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| Datasheet File OCR Text: |
| ZMD-Standard June 2004 Package SSOP44 (300 mil) MDS 771 Dimensions in millimetres 1 Dimensions View X A A2 X k x 45 0,1 44 A1 E 1 Z e D bp 0,2 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,64 0,28 0,51 0,8 10,11 10,51 0,4 0,51 HE Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,44 0,1 0,3 2,14 2,54 0,23 0,32 17,73 17,93 7,40 7,60 0,5 0 8 * without mold-flash 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,8 g Low Stress Epoxy Cu-Alloy solder plating Z-bends Emin* Emax* kmin min max Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signed Marx Date: 4. June 2004 Quality: signed Tina Kochan Doc-No. QS-000771-HD-01 c LP |
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