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| CYStech Electronics Corp. NPN Epitaxial Planar Transistor Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 1/3 BTD5213M3 Features * High VCEO, VCEO=80V * High IC, IC(DC)=1A * Low VCE(sat) * Good current gain linearity * Complementary to BTB1260M3 Symbol BTD5213M3 Outline SOT-89 BBase CCollector EEmitter BCE Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Symbol VCBO VCEO VEBO IC ICP Pd Limit 100 80 5 1 2 (Note 1) 0.6 1 (Note 2) 2 (Note 3) 208 125 (Note 2) 62.5 (Note 3) 150 -55~+150 Unit V V V A A W W W C/W C/W C/W C C Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature RJA Tj Tstg Note : 1. Single Pulse Pw350s, Duty2%. 2. When mounted on FR-4 PCB with area measuring 10x10x1 mm 3. When mounted on ceramic with area measuring 40x40x1 mm BTD5213M3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. 100 80 5 82 Typ. 100 20 Max. 1 1 0.4 820 Unit V V V A A V MHz pF Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 2/3 Test Conditions IC=50A, IE=0 IC=1mA, IB=0 IE=50A, IC=0 VCB=80V. IE=0 VEB=4V,IC=0 IC=500mA, IB=20mA VCE=3V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width 380s, Duty Cycle2% Classification Of hFE Rank Range P 82~180 Q 120~270 R 180~390 S 270~560 T 390~820 BTD5213M3 CYStek Product Specification CYStech Electronics Corp. SOT-89 Dimension A Spec. No. : C310M3 Issued Date : 2003.06.27 Revised Date : Page No. : 3/3 Marking: 1 2 C 3 H DF B D Style: Pin 1. Base 2. Collector 3. Emitter E F G I 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 *: Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.01417 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD5213M3 CYStek Product Specification |
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