 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ZMD-Standard March 2005 Package SOP16 (300 mil) MDS 773 Dimensions in millimetres Based on JEDEC JEP95 MS-013 1 Dimensions X A2 A View X k x 45 bp 16 0,1 0,2 M A1 Z 1 e D Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,65 0,35 0,49 1,27 10,00 10,65 0,61 0,79 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,35 0,10 0,30 2,25 2,45 0,23 0,32 10,21 10,46 7,40 7,60 0,25 0 8 * without mold-flash 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy Emin* Emax* kmin min max Cu-Alloy solder plating Z-bends Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signed Marx Date: 18 March 2005 Quality: signed Tina Kochan Doc-No. QS-000773-HD-01.01 c LP |
Price & Availability of MDS773
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |