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HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9014 Issued Date : 1996.04.12 Revised Date : 2001.01.25 Page No. : 1/4 HI882 NPN EPITAXIAL PLANAR TRANSISTOR Description The HI882 is designed for using in output stage of 10 W audio amplifier, voltage regulator, DC-DC converter and relay driver. Absolute Maximum Ratings (Ta=25C) TO-251 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 10 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage....................................................................................... 40 V BVCEO Collector to Emitter Voltage.................................................................................... 30 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current (DC) ...................................................................................................... 3 A IC Collector Current (Pulse) .................................................................................................. 7 A IB Base Current (DC) ..................................................................................................... 600 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 0.3 1 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IC=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hFE1 Rank Range Q 100-200 P 160-320 E 250-500 HI882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE9014 Issued Date : 1996.04.12 Revised Date : 2001.01.25 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o 75 C o 25 C o Saturation Voltage (mV) 75 C 100 o hFE 100 25 C o hFE @ VCE=2V 10 1 10 100 1000 10000 10 1 125 C VCE(sat) @ IC=10IB o 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 1000 Saturation Voltage & Collector Current Saturation Voltage (mV) 75 C o Saturation Voltage (mV) 75 C o 100 125 C o 100 25 C o 125 C o 25 C o VCE(sat) @ IC=40IB 10 1 10 100 1000 10000 10 1 10 100 VCE(sat) @ IC=20IB 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 Capacitance & Reverse-Biased Voltage 100 Saturation Voltage (mV) 75 C 1000 25 C o o 125 C VBE(sat) @ IC=10IB 100 1 10 100 1000 10000 o Capacitance (pF) Cob 10 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) HI882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9014 Issued Date : 1996.04.12 Revised Date : 2001.01.25 Page No. : 3/4 Cutoff Frequency & Collector Current 1000 10000 PT=1ms PT=100ms Safe Operating Area Cutoff Frequency (MHz).. . Collector Current-IC (mA) 1000 PT=1s 100 VCE=5V 100 1 10 100 1000 10 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HI882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking: Spec. No. : HE9014 Issued Date : 1996.04.12 Revised Date : 2001.01.25 Page No. : 4/4 A B C D H 882 Date Code I Control Code F 3 I E K 2 1 G Style: Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code: I *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HI882 HSMC Product Specification |
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