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Band Switching Diodes
MA27077
Silicon epitaxial planar type
Unit: mm
For band switching Features
* Low forward dynamic resistance rf * Less voltage dependence of diode capacitance CD * SSS-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package
0.27+0.05 -0.02 2
1.000.05 1.400.05
0.10+0.05 -0.02
1 0.600.05 5
0.15 min.
Parameter Reverse voltage Forward current Operating ambient temperature * Storage temperature
Symbol VR IF Topr Tstg
Rating 35 100 -25 to +85 -55 to +125
Unit
0 to 0.01
V mA C C
1: Anode 2: Cathode SSSMini2-F1 Package
Note) *: Maximum ambient temperature during operation.
Marking Symbol: C
Electrical Characteristics Ta = 25C 3C
Parameter Forward voltage Reverse current Diode capacitance Forward dynamic resistance
*
Symbol VF IR CD rf VR = 33 V
Conditions IF = 100 mA VR = 6 V, f = 1 MHz IF = 2 mA, f = 100 MHz
Min
Typ 0.92 0.01 0.9 0.65
Max 1.00 100.00 1.2 0.85
Unit V nA pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Absolute frequency of input and output is 100 MHz. 3. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER
0.15 max.
0.520.03
Absolute Maximum Ratings Ta = 25C
5
0.15 min.
Publication date: March 2004
SKG00001BED
1
MA27077
IF VF
120 25C 100
10
CD VR
f = 1 MHz Ta = 25C
CD Ta
1.020 f = 1 MHz
Diode capacitance CD (pF)
Forward current IF (mA)
1.014
VR = 6 V
CD (Ta) CD (Ta = 25C)
0 10 20 30
80 Ta = 60C -40C
1.008
60
1
1.002
40
20
10 -1
0.996
0
0.990 0 20 40 60 80 100
0
0.4
0.8
1.2
Forward voltage VF (V)
Reverse voltage VR (V)
Ambient temperature Ta (C)
IR T a
10 VR = 33 V
Reverse current IR (nA)
1
10 -1
0
40
80
120
Ambient temperature Ta (C)
2
SKG00001BED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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