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Hologram Unit
HUH7279
Hologram unit for CD-R/RW drivers
Unit: mm
For optical information processing (Recordable x 12 speed + readable x 32 speed) I Features
* Thin smaller package size is achieved through micro-mirror integration * Focus error signal detection: SSD method * Tracking error signal detection: 3-beam method * Fast response (fC = 65 MHz typ.) * Able to read and write CD-R/RW disks * Low-power semiconductor laser included * Built-in I-V conversion amp.
8 9 10 11 12 13 14
Molding gate size of HOE PKG center Apparent 2.0 max. emitting point
0.0 min.
8.8+0.15 -0.2
3.00.1(at the root)
P0.50.1(at the root)
1.350.2 2.0 max.
(2.0)
Hall make for No.1 pin on reverse side
0.0 min. 0.0 min.
5.480.2 (1.39) (0.71)
2.50.05 0.90.05 Thickness of HOE
3
0.7770.05 at the root
0.2 max.
3.760.3
5.10.4
Reference plane
(0.52)
0.05 max.
3.10.1 12.20.3
Apparent emitting point
(1.7)
I Applications
* CD-R/RW drives (write/read)
Note) 1. 2. 3. 4.
Standard corner R = 0.20 max. Thickness of plate: Ni 0.5 m min. + Pd 0.02 m min. Optical pass of HOE: Thickness = 2.5 mm, n = 1.519 Apparent emitting point in figure is designed without consideration of optical pass in HOE.
I Absolute Maximum Rating
Parameter Laser beam output
*1, 2
Symbol PO VR(LD) VCC VCC VC Topr Tstg
Rating 65 (CW), 110 (pulse) 1.5 6 +3.0 to +5.5 +1.5 to +2.1 -10 to +65 -40 to +85
Unit mW V V V V C C
Laser reverse voltage Supply voltage Operating supply voltage range Reference voltage Operating ambient temperature *2, 3 Storage temperature
Note) *1: Measured without HOE. *2: Relation between PO and Topr is defined in figure 2. Absolute maximum ratings of the PO under the pulse operation (pulse width = 0.5 s, duty 50%, without bias current) is PO = 110 mW, Topr = 60C. *3: Operating ambient temperature is defined under the condition of Rth 150C/W. (Rth: Thermal resistence of the LDHU which is set into the pickup)
0.250.05 Lead frame
1.750.2
0.2 max.
7 6 5 4 3 2 1 8.5+0
3.50.1
(0.3)
-0.05
3
1.90.1
Publication date: October 2001
SHH00005CED
1
HUH7279
LD(-) VCC
I Block Diagram
8
LD
LD(+)
7
9
6
FE1
18 k
E
10 100 k 18 k 11 100 k 18 k
5
FE2
F
4
FE3
G
12 100 k 18 k
3
FE4
H
13
100 k
14 1
2
VC
(Mon)
I Pin Descriptions
Pin No. 1 2 3 4 5 6 7 GND VC FE4 signal out FE3 signal out FE2 signal out FE1 signal out VCC Description Pin No. 8 9 10 11 12 13 14 LD(-) LD(+) E signal out F signal out G signal out H signal out Mon. out Description
I Electro-Optical Characteristics
* Unit characteristic specifications TC = 25C 3C, VCC = 5.0 V, VC = 2.5 V
Parameter Threshold current Operating current Operating voltage Oscillating wavelength Focus error signal amplitude Focus error signal offset Main beam signal level Main beam signal offset Sub beam signal level Sub beam signal offset Symbol Ith IOP VOP VFE BFE VTE BTE VTC BTC Conditions CW PO = 50 mW CW PO = 50 mW CW PO = 50 mW CW PO = 50 mW PLO = 0.8 mW PLO = 0.8 mW PLO = 0.8 mW PLO = 0.8 mW PLO = 0.8 mW PLO = 0.8 mW Min 10 65 1.6 779 195 -10 250 -15 120 -18 Typ 23 85 1.9 785 285 0 370 0 180 0 Max 35 105 2.5 791 375 +10 490 +15 240 +18 Unit mA mA V nm mV % mV % mV %
2
SHH00005CED
GND
Caution for Safety
I Gallium arsenide material (GaAs) is used in this product.
Therefore, do not burn, destroy, cut, crush, or chemically decompose the product, since gallium arsenide material in powder or vapor form is harmful to human health. Observe the relevant laws and regulations when disposing of the products. Do not mix them with ordinary industrial waste or household refuse when disposing of GaAs-containing products.
DANGER
I Do not touch or look at a laser beam directly.
It is in danger of a injury to eyesight or outer skin in the worst case.
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and afterunpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR

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