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2SK3453 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOSV) 2SK3453 Switching Regulator Applications * * * * Low drain-source ON resistance: RDS (ON) = 0.72 (typ.) High forward transfer admittance: |Yfs| = 7.0 S (typ.) Low leakage current: IDSS = 100 A (max) (VDS = 700 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Unit: mm Absolute Maximum Ratings (Ta = 25C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC Pulse (Note 1) (Note 1) Symbol VDSS VDGR VGSS ID IDP PD EAR IAR EAR Tch Tstg Rating 700 700 30 10 30 80 420 10 8 150 -55~150 Unit V V V A W mJ A mJ C C Drain power dissipation (Tc = 25C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range JEDEC JEITA TOSHIBA 2-16F1B Weight: 5.8 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, channel to case Thermal resistance, channel to ambient Symbol Rth (ch-c) Rth (ch-a) Max 1.56 41.6 Unit C/W C/W Note 1: Ensure that the channel temperature does not exceed 150C. Note 2: VDD = 90 V, Tch = 25C (initial), L = 7.5 mH, RG = 25 , IAR = 10 A Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2006-11-08 2SK3453 Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain-source breakdown voltage Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS V (BR) GSS IDSS V (BR) DSS Vth RDS (ON) Yfs Ciss Crss Coss tr ID = 5 A VDS = 25 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 25 V, VDS = 0 V IG = 10 A, VDS = 0 V VDS = 700 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 5 A VDS = 10 V, ID = 5 A Min 30 700 2.0 4.0 Typ. 0.72 7.0 1700 40 200 40 Max 10 100 4.0 1.0 pF Unit A V A V V S 10 V VGS 0V 4.7 RL = 40 VDD 200 V - VOUT ns Turn-ON time Switching time Fall time ton 72 tf Duty < 1%, tw = 10 s = 42 nC Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("miller") charge toff Qg Qgs Qgd VDD 400 V, VGS = 10 V, ID = 10 A - 145 53 25 28 Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current Forward voltage (diode) Reverse recovery time Reverse recovery charge (Note 1) Symbol IDR IDRP VDSF trr Qrr Test Condition IDR = 10 A, VGS = 0 V IDR = 10 A, VGS = 0 V, dIDR/dt = 100 A/s Min Typ. 1400 17.5 Max 10 30 -1.9 Unit A A V ns C Marking TOSHIBA K3453 Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. 2 2006-11-08 2SK3453 ID - VDS 10 Common source Tc = 25C 8 Pulse test 10 8 6 5.2 16 20 10 ID - VDS Common source 8 6 Tc = 25C Pulse test 5.6 12 Drain current ID (A) 6 5 4.8 Drain current ID (A) 4 4.6 8 5.2 2 VGS = 4 V 0 0 4 4.6 VGS = 4 V 2 4 6 8 10 0 0 10 20 30 40 50 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID - VGS 20 Common source 16 VDS = 20 V Pulse test 25 12 20 VDS - VGS Common source VDS (V) Tc = 25C 16 Pulse test Drain current ID (A) Drain-source voltage 12 ID = 10 A 8 8 100 4 Tc = -55C 0 0 4 5 2.5 2 4 6 8 10 0 0 4 8 12 16 20 Gate-source voltage VGS (V) Gate-source voltage VGS (V) Yfs - ID 50 RDS (ON) - ID 50 30 Common source Tc = 25C Pulse test Forward transfer admittance Yfs (S) 30 Common source VDS = 20 V Pulse test 10 Tc = -55C 5 3 100 1 0.5 0.3 25 Drain-source ON resistance RDS (ON) () 10 5 3 VGS = 10, 15 V 1 0.5 0.3 0.1 0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.1 0.3 0.5 1 3 5 10 30 50 Drain current ID (A) Drain current ID (A) 3 2006-11-08 2SK3453 RDS (ON) - Tc () 10 Common source 8 Pulse test VGS = 10 V 100 50 Common source 30 Tc = 25C Pulse test 10 5 3 1 0.5 0.3 0.1 0.05 0.03 0.01 0 IDR - VDS Drain-source ON resistance RDS (ON) 6 4 ID = 10 A 5 Drain reverse current IDR (A) 10 3 1 2 2.5 VGS = 0, -1 V -0.6 -0.8 -1.0 -1.2 0 -80 -40 0 40 80 120 160 -0.2 -0.4 Case temperature Tc (C) Drain-source voltage VDS (V) Capacitance - VDS 5000 3000 5 Vth - Tc Common source VDS = 10 V ID = 1 mA Pulse test Vth (V) Gate threshold voltage Ciss 4 (pF) 1000 500 300 Coss 100 50 30 Common source VGS = 0 V f = 1 MHz Tc = 25C 0.3 0.5 1 3 5 10 Crss Capacitance C 3 2 1 10 0.1 30 50 100 0 -80 -40 0 40 80 120 160 Drain-source voltage VDS (V) Cace temperature Tc (C) PD - Tc 200 500 Dynamic input/output characteristics 20 Drain power dissipation PD (W) 160 VDS (V) 400 VDS 300 VDS = 100 V 16 200 400 Common source ID = 10 A Tc = 25C Pulse test 8 80 200 40 100 VGS 4 10 0 40 80 120 160 200 0 0 10 20 30 40 50 60 70 0 80 Case temperature Tc (C) Total gate charge Qg (nC) 4 2006-11-08 Gate-source voltage Drain-source voltage 120 12 VGS (V) 2SK3453 rth - tw 10 rth (t)/Rth (ch-c) 1 Duty = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 PDM Single pulse t T Duty = t/T Rth (ch-c) = 1.56C/W 0.001 10 100 1m 10 m 100 m 1 10 Normalized transient thermal impedance Pulse width tw (S) Safe operating area 100 500 EAS - Tch 30 Avalanche energy EAS (mJ) ID max (pulsed) * ID max (continuous) 1 ms * 100 s * 400 10 300 Drain current ID (A) 3 DC operation Tc = 25C 200 1 100 0.3 0 25 0.1 * 0.03 Single nonrepetitive pulse Tc = 25C Curves must be derated linearly with increase in temperature. 0.01 1 10 100 1000 50 75 100 125 150 Channel temperature (initial) Tch (C) 15 V -15 V BVDSS IAR VDD VDS Drain-source voltage VDS (V) Test circuit RG = 25 VDD = 90 V, L = 7.5 mH Wave form AS = 1 B VDSS L I2 B 2 VDSS - VDD 5 2006-11-08 2SK3453 RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2006-11-08 |
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