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SPICE MODEL: MMSTA63 MMSTA64
Lead-free Green
MMSTA63/MMSTA64
PNP SURFACE MOUNT DARLINGTON TRANSISTOR
Features
* * * * * * *
Epitaxial Planar Die Construction Complementary NPN Types Available (MMSTA13/MMSTA14) Ultra-Small Surface Mount Package Ideal for Medium Power Amplification and Switching High Current Gain Lead Free/RoHS Compliant (Note 2) "Green" Device (Note 3 and 4)
B G H E BC A C
SOT-323 Dim A B C D E G
M
Min 0.25 1.15 2.00 0.30 1.20 1.80 0.0 0.90 0.25 0.10 0
Max 0.40 1.35 2.20 0.40 1.40 2.20 0.10 1.00 0.40 0.18 8
0.65 Nominal
Mechanical Data
* * * * * * * * * *
Case: SOT-323 Case Material: Molded Plastic, "Green" Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: See Diagram Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). MMSTA63 Marking K2E, K3E (See Page 3) MMSTA64 Marking K3E (see Page 3) Ordering & Date Code Information: See Page 3 Weight: 0.006 grams (approximate)
K
H J K L M
J
D
E
L
C
a
All Dimensions in mm
B
E
Maximum Ratings
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation (Note 1)
@ TA = 25C unless otherwise specified Symbol VCBO VCEO VEBO IC Pd RqJA Tj, TSTG Value -30 -30 -10 -500 200 625 -55 to +150 Unit V V V mA mW C/W C
Characteristic
Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage and Temperature Range
Note:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php 4. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30159 Rev. 8 - 2
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MMSTA63/MMSTA64
Electrical Characteristics
Characteristic OFF CHARACTERISTICS (Note 5) Collector-Emitter Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS (Note 5) DC Current Gain
@ TA = 25C unless otherwise specified Symbol V(BR)CEO ICBO IEBO MMSTA63 MMSTA64 MMSTA63 MMSTA64 Min -30 3/4 3/4 5,000 10,000 10,000 20,000 3/4 3/4 Max 3/4 -100 -100 Unit V nA nA Test Condition IC = -100mA VBE = 0V VCB = -30V, IE = 0 VEB = -10V, IC = 0 IC = -10mA, VCE = -5.0V IC = -10mA, VCE = -5.0V IC = -100mA, VCE = -5.0V IC = -100mA, VCE = -5.0V IC = -100mA, IB = -100mA IC = -100mA, VCE = -5.0V VCE = -5.0V, IC = -10mA, f = 100MHz
hFE VCE(SAT) VBE(SAT)
3/4 -1.5 -2.0
3/4 V V
Collector-Emitter Saturation Voltage Base- Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product
200
fT
125
1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40
3/4
MHz
IC = 1000 IB
150
VCE(SAT), COLLECTOR TO EMITTER SATURATION VOLTAGE (V)
PD, POWER DISSIPATION (mW)
TA = -50C
100
TA = 25C
50
TA = 150C
0 0 25 50 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE (C) Fig. 1, Max Power Dissipation vs Ambient Temperature
1
10
100
1000
IC, COLLECTOR CURRENT (mA) Fig. 2, Collector Emitter Saturation Voltage vs. Collector Current
10,000,000 VCE = 5V TA = 150C 1,000,000
VBE(ON), BASE EMITTER VOLTAGE (V)
1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4
VCE = 5V TA = -50C
hFE, DC CURRENT GAIN
100,000
TA = 25C TA = -50C
TA = 25C
TA = 150C
10,000
1,000
100 1 10 100 1000 IC, COLLECTOR CURRENT (mA) Fig. 3, DC Current Gain vs Collector Current
0.3 0.2 0.1 0.1
1
10
100
IC, COLLECTOR CURRENT (mA) Fig. 4, Base Emitter Voltage vs. Collector Current
DS30159 Rev. 8 - 2
2 of 4 www.diodes.com
MMSTA63/MMSTA64
1000
fT, GAIN BANDWIDTH PRODUCT (MHz)
VCE = 5V
100
10
1 1 10 IC, COLLECTOR CURRENT (mA) Fig. 5, Gain Bandwidth Product vs. Collector Current 100
Ordering Information
Device MMSTA63-7-F MMSTA64-7-F
Notes:
(Note 4 & 6) Packaging SOT-323 SOT-323 Shipping 3000/Tape & Reel 3000/Tape & Reel
4. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. Short duration test pulse used to minimize self-heating effect. 6. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KxE = Product Type Marking Code, e.g. K2E = MMSTA63 YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September
KxE
Date Code Key Year Code Month Code 1998 J Jan 1 1999 K Feb 2 2000 L 2001 M March 3 2002 N Apr 4 2003 P May 5 2004 R Jun 6 2005 S Jul 7 2006 T 2007 U Aug 8 2008 V Sep 9 2009 W Oct O 2010 X Nov N 2011 Y 2012 Z Dec D
DS30159 Rev. 8 - 2
YM
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MMSTA63/MMSTA64
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
DS30159 Rev. 8 - 2
4 of 4 www.diodes.com
MMSTA63/MMSTA64

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