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M1301 VHCT08A 2DR2G STB1045 100MZF SC4040DS PBL38814 NC7WP86L
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 40 10V
30 25 Vds=5V
30
4.5V
Id (A)
20 Vgs=2V 10
Id (A)
2.5V
20 15 125C 10 5 25C
0 0 1 2 3 4 5 Vds (Volts) Fig 1: On-Region Characteristics
0 0.5 1 1.5 2 2.5 Vgs (Volts) Figure 2: Transfer Characteristics
14
1.8
Normalized On-Resistance
Id=9.3A 1.6 Vgs=4.5V 1.4 Vgs=10V 1.2 1 0.8 0 50 100 150 200 Temperature (C) Figure 4: On resistance vs. Junction Temperature
Rds(on) (m:)
13 Vgs=4.5V 12 Vgs=10V
11
10 0 5 10 15 20 25 30 Id (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage
30 25 Id=9.3A
1.0E+01 1.0E+00 1.0E-01 125C
Rds(on) (m:)
Is (A)
20 125C 15 25C 10 5 0 2 4 6 8 10 Vgs (Volts) Figure 5: On resistance vs. Gate-Source Voltage
1.0E-02 1.0E-03 1.0E-04 1.0E-05 0.0 0.2
25C
FET+SCHOTTKY
0.4
0.6
0.8
1.0
Vsd (Volts) Figure 6: Body-Diode Characteristics (Note 6)
5 4
10000 Vds=15V Id=9.3A Ciss f=1MHz Vgs=0V
3 2 1 0 0 5 10 15 20 25 30 35 Qg (nC) Figure 7: Gate-Charge Characteristics
Capacitance (pF)
Vgs (Volts)
1000 Coss FET+SCHOTTKY
Crss 100 0 5 10 15 20 25 30 Vds (Volts) Figure 8: Capacitance Characteristics
100.0 Tj(max)=150C, Ta=25C Rds(on) limited 10.0 1ms 10ms 0.1s 1.0 1s 10s DC 0.1 0.1 1 Vds (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note 5) 10 100 100Ps 10Ps
40 Tj(max)=150C Ta=25C 30
Power (W)
Id (A)
20
10
0 0.001
0.01
0.1
1
10
100
1000
Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note 5)
10
ZTja Normalized Transient Thermal Resistance
D=Ton/T Tj,pk=Ta+Pdm.ZTja.RTja RTja=62.5C/W
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
0.1
Pd Ton Single Pulse
T
0.01 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance
30 4V 25 20 10V 4.5V 3.5V
30 25 20 Vds=5V
Id (A)
15 10 5 0 0 1 2 3 4 5 Vds (Volts) Fig 1: On-Region Characteristics
Id (A)
125C 15 10
Vgs=3V 5 0 1 1.5 2 2.5 3
25C
3.5
4
Vgs (Volts) 1040 Figure 2: Transfer Characteristics
26 Vgs=4.5V
1.7
180 110 0.7
Id=8.3A Vgs=4.5V Vgs=10V
Rds(on) (m:)
22
Normalized On-Resistance
25 30
1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0
18 Vgs=10V 14
10 0 5 10 15 20 Id (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 50 100 150 200
Temperature (C) Figure 4: On resistance vs. Junction Temperature
60 50 Id=8.3A
1.0E+01 1.0E+00 1.0E-01 125C
Rds(on) (m:)
Is (A)
40 30 125C 20 25C 10 2 4 6 8 10 Vgs (Volts) Figure 5: On resistance vs. Gate-Source Voltage
1.0E-02 25C 1.0E-03 1.0E-04 1.0E-05 0.0 0.2 0.4 0.6 0.8 1.0 Vsd (Volts) Figure 6: Body-Diode Characteristics
10 8 Vds=15V Id=8.5A
1500 1250 Ciss f=1MHz Vgs=0V
Capacitance (pF)
Vgs (Volts)
1000 750 500 250 0 Coss
6 4 2 0 0 4 8 12 16 20 Qg (nC) Figure 7: Gate-Charge Characteristics
Crss
0
5
10
15
20
25
30
Vds (Volts) Figure 8: Capacitance Characteristics 1040
100.0
Tj(max)=150C, Ta=25C Rds(on) limited 10Ps 100Ps 10ms 0.1s
40
180 110 0.7
Tj(max)=150C Ta=25C
30
Power (W)
1s 10s DC
10.0
1ms
Id (A)
20
1.0
10
0.1 0.1 1 Vds (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note 5) 10 100
0 0.001
0.01
0.1
1
10
100
1000
Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note 5)
10
ZTja Normalized Transient Thermal Resistance
D=Ton/T Tj,pk=Ta+Pdm.ZTja.RTja RTja=62.5C/W 1
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
Pd Ton Single Pulse
T
0.01 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance


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