Slot 2 Slot 2 SD/SMC/MS Slot 3 Slot 4
Mode 1 (2SLOTSEL : 1) SD CF SMC/XD MS
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4.0 Pin Assignment
The AU9362 is packed in 64-LQFP-form factor. The following figure shows signal name for each pin and the table in the following page describes each pin in detail.
Figure 4.1 Pin Assignment Diagram
SDDATA EEPDATA
49 48 47 46 45 44 43
MSDATA
MSCLK
XDCDN
SDCMD
51
VCCMS
SDCDN
64
63
62
61
60
59
VCCK
58
57
56
55
54
53
52
SMCEN
50
GNDK
MSBS
SDWP
SDCLK
GPON7
MSINS
VCCA GNDA XTAL1 XTAL2 VCC2CARD VCC5V VCC3V GNDIO USB_DM USB_DP SMWRN SMALE SMCLE SMRDN SMRBN SMDATA0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 28 30 31 32
EEPCLK SMWPN SMCDN XDCEN CFRDN CFAD0 CFAD1 CFAD2 CFAD3 CFAD9 CFWTN CFOEN CFWEN CFW RN CFCDN CFD7
Alcor Micro AU9362 64-PIN LQFP
42 41 40 39 38 37 36 35 34 33
CFD1
SMDATA5
SMDATA6
2SLOTSEL
SMDATA2
SMDATA1
CFD2
CFD3
CFD4
CFD5
CFD6
XDWPN
AU9362 USB Multiple Slots Flash Memory Card Reader V1.03
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SMDATA4
SMDATA3
CFD0
SMDATA7
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Table 4-1. Pin Descriptions
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Pin Name VCCA GNDA XTAL1 XTAL2 VCC2CARD VCC5V VCC3V GNDIO USB_DM USB_DP SMWRN SMALE SMCLE SMRDN SMRBN SMDATA0 SMDATA4 SMDATA5 SMDATA6 2SLOTSEL SMDATA7 SMDATA3 SMDATA2 XDWPN SMDATA1 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6 CFD7 CFCDN CFWRN CFWEN CFOEN CFWTN CFAD9 CFAD3 CFAD2 CFAD1 CFAD0 CFRDN XDCEN SMCDN SMWPN EEPCLK EEPDATA SMCEN I/O Type PWR PWR I O O PWR PWR PWR I/O I/O O O O O I I/O I/O I/O I/O I I/O I/O I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I O O O I O O O O O O O I I O I/O O Analog 3.3V input. Ground. Analog ground. Crystal Oscillator Input (12MHz). Crystal Oscillator Output (12MHz). Connect to Card Power. 5V power supply from USB connector. Internally regulated 3.3V power supply output. Ground :I/O USB DM. USB DP. SMC Write Enable.(0: write enable, 1: write disable.) SMC Address Latch Enable. (0: ALE closed, 1: ALE open.) SMC Command Latch Enable. (0: CLE closed, 1: CLE open.) SMC Read Enable. (0: read enable, 1: read disable.) SMC Ready/Busy. (0: busy, 1: ready.) SMC Data0. SMC Data4. SMC Data5. SMC Data6. Mode Selection. (0: 2 slots mode, 1: 4 slots mode.) SMC Data7. SMC Data3. SMC Data2. XD Write protect (0: protect, 1: not protect.) SMC Data1. CF Card Data0. CF Card Data1. CF Card Data2. CF Card Data3 CF Card Data4. CF Card Data5. CF Card Data6. CF Card Data7. CF Card Detect. Internal pull-up pad. CF Card IOWRN. CF Card WE. CF Card OE. CF Card WAIT. CF Card Addr9. CF Card Addr3. CF Card Addr2. CF Card Addr1. CF Card Addr0. CF Card IORD. XD Card Enable. (0: enable, 1: disable.) SMC Card Detect. Internal pull-up pad. SMC Write Protect. (0: protected, 1: not protected.) EEPROM Serial Clock. EEPROM Serial Data. SMC Enable. (0: disable, 1: enable.) Page 10 of 26 AU9362 USB Multiple Slots Flash Memory Card Reader V1.03 Description
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51 52 53 54 55 56 57 58 59 60 61 62 63 64
SDCMD SDCLK SDDATA SDCDN SDWP GPON7 XDCDN VCCK GNDK VCCMS MSINS MSBS MSCLK MSDATA
I/O O I/O I I I/O I PWR PWR PWR I O O I/O
SD CMD. SD CLK. SD Data. SD Card Detect. Internal pull-up pad. SD Write Protect. General Purpose Out, used as activity LED. XD Card Detect. Internal pull-up pad. Core 3.3V Input. Ground. MS 3.3V Input. MS Card INS. Internal pull-up pad. MS Card BS. MS Card SCLK. MS Card DATA.
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5.0 System Architecture and Reference Design
5.1 AU9362 Block Diagram
Figure 5.1 AU9362 Block Diagram
USB Upstream Port
USB
XCVR
SIE
RAM
CF/CFII/SMC /MS/MS PRO/MMC/S D/FM/xD Control FIFO
Processor
ROM
Arbitrator
EEPROM Control
CF MD SMC MS MS PRO MS Duo SD MMC Flash Memory(FM) Other
3.3 Card Power
3.3V Voltage Regulator /Power Switch
12MHz XTAL
EEPROM
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5.2 Sample Schematics
VCC3.3 FB C2 0.1UF FB F2 F1 C3 0.1UF GNDA C4 18PF 1M VCCA C1 18PF R1 Y1 12MHZ XTAL2 MSDATA MSCLK MSBS MSINS VCCK GNDK VCCK XDCDN GPON7 SDWP SDCDN SDDATA SDCLK SDCMD SMCEN EEPDATA U1 MSDATA MSCLK MSBS MSINS VCCMS GNDK VCCK XDCDN GPON7 SDWP SDCDN SDDATA SDCLK SDCMD SMCEN EEPDATA VCCA GNDA XTAL1 XTAL2 VCC5V 1.5K 1 2 3 4 5 R4 R5 39 39 SMWRN SMALE SMCLE SMRDN SMRBN SMDATA0 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 XTAL1
VCC2CARD C5 0.1UF VCC3.3 VCC FB C8 J1 VCC DATADATA+ GND FGND1 0.1UF F4 C9 1UF 10UF 0.1UF FB R2 C6 F3 C7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VCCA GNDA XTAL1 XTAL2 VCC2CARD VCC5V VCC3V GNDIO USB_DM USB_DP SMWRN SMALE SMCLE SMRDN SMRBN SMDATA0 SMDATA4 SMDATA5 SMDATA6 2SLOTSEL SMDATA7 SMDATA3 SMDATA2 XDWPN SMDATA1 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6
EEPCLK SMWPN SMCDN XDCEN CFRDN CFAD0 CFAD1 CFAD2 CFAD3 CFAD9 CFWTN CFOEN CFWEN CFWRN CFCDN CFD7
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
EEPCLK SMWPN SMCDN XDCEN CFRDN CFAD0 CFAD1 CFAD2 CFAD3 CFAD9 CFWTN CFOEN CFWEN CFWRN CFCDN CFD7
CFPWR
R3 100K
VCC5V C10 0.1UF
FB C11 0.1UF FB
F5
AU9362 VCCK C12
SMDATA4 SMDATA5 SMDATA6 2SLOTSEL SMDATA7 SMDATA3 SMDATA2
F6
0.1UF GNDK
Mode 0 (2SLOTSEL : 0)
VCC3.3 1 2SLOTSEL SW1 2 3
Mode 1 (2SLOTSEL : 1) Slot 1 SD CF SM/XD MS
Slot 1
CF
Slot 2 Slot 3 Slot 4
Slot 2
SD/SMC/MS
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
SMDATA1 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6 VCC3.3 Size A4 Date: Document Number
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VCC
VCC3.3
Rev
AU9362 card reader demostration schematics
Thursday, June 24, 2004 Sheet 1 of 3
2.51
CFPWR SMPWR JP1 1 2 3 4 5 06 07 08 09 10 11 GND CLE ALE -WE -WP D0 D1 D2 D3 GND GND -CD VCC D4 D5 D6 D7 LVD GND R/-B -RE -CE VCC GND 12 13 14 15 16 17 18 19 20 21 22 R6 C14 SMC CONNECTOR 0.1UF R7 SMPWR R8 47K C17 0.1UF 10K CFD4 CFD6 CFOEN SMDATA4 SMDATA5 SMDATA6 SMDATA7 SMRBN SMRDN SMCEN 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 J2 GND CFdata4 CFdata6 CE1N -OE CFaddr8 VCC CFaddr5 CFaddr3 CFaddr1 CFdata0 CFdata2 CDN CFdata11 CFdata13 CFdata15 VS1 IOWRN INTRQ CSEL RESET INDACK SPKR CFdata8 CFdata10 CFdata3 CFdata5 CFdata7 CFaddr10 CFaddr9 CFaddr7 CFaddr6 CFaddr4 CFaddr2 CFaddr0 CFdata1 IOIS16 CDN CFdata12 CFdata14 CE2N IORDN WEN VCC VS2 WAITN REGN STSCHG CFdata9 GND 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 CFD3 CFD5 CFD7 CFAD9
SMCLE SMALE SMWRN SMWPN SMDATA0 SMDATA1 SMDATA2 SMDATA3 SMCDN
CFAD3 CFAD1 CFD0 CFD2 CFCDN
CFAD2 CFAD0 CFD1
CFPWR CFRDN CFWEN CFWTN
VCC2CARD CFWRN
470K
CF CONNECTOR
XDPER JP2 MSPWR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC VCC D7 D6 D5 D4 D3 D2 D1 D0 GND -WP -WE ALE CLE -CE -RE R/-B GND -CD R9 R10 JP3 MSBS MSDATA MSINS MSCLK VSS BS RESERVED SDIO RESERVED INS RESERVED SCLK VCC VSS R12 10K MS SOCKET SDPWR 10K 10K SDCMD SDCDN SDCLK C19 SDDATA 0.1UF SDWP C21 SD SOCKET 18PF 100K JP4 9 1 2 SDCD 3 4 5 6 7 8 SDWP R11 SDPWR SDPWR
VCC2CARD
SMDATA7 SMDATA6 SMDATA5 SMDATA4 SMDATA3 SMDATA2 SMDATA1 SMDATA0 SMWRN SMALE SMCLE XDCEN SMRDN SMRBN XDCDN
C20 0.1UF
XD CONNECTOR
RESERVED
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
Size A4 Date:
Document Number
Rev
AU9362 card reader demostration schematics
Thursday, June 24, 2004 Sheet 2 of 3
2.51
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VCC
D2
1N4001 R13 VCC2CARD MOSFET P Q3 CFCDN R15 100K 9012 3 SMPWR Q5 9013 1 CFPWR R16 100K 2 Q2 100K SDPWR
Q1 MOSFET P R14 6.2 VCC2CARD
SDCDN Q4 MOSFET P VCC2CARD
SMCDN
Q6 MOSFET P MSPWR VCC3.3 D1 GPON7 R17 C22 0.1UF VCC3.3 R18 10K EEPCLK EEPDATA C24 0.1UF VCC3.3 U2 8 7 6 5 VCC WP SCL SDA A0 A1 A2 GND 1 2 3 4 XDPWR C23 0.1UF XDCDN Q7 MOSFET P VCC2CARD 100K MSIN VCC2CARD
24C02 or compatible
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
Size A4 Date:
Document Number
Rev
AU9362 card reader demostration schematics
Thursday, June 24, 2004 Sheet 3 of 3
2.51
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6.0
Electrical Characteristics
6.1 Absolute Maximum Ratings
Table 6.1 Absolute Maximum Ratings SYMBOL VCC VIN VOUT TSTG PARAMETER Power Supply Input Voltage Output Voltage Storage Temperature RATING -0.3 to 6.0 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -40 to 125 UNITS V V V
C
6.2 Recommended Operating Conditions
Table 6.2 Recommended Operating Conditions SYMBOL VCC VIN TOPR PARAMETER Power Supply Input Voltage Operating Temperature MIN 4.5 0 -5 TYP 5.0 MAX 5.5 VCC 85 UNITS V V
O
C
6.3 General DC Characteristics
Table 6.3 General DC Characteristics SYMBOL IIL IIH IOZ CIN COUT CBID PARAMETER Input low current Input high current Tri-state leakage current Input capacitance Output capacitance Bi-directional buffer capacitance CONDITIONS no pull-up or pull-down no pull-up or pull-down MIN -1 -1 -10 4 4 4 TYP MAX UNITS 1 1 10 A A A F F F
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6.4 DC Electrical Characteristics for 5 volts operation
( Under SYMBOL VIL VIL VIL VIL VIH VIH VIH VIH VOL VOH RI Table 6.4 DC Electrical Characteristics for 5 volts operation Recommended Operating Conditions and VCC=4.5v ~ 5.5v , Tj= -40OC to + 85OC ) PARAMETER CONDITIONS MIN TYP MAX UNITS Input Low Voltage Input Low Voltage Schmitt input Low Voltage Schmitt input Low V oltage Input High Voltage Input Hight Voltage Schmitt input High Voltage Schmitt input High Voltage Output low voltage Output high voltage Input Pull-up/down resistance TTL CMOS TTL CMOS TTL CMOS TTL CMOS IOL=2, 4, 8, 12, 16, 24 mA IOH=2, 4, 8, 12, 16, 24 mA Vil=0V or Vih=VCC 3.5 50 2.2 0.7*VCC 1.87 3.22 0.4 1.10 1.84 0.8 0.3*VCC V V V V V V V V V V K
6.5 Crystal Oscillator Circuit Setup for Characterization
The following setup was used to measure the open loop voltage gain for crystal oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.
Figure 6.1 Crystal Oscillator Circuit Setup for Characterization
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6.6 USB Transceiver Characteristics
RECOMMENDED OPERATING CONDITIONS Table 6.5 Recommended Operating Conditions SYMBOL VCC VI VI/O VO TAMB PARAMETER DC supply voltage DC input voltage range DC input range for I/Os DC output voltage range Operating ambient temperature range in free air See DC and AC characteristics for individual device CONDITIONS LIMITS MIN 3.0 0 0 0 0 MAX 3.6 5.5 VCC VCC 70 V V V V
UNIT
C
ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2) Table 6.6 Absolute Maximum Rating System In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v) SYMBOL PARAMETER CONDITIONS LIMITS MIN VCC IIK VI VI/O IOK VO IO IO ICC, IGND TSTO PTOT DC supply voltage DC input diode current DC input voltage DC input voltage range for I/Os DC output diode current DC output voltage DC output source sink current for VP/VM and RCV pins DC output source or sink current for D+/D- pins DC Vcc or GND current Storage temperature range Power dissipation per package -60 Vo> Vcc or Vo<0 Note 3 Vo=0 to Vcc Vo= 0 to Vcc -0.5 Vi<0 Note 3 -0.5 -0.5 -0.5 MAX +6.5 -50 +5.5 Vcc +0.5 +/-50 Vcc +0.5 +/-15 +/-50 +/-100 +150 V mA V V mA V mA mA mA
UNIT
C
mW
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The performance capability of a high performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150C. 3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.
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DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (Ground=0V). LIMITS -40C to +85C MIN TYP MAX 0.3 0.4 1.5 0.8 28 28 2.2 2.4 2.8 1.1 34 35 2.7 0.3 330 0.7 0.4 0.2 600 70 9 2 +/-0.1 +/-0.5 +/-10 14 43 43 0.5 2.0
Table 6.7 DC ELECTRICAL CHARACTERISTICS SYMBOL PARAMETER TEST CONDITIONS UNIT
VHYS VIH VIL RoH RoL VOH VOL IQ Isup IFS ILS ILeak IOFF
Hysteresis on inputs HIGH level input LOW level input Output impedance (HIGH state) Output impedance (LOW state) HIGH level output (Note 3) LOW level output (Note 3) Quiescent supply current Supply current in suspend Active supply current (Full Speed) Active supply current (Low Speed) Input leakage current 3-state output OFF-state current
Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Note 2 Note 2 Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.3V Vcc=3.3V Vcc=3.6V VI=5.5V or GND, not for I/O Pins Vi=Vih or ViL; Vo=Vcc or GND
V V V ohm ohm V V A A mA mA A A
NOTES: 1. All typical values are at Vcc=3.3V and Tamb=25C. 2. This value includes an external resistor of 24 ohm +/-1%. diagram for testing details. 3. All signals except D+ and D-.
See "Load D+ and D-"
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AC ELECTRICAL CHARACTERISTICS
Table 6.8 ACElectricalCharacteristics GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms LIMITS (TAMB) SYMBOL PARAMETER WAVEFORM 0 C to +25C MIN TYP MAX 0 0 4 4 9 9 12 12 20 20
0C to +70C MIN MAX 0 0 4 4 14 14 20 20
UNIT
tpLH tpHL trise tfall tRFM
VMO/VPO to D+/DFull Speed Rise and Fall Times Full Speed Rise and Fall Time Matching Full Speed VMO/VPO to D+/DLow Speed Rise and Fall Times Low Speed Rise and Fall Time Matching Low Speed D+/D- to RCV
1
ns
2
ns
90
110
90
110
%
tpLH tpHL trise tfall tRFM
1
120 120 75 75
300 300 300 200 75 75
300 300 300 200
ns
2
ns
70
130
70
130
%
tpLH tpHL tpLH tpHL tpHZ tpZH tpLZ tpZL tsu
3
9 9 4 4
16 16 8 8 12 12 10 10
16 16 8 8 12 12 10 10
ns
D+/D- to VP/VM
1
ns
OE# to D+/D- RL = 500ohm
4
ns
Setup for SPEED
5
0
ns
Vcr
Crossover point1
3
1.3
2.0
1.3
2.0
V
NOTES: 1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 50 pF capacitance.
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Figure 6.2 Electrical Characteristics Diagram
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6.7 ESD Test Results
Test Description: ESD Testing was performed on a Zapmaster system using the Human-Body-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and EIAJ IC-121 respectively Human-Body-Model stresses devices by sudden application of a high voltage supplied by a 100pF capacitor through 1.5k-ohm resistance. Machine-Model stresses devices by sudden application of a high voltage supplied by a 200pF capacitor through very low (0 ohm) resistance.
Test circuit & condition Zap Interval: 1 second Number of Zaps: 3 positive and 3 negative at room temperature Criteria: I-V Curve Tracing
Table 6.9 ESD Data Model HBM MM Mode Vdd, Vss, I/C Vdd, Vss, I/C S/S 15 15 Target 6000V 200V Results PASS PASS
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6.8 Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600 system which applies a stepped voltage to one pin per device with all other pins open except Vdd and Vss which were biased to 5Volts and ground respectively. Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for 0.5 seconds. If neither the PUT current supply nor the device current supply reached the predefined limit (DUT=00mA, Icc=100mA), then the voltage was increased by 0.1Volts and the pin was tested again. This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization committee.
Notes: 1. DUT: Device Under Test. 2. PUT: Pin Under Test.
Figure 6.3 Latch-Up Test Results Diagram
Test Circuit: Positive Input/Output Overvoltage/Overcurrent
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Test Circuit: Negative Input/Output Overvoltage/Overcurrent
Supply Overvoltage Test
Mode + + Current Vdd - Vxx Voltage
Table 6.10 Latch-Up Data Table Voltage (V)/Current (mA) S/S 11.0 5 11.0 5 200 5 200 5 9.0 5
Results Pass Pass Pass Pass Pass
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7.0 Mechanical Information
Figure 7.1 Mechanical Information Diagram
Table 7.1 Mechanical Information Table
body size D1 14 E1 14 lead count 100 A1 0.1 A2 1.4 L1 1 b 0.2 c 0.127 e 0.5
A1 A2 L1 b c e
stand-off body thickness lead length lead width lead thickness lead pitch
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8.0 Abbreviations
This chapter lists and defines terms and abbreviations used throughout this specification. SIE CF MD SMC MS SD MMC Serial Interface Engine Compact Flash Micro Drive SmartMedia Card Memory Stick Secure Digital Multimedia Card
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MEMO
About Alcor Micro, Corp Alcor Micro, Corp. designs, develops and markets highly integrated and advanced peripheral semiconductor, and software driver solutions for the personal computer and consumer electronics markets worldwide. We specialize in USB solutions and focus on emerging technology such as USB and IEEE 1394. The company offers a range of semiconductors including controllers for USB hub, integrated keyboard/USB hub and USB Flash memory card reader...etc. Alcor Micro, Corp. is based in Taipei, Taiwan, with sales offices in Taipei, Japan, Korea and California. Alcor Micro is distinguished by its ability to provide innovative solutions for spec-driven products. Innovations like single chip solutions for traditional multiple chip products and on-board voltage regulators enable the company to provide cost-efficiency solutions for the computer peripheral device OEM customers worldwide.
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