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Product specification File under Integrated
November 96
Circuits, ICO1
Philips Semiconductors
re
Philips Semiconductors
Product specification
Brushless
DC motor
drive
circuit
TDA5241
FEATURES .Full-wave .Built-in .Optimum .Built-in .Three -0.85 -built-in .Thermal .Low .Tacho ..Comparator .Built-in commutation start-up circuit independent on motor type or motor loading (using push/pull drivers at the output stages) without position sensors
commutation flyback push-pull A output current protection consumption diodes outputs: current limiter
current
by adaptative
base-drive
output without
extra sensor. position generator (PG) signal PG signal on one pin for easy use with a controlling
for external multiplexer
combining
internal
FG and external
microprocessor .Linear .PG control of the output stages
signal output.
APPLICATIONS .General purpose spindle driver ( e.g. VCR scanner motor).
GENERAL DESCRIPTION The TDA5241 is a bipolar integrated circuit used to drive brush less DC motors in full-wave mode. The device senses the rotor position using an EMF-sensing technique and is ideally suited as a drive circuit for VCR scanner motors.
QUICK ~
REFERENCE
DATA and temperature ranges
MIN.
Measured
over full voltage
SYMBOL
Yp IUM Yo
PARAMETER
supply
I cu!rent
TYP.
~ ~
MAX.
UNIT
v A V
voltage
limiting
range (note 1 }
4 0.6 0.85 0.93
I oU~Ut
voltage
at 10 = 100
mA(Upper+Lower
transistor)
Note 1. An unstabilized supply can be used; Transients of 2 V allowed with max slope 0.1 V/J.ls.
2/19
Philips Semiconductors
Product specification
Brushless
DC motor drive circuit
TDA5241
ORDERING INFORMATION
.
. Fig.1 Power derating curve .
March 1997
3/19
Philips Semiconductors
Product specification
8
Brushless DC motor drive circuit
TDA5241
BLOCK DIAGRAM
March 1997
4/19
Philips Semiconductors
Product
specification
Brushless DC motor drive circuit
TDA5241
PINNING
SYMBOL
GND1 n.c. MOT2 Vp PGIN
PIN 1 2 3 4
DESCRIPTION ground (0 V) motor supply return for output stages not connected driver output 2
Dositive suDDlv voltage
5
6 7 8 9 10 11 12 13 14 15 16 17 18
position generator: input from the position detector sensor to the position detector stage (optional) FG/PG (open collector) ground supply return for control circuits position generator output of the position detector stage external capacitor connection for commutation delay timing external capacitor connection for commutation delay timing copy external capacitor connection for start-up oscillator external capacitor connection for timing non-inverting input of the control amplifier input from the start point of the motor coils external capacitor for stability of control loop
FGPG GND2 PGOUT
8
CAP-CDM CAP-CDS CAP-ST CAP- TI CTLIN MOTO CAP-CPC MOT3 n.c. MOT1
driver output 3
I not connected
I driver
output
1
GND1
n.c .
18 u 17 16 15
10 I
MOT1
n.c
MOT2
Vp
MOT3
CAP-CPC MOTO CTLIN CAP- TI
PGIN
14
FGPG GND2 PGOUT
CAP-CDM
6 7
18 19
TDA5241
13 12
111
CAP-ST CAP-CDS
110
Fig.3 Pin configuration.
March
1997
5/19
Philips
Semiconductors
Product specification
Brushless
DC motor drive circuit
TDA5241
FUNCTIONAL DESCRIPTION The TDA5241 offers a sensorless three phase motor drive function. It is unique in its combination of sensorless motor drive and full-wave drive. The TDA5241 offers protected outputs capable of handling high currents and can be used with star or delta connected motors. It can easily be adapted for different motors and applications. The TDA5241 offers the following features: .Sensorless .Built-in .Optimum .Built-in .Three ..High .Outputs .Low commutation by using the motor EMF
start-up circuit commutation, independent of motor type or motor loading flyback diodes phase full-wave drive output current (0.85 A) protected by current limiting and thermal protection of each output transistor
current consumption by adaptive base-drive frequency generator (FG) by using the motor EMF for external position generator (PG) signal
.Accurate .Comparator .Built-in .Linear
multiplexer combining internal FG and external PG signals on one pin for easy use with a controlling control of the output stages.
microprocessor
LIMITING
VALUES with the Absolute Maximum Rating System (IEC 134).
MIN.
In accordance
SYMBOL
Vp VI
PARAMETER supply voltage
input voltage; all pins except Vp (VI < 8 V)
-0.3 GND -1
MAX. I 18 V p + 0.5 .5 Vp Vp + Vo 2.5 see power derating curve
UNIT
8
1
0
output voltage; PGOUT and PG/FG
output voltage; MOTO, MOT1, MOT2 and MOT3
Vo
VI Ptot
input voltage; CAP-ST, CAP- TI, CAP-CD and CAP-DC total power dissipation
v v v v v
~ Tamb
storage temperature range
I operating ambient temperature range
~ 1-10
+150 +70
loc ~
March
1997
6/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
CHARACTERISTICS
VP = 14.5 V "10%; Tamb = -10 C to 70 C, unless otherwise specified Symbol Supply VP IP Supply voltage range Input current range note 1 note 2 4 - - 5.3 18 7 V mA Parameter Conditions Min Typ Max Unit
Thermal protection TSD DT Local temperature at temperature sensor causing shut-down Reduction in temperature before switch-on after shut-down 130 - 140 TSD-30 150 - C C
MOT0 - CENTER TAP VI II VCSW DVCS VH Input voltage range Input bias current Comparator Switching Level Variations in comparator switching levels Comparator input hysteresis 0.5 VMOT1, MOT2 AND MOT3 VDO Voltage drop at 25 C (Vout upper stage + Vout lower stage) DVOL DVOH ILIM VDHF VDLF IDM CTL IN VCTLIN VCTLIN0 GTRAN Input voltage range Offset voltage Transfer gain See Fig. 6 VCAPCPC v 1.1 V CAP-CPC = 100 nF VCTLIN = 1.5V and VCTLIN = 3 V 0 0.7 4.5 - - 5 VP - 5.5 V V V/V Variation in voltage between lower transistors Variation in voltage between upper transistors Current limiting Diode forward voltage (DH) Diode forward voltage (DL) Peak diode current IO = 100 mA IO = 500 mA in control mode; IO = 100 mA in control mode; IO = -100 mA 12 V/6.8W notes 4 and 5; see Fig. 2; IO = -500 mA notes 4 and 5; see Fig. 2; IO = 500 mA note 5 - - - - 0.6 - -1.5 - 0.93 1.65 - - 0.85 - - - 1.05 1.9 150 150 1 1.5 - 1 mV mV A V V A V
PG IN VI IB RI VCSW +/-VIAMP Input voltage range Input bias current Input resistance Comparator switching level Comparator input hysteresis -0.3 - 5 86 - - - - 93 8 +5 650 30 107 - V nA kW mV mV
March 1997
7/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
PG OUT (open collector) VOL VOHmax tTHL Output voltage LOW Output voltage HIGH Transition time HIGH-to-LOW; CL = 50 pF; RL = 10 kW IO = 1.6 mA - - - - - 0.5 0.4 VP - V V ms
tPL
Pulse width LOW
4
-
10
ms
FG/PG (open collector) VOL VOHmax tTHL Output voltage LOW Maximum output voltage HIGH Transition time HIGH-to-LOW CL = 50 pF RL = 10 kW IO =1.6 mA - - - - - 0.5 0.4 VP - V V ms
Ratio of FG frequency and commutation frequency d tPL CAP-ST II IO VSWL VSWM VSWH CAP-TI II IOH IOL VSWL VSWM VSWH CAP-CDM II IO II/IO VIL VIH Output sink current Output source current Ratio of sink to source current Input voltage level LOW Input voltage level HIGH Output sink current Output source current HIGH Lower source current LOW Lower switching level Middle switching level Upper switching level Output sink current Output source current Lower switching level Middle switching level Upper switching level Duty factor Pulse width LOW after a PG IN pulse
- - 5
1:2 50 7
- - 15
- % ms
1.5 -2.5 - - -
2.0 -2.0 0.20 0.30 2.20
2.5 -1.5 - - -
mA mA V V V
22 -70 -6.0 - - -
30 -63 -5.3 50 0.30 2.20
38 -56 -4.6 - - -
mA mA mA mV V V
10.6 -5.3 1.85 780 2.3
16.2 -8.1 2.05 860 2.4
22 -11 2.25 940 2.55
mA mA
mV V
March 1997
8/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
Symbol CAP-CDS II IO II/IO VIL VIH CAP-CPC II IO
Parameter
Conditions
Min
Typ
Max
Unit mA mA
Output sink current Output source current Ratio of sink to source current Input voltage level LOW Input voltage level HIGH
10.1 -20.9 0.9 780 2.3
15.5 -15.5 1.025 860 2.4
20.9 -10.1 1.15 940 2.55
mV V
Output sink current Output source current
1 -100
- -
3 -30
mA mA
NOTES: 1. An unstabilized supply can be used; transients of 2 V allowed with max slope 0.1 V/s. 2. All other inputs at 0V; all outputs at VP and IO = 0 A. 3. Switching levels with respect to MOT1, MOT2 and MOT3. 4. Drivers are in high impedance OFF-state. 5. The outputs are short-circuit protected by limiting the current and the IC temperature.
Fig. 4 Switching levels
March 1997
9/19
Philips Semiconductors
Product
specification
8
Brushless
DC motor drive circuit
TDA5241
APPLICATION Introduction
INFORMATION
Figure 5 shows full-wave driving of a three phase motor requires three push-pull output stages. In each of the six possible states two outputs are active, one sourcing and one sinking current. The third output presents a high impedance to the motor which enables measurement of the motor EMF in the corresponding motor coil by the EMF comparator at each output. The commutation logic is responsible for control of the output transistors and selection of the correct EMF comparator. The zero-crossing in the motor EMF (detected by the comparator selected by the commutation logic) is used to calculate the correct moment for the next commutation, that is, the change to the next output state. The delay is calculated (depending on the motor loading) by the adaptive commutation delay block. Because of high inductive loading the output stages contain flyback diodes. The output stages are also protected by a current limiting circuit and by thermal protection of the six output transistors. 8 The zero-crossings can be used to provide speed information such as the tacho signal FG. A VCR scanner also requires a PG phase sensor. This circuit has an interface for a simple pick-up coil. A multiplexer circuit is also provided to combine the FG and PG signals in time. The TDA 5240 is providing 1 multiplexed FG PG signal: pin7 (8020) FG-PG 3 times the number of pole pairs. A PG output signal is generated; pulse width is typically 7 ~s. Table 1 OUTPUT STATES
MOT1 Z H H Z L L MOT2 L L Z H H Z MOT3 H Z L L Z H
STATE 1 2 3 4 5 6
8
In Table1
, the
sequence
of the
six possible
states
of the outputs
has
been
depicted
8
March 1997
10/19
Philips
Semiconductors
Product
specification
Brushless
DC motor drive circuit
TDA5241
.
.
Fig.5 Typical application of the TDA5241.
March 1997
11/19
Philips Semiconductors
Product specification
Brushless
DC motor drive circuit
TDA5241
Analog control of the motor output voltages is achieved by an internal operational amplifier which tranfer gain is internally fixed. Compensation of the motor pole is done by an external capacitor (CAP CPC). Both grounds GND1 and GND2 must be connected together. ADJUSTMENTS The system has been designed in such a way that the tolerances of the application components are not critical. However , the approximate values of the following components must still be determined: .The start capacitor; this determines the frequency of the start oscillator
.The two capacitors in the adaptive commutation delay circuit. These are important in determining the optimum moment for commutation, depending on the type and loading of the motor .The timing capacitor; this provides the system with its timing signals
(This deals with the application note AN94070) THE STARTCAPACITORS (CAP-ST) This capacitor determines the frequency of the start oscillator. It is charged and discharged, with a current of 2 ~A, from 0.05 to 2.2 V and back to 0.05 V. The time taken to complete one cycle is given by: tstart= (2.15 X C)s (with C in ~F)
The start oscillator is reset by a commutation pulse and so is only active when the system is in the start-up mode. A pulse from the start oscillator will cause the outputs to change to the next state (torque in the motor) .If the movement of the motor generates enough EMF the TDA5241 will run the motor. If the amount of EMF generated is insufficient, then the motor will move one step only and will oscillate in its new position. The amplitude of the oscillation must decrease sufficiently before the arrival of the next start pulse, to prevent the pulse arriving during the wrong phase of the oscillation. The oscillation of the motor is given by:
8
March 1997
12/19
Philips Semiconductors
Product
specification
Brushless
DC motor drive circuit
TDA5241
fosc
=
where: Kt = torque constant (A) pole-pairs (N.m/A)
I = current p = number
of magnetic
J = inertia J (kg/m2) Example: J = 72 x 10-6 kg/m2, K = 25 x 10-3 N.m/A, p = 6 and I = 0.5 A; this gives f osc = 5 Hz. If the damping 220 nF). is high
then a start frequency
of 2 Hz can be chosen
or t = 500 ms, thus C = 0.5/2 = 0.25 IlF, (choose
THE ADAPTIVECOMMUTATION DELAY(CAP-CDM AND CAP-CDS) In this circuit capacitor CAP-CDM is charged during one commutation period, with an interruption of the charging current during the diode pulse. During the next commutation period this capacitor (CAP-CDM) is discharged at twice the charging current. The charging current is 8.1 IlA and the discharging current 16.2 IlA ; the voltage range is from 0.9 to 2.2 V. The voltage must stay within this range at the lowest commutation frequency of interest, fc1:
c = 8.1 :rx1:3 -5
-~ -fC1
(C
in nF)
If the frequency 2.2 to 0.9 Vat
is lower, then a constant 16.2 J.lA.
commutation
delay after the zero-crossing
is generated
by the discharge
from
maximum delay = (0.076 x C) ms (witch C in nF) Example: nominal commutation frequency = 900 Hz and the lowest usable frequency = 400 Hz, so: CAP-CDM = 6231 400= 15.6 (choose 18 nF)
The other capacitor, CAP-CDS, is used to repeat the same delay by charging and discharging with 20 ~A. The same value can be chosen as for CAP-CDM. Figure 7 illustrates typical voltage waveforms
-Vmax=Vih
voltage on CAP-CD
-Vil
Fig.7
CAP-CD
and CAP-DC typical voltage waveforms in normal (ZCR = Zero-crossing ; COM = COMMUTATION)
running
mode.
8
March 1997
13/19
Philips
Semiconductors
Product specification
Brushless
DC motor drive circuit
TDA5241
THE TIMINGCAPACITOR (CAP- TI) Capacitor CAP- TI is used for timing the successive steps within one commutation period; these steps include some internal delays. The most important function is the watchdog time in which the motor EMF has to recover from a negative diode-pulse back to a positive EMF voltage (or vice versa). A watchdog timer is a guarding function that only becomes active when the expected event does not occur within a predetermined time. The EMF usually recovers within a short time if the motor is running normally ( ms ). However, if the motor is motionless or rotating in the reverse direction, then the time can be longer ( ms ). A watchdog time must be chosen so that it is long enough for a motor without EMF (still) and eddy currents that may stretch the voltage in a motor winding; however, it must be short enough to detect reverse rotation. If the watchdog time is made too long, then the motor may run in the wrong direction (with little torque). The capacitor is charged, with a current of 5711A, from 0.2 to 0.3 V. Above this level it is charged, with a current of 5 I1A, up to 2.2 V only if the selected motor EMF remains in the wrong polarity (watchdog function). At the end, or, if the motor voltage becomes positive, the capacitor is discharged with a current of 28 11 The watchdog time is the time taken to A. charge the capacitor, with a current of 5 I1A, from 0.3 to 2.2 V. The value of CAP- TI is given by:
= 2.63 tm (C in nF ; t in ms)
Example: If after switching off, the voltage from a motor winding is reduced, in 3.5 ms, to within 20 mV (the offset of the EMF comparator), then the value of the required timing capacitor is given by: C = 2.63 x 3.5 = 9.2 (choose 10 nF) Typical voltage waveforms are illustrated by Fig. 8.
voltage on CAP- TI
If the chosen possible
value of CAP- TI is too small, then oscillations direction
can occur in certain
positions
of a blocked
rotor. If the chosen
value
is too large, then it is
that the motor may run in the reverse
(synchronously
with little torque).
8
March 1997
Fig.8 Typical CAP- TI and VMOT1 voltage waveforms in normal running mode.
14/19
Philips Semiconductors
Product
specification
Brushless
DC motor drive circuit
TDA5241
OTHER DESIGN ASPECTS There are other design aspects concerning the application of the TDA5241 besides the commutation function. They are:
.Generation .Built-in .Reliability.
of the tacho signal FG interface for a PG sensor
FG SIGNAL The FG signal is generated in the TDA5241 by using the zero-crossing of the motor EMF from the three motor windings. Every zero-crossing in a (star connected) motor winding is used to toggle the FG output signal. The FG frequency is therefore half the commutation frequency. All transitions indicate the detection of a zero-crossing (except for PG). The negative-going edges are called FG pulses because they generate an interrupt in a controlling microprocessor. 8 The accuracy of the FG output signal Uitter) is very good. This accuracy depends on the symmetry of the motor's electromagnetic construction, which also effects the satisfactory functioning of the motor itself. Two FG frequencies are given out: 6 times the number of poles pairs or 3 times the number of poles pairs. A pull-up resistor must be connected to PGFG outputs Example: A three phase motor with 6 magnetic pole-pairs at 1500 rpm and with a full-wave drive has a commutation frequency of 25 x 6 x 6 = 900 Hz, and generates a tacho signal of 450 Hz. PG SIGNAL The accuracy of the PG signal in applications such as VCR must be high (phase information. This accuracy is obtained by combining the accurate FG signal with the PG signal by using a wide tolerance external PG sensor. The external PG signal (PGIN) is only used as an indicator to select a particular FG pulse. This pulse differs from the other FG pulses in that a ahort LOW-time of 15 /.ls after a HIGH to LOW transition. All other FG pulses have a 50% duty factor (see Fig. 9),
tolerance
on PC IN
PG IN
v!\v
v!\v
MOT3
PG / F G.S'-J~s-LJ~
Fig.9 Timing and the FG and PG IN signals.
March 1997
15/19
Philips
Semiconductors
Product
specification
Brushless
DC motor drive circuit
TDA5241
RELIABILITY It is necessary to protect high current circuits and the output stages are protected in two ways: .Current limiting of the 'lower' output transistors. The 'upper' output transistors use the same base current as the conducting 'lower' transistor (+15%). This means that the current to and from the output stages is limited. .Thermal protection of the six output transistors is achieved by each transistor having a thermal sensor that is active when the transistor is switched on. The transistors are switched off when the local temperature becomes too high.
March 1997
16/19
Philips
Semiconductors
Product
specification
Brushless
DC motor drive circuit
TDA5241
PACKAGE OUTLINE
8
MSA259
Dimensions in mm
Fig.10
PLASTIC
DUAL IN-LINE
PACKAGE;
18 LEADS;
SOT102RG4
March 1997
17/19
Philips
Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
SOLDERING Introduction There is no soldering method that is ideal for aIlIC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook"(order code 939865290011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: .A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. longitudinal axis of the package footprint must be parallel to the solder flow. package footprint must incorporate solder thieves at the downstream end.
.The .The
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to' 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
March
1997
18/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
Data sheet status
Data sheet status [1] Objective specification Preliminary specification Product specification Product status [2] Development Qualification Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Production
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 1996 All rights reserved. Printed in U.S.A. Date of release: 11-96
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Document order number:
9397 750 08755
Philips Semiconductors
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