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| REFLECTIVE OBJECT SENSOR QRE1113.GR PACKAGE DIMENSIONS 0.114 (2.90) 0.099 (2.50) 4 3 0.024 (0.60) 0.016 (0.40) 0.079 (2.0) 0.063 (1.60) 0.130 (3.30) 0.122 (3.10) 1 2 30 0.063 (1.60) 0.055 (1.40) 0.024 (0.61) NOM (4X) 0.193 (4.90) 0.177 (4.50) 0.043 (1.10) 0.035 (0.90) SCHEMATIC PIN 1 ANODE PIN 2 CATHODE PIN 3 COLLECTOR PIN 4 EMITTER NOTES: 1. Dimensions for all drawings are in inches (millimeters). 2. Tolerance of .010 (.25) on all non-nominal dimensions 1 2 3 4 FEATURES * * * * * Phototransistor output Tape and reel packaging No contact surface sensing Miniature package Lead form style: Gull Wing (c) 2002 Fairchild Semiconductor Corporation Page 1 of 5 12/9/02 REFLECTIVE OBJECT SENSOR QRE1113.GR ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified) Parameter Operating Temperature Storage Temperature Soldering Temperature EMITTER Continuous Forward Current Reverse Voltage Peak Forward Current(5) Power Dissipation(1) SENSOR Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Power Dissipation(1) VCEO VECO IC PD 30 5 20 50 V V mA mW IF VR IFP PD 50 5 1 75 mA V mA mW (Iron)(2,3,4) Soldering Temperature (Flow)(2,3) Symbol TOPR TSTG TSOL-I TSOL-F Rating -25 to +85 -30 to +100 240 for 5 sec 260 for 10 sec Units C C C C ELECTRICAL / OPTICAL CHARACTERISTICS (TA = 25C unless otherwise specified) PARAMETER INPUT DIODE Forward Voltage Reverse Leakage Current Peak Emission Wavelength OUTPUT TRANSISTOR Collector-Emitter Dark Current COUPLED On-State Collector Current Saturation Voltage Rise Time Fall Time VCC = 5 V, IC(ON) = 100 A, RL = 1K IF = 20 mA, VCE = 5 V IC(ON) VCE (SAT) tr tf 0.15 -- -- -- 0.40 -- 20 20 -- 0.3 -- -- mA V s VCE = 20 V, IF = 0 mA ID -- -- 100 nA IF = 20 mA VR = 5 V IF = 20 mA VF IR PE -- -- -- 1.2 -- 940 1.6 10 -- V A nm TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNITS NOTES: 1. Derate power dissipation linearly 1.33 mW/C above 25C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16" (1.6mm) from housing. 5. Pulse conditions: tp = 100 s; T = 10 ms. (c) 2002 Fairchild Semiconductor Corporation Page 2 of 5 12/9/02 REFLECTIVE OBJECT SENSOR QRE1113.GR TYPICAL PERFORMANCE CURVES Fig. 1 Normalized Collector Current vs. Distance between device and reflector IC (ON)- NORMALIZED COLLECTOR CURRENT 1.0 1.0 IF = 10 mA VCE = 5 V TA = 25C Fig. 2 Collector Current vs. Forward Current 0.8 IC (ON) - COLLECTOR CURRENT (mA) 0.8 d0 0.6 0.6 0.4 Sensing Object: White Paper (90% reflective) 0.2 Mirror 0.4 0.2 0.0 0 1 2 3 4 5 0.0 0 4 8 12 16 20 d-DISTANCE (mm) IF - FORWARD CURRENT (mA) Fig. 3 Collector Current vs. Collector to Emitter Voltage ICEO - NORMALIZED DARK CURRENT 2.0 Fig. 4 Collector Emitter Dark Current (Normalized) vs. Ambient Temperature 102 Normalized to: VCE = 10 V TA = 25C 101 VCE = 10 V VCE = 5 V IC (ON) - COLLECTOR CURRENT (mA) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 d = 1 mm, 90% reflection TA = 25C IF = 25mA IF =20mA IF =15mA IF =10mA IF =5mA 100 10-1 0.2 0.0 0.1 1 10 10-2 25 40 55 70 85 VCE - COLLECTOR EMITTER VOLTAGE (V) TA - Ambient Temperature (C) (c) 2002 Fairchild Semiconductor Corporation Page 3 of 5 12/9/02 REFLECTIVE OBJECT SENSOR QRE1113.GR Fig. 5 Forward Current vs. Forward Voltage 50 100 TA = 25C 40 Fig. 6 Rise and Fall Time vs. Load Resistance VCC = 10 V tpw = 100 us T=1ms TA = 25C IC = 0.3 mA IF - FORWARD CURRENT (mA) RISE AND FALL TIME (us) tf tr 10 tf tr 30 20 IC = 1 mA 10 0 1.0 1.1 1.2 1.3 1.4 1.5 1 0.1 1 10 VF - FORWARD VOLTAGE (V) RL - LOAD RESISTANCE (K) Fig. 7 Forward Voltage vs. Ambient Temperature 3.0 VF - FORWARD VOLTAGE (V) 2.5 2.0 IF = 50 mA IF = 20 mA 1.0 IF = 10 mA 1.5 0.5 0.0 -40 -20 0 20 40 60 80 TA - AMBIENT TEMPERATURE (C) (c) 2002 Fairchild Semiconductor Corporation Page 4 of 5 12/9/02 REFLECTIVE OBJECT SENSOR QRE1113.GR DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2002 Fairchild Semiconductor Corporation Page 5 of 5 12/9/02 |
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