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PD - 94027A HEXFET(R) POWER MOSFET THRU-HOLE (TO-257AA) IRF5Y9540CM 100V, P-CHANNEL Product Summary Part Number IRF5Y9540CM BVDSS -100V RDS(on) 0.117 ID -18A Fifth Generation HEXFET(R) power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. These devices are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits. TO-257AA Features: n n n n n n n Low RDS(on) Avalanche Energy Ratings Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed Light Weight Absolute Maximum Ratings Parameter ID @ VGS = -10V, TC = 25C ID @ VGS = -10V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight For footnotes refer to the last page -18 -11 -72 75 0.6 20 256 -11 7.5 4.4 -55 to 150 300 (0.063in./1.6mm from case for 10sec) 4.3 (Typical) Units A W W/C V mJ A mJ V/ns o C g www.irf.com 1 11/17/00 IRF5Y9540CM Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified) Parameter Min Typ Max Units -- -0.11 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 6.8 -- -- 0.117 -4.0 -- -25 -250 -100 100 109 19 53 29 135 87 84 -- V V/C V S( ) A Test Conditions VGS = 0V, ID = -250A Reference to 25C, ID = -1.0mA VGS = 10V, ID = -11A VDS = VGS, ID = -250A VDS = -50V, IDS = -11A VDS = -100V ,VGS=0V VDS = -80V, VGS = 0V, TJ =125C VGS = -20V VGS = 20V VGS =-10V, ID = -11A VDS = -80V VDD = -50V, ID = -11A, RG = 7.5 BVDSS Drain-to-Source Breakdown Voltage -100 BV DSS/T J Temperature Coefficient of Breakdown -- Voltage RDS(on) Static Drain-to-Source On-State -- Resistance VGS(th) Gate Threshold Voltage -2.0 gfs Forward Transconductance 5.3 IDSS Zero Gate Voltage Drain Current -- -- IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance -- -- -- -- -- -- -- -- -- -- nA nC ns nH Measured from drain lead (6mm/ 0.25in. from package) to source lead (6mm/0.25in. from package) VGS = 0V, VDS = -25V f = 1.0MHz Ciss C oss C rss Input Capacitance Output Capacitance Reverse Transfer Capacitance -- -- -- 1390 428 246 -- -- -- pF Source-Drain Diode Ratings and Characteristics Parameter IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Min Typ Max Units -- -- -- -- -- -- -- -- -- -- -18 -72 -1.6 220 1200 Test Conditions A V ns nC Tj = 25C, IS = -11A, VGS = 0V Tj = 25C, IF = -11A, di/dt 100A/s VDD -50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. Thermal Resistance Parameter RthJC Junction-to-Case Min Typ Max Units -- -- 1.67 C/W Test Conditions Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page 2 www.irf.com IRF5Y9540CM 100 -I D , Drain-to-Source Current (A) -I D , Drain-to-Source Current (A) 10 VGS -15V -10V -8.0V -7.0V -6.0V -5.5V -5.0V BOTTOM -4.5V TOP 100 10 VGS -15V -10V -8.0V -7.0V -6.0V -5.5V -5.0V BOTTOM -4.5V TOP -4.5V 1 1 -4.5V 0.1 0.1 20s PULSE WIDTH T = 25 C J 1 10 100 0.1 0.1 20s PULSE WIDTH T = 150 C J 1 10 100 -VDS , Drain-to-Source Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 TJ = 150 C 10 R DS(on) , Drain-to-Source On Resistance (Normalized) TJ = 25 C 2.5 ID = -18A -I D , Drain-to-Source Current (A) 2.0 1.5 1.0 1 0.5 0.1 4 6 8 15 V DS = -25V 20s PULSE WIDTH 10 12 14 0.0 -60 -40 -20 VGS = -10V 0 20 40 60 80 100 120 140 160 -VGS , Gate-to-Source Voltage (V) TJ , Junction Temperature( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature www.irf.com 3 IRF5Y9540CM 2500 2000 -VGS , Gate-to-Source Voltage (V) VGS = Ciss = Crss = Coss = 0V, f = 1MHz Cgs + Cgd , Cds SHORTED Cgd Cds + Cgd 20 ID = -11A 16 C, Capacitance (pF) VDS =-80V VDS =-50V VDS =-20V 1500 Ciss 12 1000 C oss C rss 8 500 4 0 1 10 100 0 0 20 40 FOR TEST CIRCUIT SEE FIGURE 13 80 100 60 120 -VDS , Drain-to-Source Voltage (V) QG , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 100 1000 OPERATION IN THIS AREA LIMITED BY R DS(on) -ISD , Reverse Drain Current (A) TJ = 150 C 10 TJ = 25 C 1 -I D , Drain-to-Source Current (A) 100 10 Tc = 25C Tj = 150C Single Pulse 1 1 10 100 1000 -VDS , Drain-toSource Voltage (V) 1ms 10ms 0.1 0.2 V GS = 0 V 0.8 1.4 2.0 2.6 -VSD ,Source-to-Drain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area 4 www.irf.com IRF5Y9540CM 20 V DS 16 RD VGS RG -ID , Drain Current (A) D.U.T. + 12 -10V 8 Pulse Width 1 s Duty Factor 0.1 % Fig 10a. Switching Time Test Circuit 4 td(on) tr t d(off) tf VGS 0 25 50 75 100 125 150 10% TC , Case Temperature ( C) 90% Fig 9. Maximum Drain Current Vs. Case Temperature VDS Fig 10b. Switching Time Waveforms 10 Thermal Response (Z thJC ) 1 D = 0.50 0.20 0.10 0.1 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) 0.0001 0.001 0.01 0.01 0.00001 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.1 1 PDM t1 t2 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com - V DD 5 IRF5Y9540CM 600 VDS EAS , Single Pulse Avalanche Energy (mJ) L 500 RG D .U .T IA S VD D A D R IV E R ID -5.0A -7.0A BOTTOM -11A TOP -20V -10V 400 tp 0.0 1 300 15V 200 100 Fig 12a. Unclamped Inductive Test Circuit IAS 0 25 50 75 100 125 150 Starting TJ , Junction Temperature( C) Fig 12c. Maximum Avalanche Energy Vs. Drain Current tp V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. 50K QG -12V 12V .2F .3F -10V QGS VG QGD VGS -3mA Charge IG ID Current Sampling Resistors Fig 13a. Basic Gate Charge Waveform Fig 13b. Gate Charge Test Circuit 6 www.irf.com + D.U.T. - VDS IRF5Y9540CM Footnotes: Repetitive Rating; Pulse width limited by maximum junction temperature. VDD = -25 V, Starting TJ = 25C, L= 4.2mH Peak IAS = -11A, RG= 25 ISD -11A, di/dt -350 A/s, Pulse width 400 s; Duty Cycle 2% VDD -100V, TJ 150C Case Outline and Dimensions -- TO-257AA IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 11/00 www.irf.com 7 |
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