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| Combine Type Connector (for SD Memory Card, MultiMediaCardTM, Memory StickTM, xD-Picture CardTM) SCDE Series Push-in push-out eject mechanism applicable to four media types. For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module Structure Mounting type Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial Contact resistance Initial Connector contacts Detection switch 100m 500m Features Applicable to four memory card standards - SD Memory Card, MultiMediaCardTM, Memory StickTM and xD-Picture CardTM. Push-push ejection mechanism applied in both card types. Same insertion and ejection position applied for both cards. Applications For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players Typical Specifications Items Specifications SD Memory Card MultiMediaCardTM Applicable media Memory StickTM xD-Picture CardTM Surface mounting type Standard mount / Reverse mount Push-push type 10 to 60 500V AC 1minute SCDE1 , 250V AC 1minute SCDE2 1,000M min. max. SCDE2 max. SCDE2 Performance max. SCDE1 , 150m max. SCDE1 , 600m Insertion and removal cycle 10,000cycles SD Memory Card, xD-Picture CardTM 12,000cycles Memory StickTM Product Line Media ejection structure Mounting system Standard mount Push-push type Reverse mount 0 Tray SCDE2B0100 2 Stand-off mm Packing system Product No. SCDE1C0200 Drawing No. 1 40 Combine Type Connector(for SD Memory Card, MultiMediaCardTM, Memory StickTM, xD-Picure CardTM) SCDE Series Dimensions No. Style Unit:mm PC board mounting hole dimensions Viewed from the mounting face side 4.5 MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 SD No.4 SD No.5 SD No.6 SD No.7 SD No.8 48.1 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 SD No.3 SD No.2 SD No.1 SD No.9 33.25 29.7 13.95 13.025 10.475 10.475 8.65 19-1.1 27(P1.5 18) For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type CD switch (for SD) 21 (1.2)Over travel 16.7 14.9 o2 Locked position (5) (5.5) Eject position WP switch (for SD) xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 xD No.!3 xD No.!2 xD No.!1 xD No.!0 Ground xD No.1 xD No.0 (CD for xD) xD No.2 xD No.3 xD No.4 xD No.5 xD No.6 xD No.7 xD No.8 xD No.9 15(P1 19-0.6 9.2 9.3 10 6.65 7.5 8.35 15) Card center Connector center 31 27 Land No pattern area o1.5 6.25 15.5 Common (for SD) 19.375 17.175 16.05 14.55 4.95 3.15 0.9 1 27 1.55 1.4 13.7 o1.55 (hole) 28.75 26.6 25.5 (hole) For Compact FlashTM For PC cards supporting CardBus 5.7 7.255 6.275 1.5 6.65 2.2 5.3 0.95 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 0.2 4.75 4.6 15.85 0.975 23.6 15.85 SD No.4 SD No.3 SD No.2 SD No.1 SD No.9 MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 SD No.5 Dummy SD No.6 Dummy SD No.7 SD No.8 Common for SD CD Switch for SD o1 .7 ho 0.95 For Express CardTM For CMOS Camera Module le 0.65 8.475 1.5 14 7.525 14 2.8 o1 .5h ole (1.2) Over travel 22 39.25 36.25 30.175 1. 1 43.95 47.7 0.75 21.2 0.65 0.95 Lock Position 2 4.9 5.1 GND xD No.1 xD No.0 xD No.2 xD No.3 xD No.4 xD No.5 xD No.6 xD No.7 xD No.8 xD No.9 GND for xD (5.5) WP Switch for SD xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 xD No.!3 xD No.!2 xD No.!1 xD No.!0 (5) Eject Position 9.7 1.775 12 4.5 14.1 2.25 6 14.1 2.25 Connector center 30.5 On the card entry side, the metal exposed part is connected to terminal No.9 of the xD card. No pattern area 2- 1.3 No pattern exposure area 28 MS, SD card center 0.65 o3 .5 41 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type 240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.) Room temperature Heating time For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module sec. Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50 |
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